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1. 发明授权

US06098788A Casting of complex micromechanical objects 失效
标题翻译：铸造复杂的微机械物体
公开(公告)号：US06098788A
公开(公告)日：2000-08-08
申请号：US926401
申请日：1997-09-09
申请人： Nancy Anne Greco , Ernest Norman Levine , Michael F. Lofaro , James Gardner Ryan
发明人： Nancy Anne Greco , Ernest Norman Levine , Michael F. Lofaro , James Gardner Ryan
IPC分类号： B29C33/30 , B29C33/38 , B65G33/00
CPC分类号： B29C33/38 , B29C33/302 , Y10T428/24322
摘要： A seamless micromechanical object is cast by forming a multilevel mold, filling the mold, and selectively removing the mold with respect to the micromechanical object. The mold can have a first level having a first opening therein, and a second level on the first level, the second level having a second opening therein, the second opening smaller than the first opening. The object may contain a controlled void, for example a micromechanical auger with a void formed therethrough to be used as a capillary to drain off fluids when the auger is in use.
摘要翻译：通过形成多层模具，填充模具并相对于微机械物体选择性地移除模具来铸造无缝微机械物体。模具可以具有在其中具有第一开口的第一层和第一层上的第二层，第二层在其中具有第二开口，第二开口小于第一开口。该物体可以包含受控的空隙，例如具有穿过其形成的空隙的微机械螺旋钻，用作毛细管以在使用螺旋推运器时排出流体。

2. 发明授权

US06199269B1 Manipulation of micromechanical objects 失效
标题翻译：微机械物体的操纵
公开(公告)号：US06199269B1
公开(公告)日：2001-03-13
申请号：US08956752
申请日：1997-10-23
申请人： Nancy Anne Greco , Ernest Norman Levine , Michael F. Lofaro , James Gardner Ryan
发明人： Nancy Anne Greco , Ernest Norman Levine , Michael F. Lofaro , James Gardner Ryan
IPC分类号： B23P1900
CPC分类号： G02B26/0841 , Y10T29/4979 , Y10T29/49799 , Y10T29/53
摘要： An aid to the manipulation of microfabricated micro tools in manufacturing and assembly is disclosed. A sequence of micro tools and a manipulator are connected to one another via attachment links as a combination. The attachment links are optimized to readily allow severing of individual micro tools from the combination as needed. The manipulator provides an aid for handling the combination via probe, pliers, clasping, mating or other device. This facilitates human or machine interaction with the combination of micro tools, either for subsequent processing, or for the assembly of the micro tools into a completed product.
摘要翻译：公开了在制造和组装中对微加工微型工具的操纵的帮助。一系列微型工具和操纵器通过连接作为一个组合相互连接。附件链接被优化以容易地允许根据需要从组合中分离各个微型工具。操纵器提供了通过探头，钳子，夹紧，配合或其他装置处理组合的辅助。这有助于人类或机器与微型工具的组合相互作用，用于后续处理，或者将微型工具组装成完整的产品。

3. 发明授权

US06228744B1 Manufacturing methods and uses for micro pipe systems 失效
标题翻译：微管系统的制造方法和用途
公开(公告)号：US06228744B1
公开(公告)日：2001-05-08
申请号：US09427898
申请日：1999-10-27
申请人： Ernest Norman Levine , Michael Francis Lofaro , James Gardner Ryan
发明人： Ernest Norman Levine , Michael Francis Lofaro , James Gardner Ryan
IPC分类号： H01L2176
CPC分类号： G02B6/131 , G02B6/132 , G02B2006/12176 , H01L23/473 , H01L2924/0002 , Y10S366/03 , H01L2924/00
摘要： A semiconductor device or other suitable substrate and method with single or multi layers of buried micro pipes are disclosed. This is achieved by controlling the aspect ratio of trenches as well as controlling the deposition characteristics of the material used to fill the trenches. A buried micro pipe is formed by filling a trench that has a height which is larger than a width thereof, so that the trench filler material lines sidewalls and bottom of the trench, and covers the top of the trench to form the micro pipe within the trench. Another layer can be formed over the filler material and planarized. Alternatively, the filler material itself can be planarized. Forming trenches in the planarized layer, and repeating the above steps forms a second set of buried micro pipes in these new trenches. This forms a semiconductor device having multiple layer of buried micro pipes. Via holes may be etched to contact a micro pipe, or to inter connect micro pipes buried at different levels Thus, instead of eliminating defective voids in trenches, the voids are controlled to form the micro pipes, which may be used to circulate a cooling fluid, or lined with a conductive material to form a micro light pipe channel, or buried conductive pipes.
摘要翻译：公开了一种具有单层或多层埋入微管的半导体器件或其它合适的衬底和方法。这通过控制沟槽的纵横比以及控制用于填充沟槽的材料的沉积特性来实现。通过填充具有大于其宽度的高度的沟槽而形成埋入的微管，使得沟槽填充材料管道沟槽的侧壁和底部，并且覆盖沟槽的顶部以在该沟槽的内部形成微管沟。可以在填料材料上形成另一层并进行平面化。或者，填充材料本身可以被平坦化。在平坦化层中形成沟槽，并重复上述步骤，在这些新的沟槽中形成第二组埋入的微管。这形成具有多层埋藏微管的半导体器件。可以蚀刻通孔以接触微管，或者将不同级别的微管相互连接。因此，不用消除沟槽中的有缺陷的空隙，可以控制空隙以形成微管，这可以用来循环冷却流体或用导电材料衬里形成微光管通道，或埋入导电管。

4. 发明授权

US6031286A Semiconductor structures containing a micro pipe system therein 失效
标题翻译：其中包含微管系统的半导体结构
公开(公告)号：US6031286A
公开(公告)日：2000-02-29
申请号：US808927
申请日：1997-02-28
申请人： Ernest Norman Levine , Michael Francis Lofaro , James Gardner Ryan
发明人： Ernest Norman Levine , Michael Francis Lofaro , James Gardner Ryan
IPC分类号： G02B6/12 , G02B6/13 , G02B6/132 , H01L23/473 , H01L23/34
CPC分类号： G02B6/131 , G02B6/132 , H01L23/473 , G02B2006/12176 , H01L2924/0002 , Y10S366/03
摘要： A semiconductor device or other suitable substrate and method with single or multi layers of buried micro pipes are disclosed. This is achieved by controlling the aspect ratio of trenches as well as controlling the deposition characteristics of the material used to fill the trenches. A buried micro pipe is formed by filling a trench that has a height which is larger than a width thereof, so that the trench filler material lines sidewalls and bottom of the trench, and covers the top of the trench to form the micro pipe within the trench. Another layer can be formed over the filler material and planarized. Alternatively, the filler material itself can be planarized. Forming trenches in the planarized layer, and repeating the above steps forms a second set of buried micro pipes in these new trenches. This forms a semiconductor device having multiple layer of buried micro pipes. Via holes may be etched to contact a micro pipe, or to inter connect micro pipes buried at different levels. Thus, instead of eliminating defective voids in trenches, the voids are controlled to form the micro pipes, which may be used to circulate a cooling fluid, or lined with a conductive material to form a micro light pipe channel, or buried conductive pipes.
摘要翻译：公开了一种具有单层或多层埋入微管的半导体器件或其它合适的衬底和方法。这通过控制沟槽的纵横比以及控制用于填充沟槽的材料的沉积特性来实现。通过填充具有大于其宽度的高度的沟槽而形成埋入的微管，使得沟槽填充材料管道沟槽的侧壁和底部，并且覆盖沟槽的顶部以在该沟槽内部形成微管沟。可以在填料材料上形成另一层并进行平面化。或者，填充材料本身可以被平坦化。在平坦化层中形成沟槽，并重复上述步骤，在这些新的沟槽中形成第二组埋入的微管。这形成具有多层埋藏微管的半导体器件。可以蚀刻通孔以接触微管，或者将不同层次的微管相互连接。因此，不是消除沟槽中的有缺陷的空隙，而是控制空隙以形成可用于循环冷却流体或用导电材料衬里以形成微光管通道的微管或埋入的导电管。

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