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    • 1. 发明授权
    • Automated photomask inspection apparatus
    • 自动光掩模检测仪
    • US06363166B1
    • 2002-03-26
    • US09539672
    • 2000-03-30
    • Mark Joseph WihlTao-Yi FuMarek ZywnoDamon Floyd KvammeMichael E. Fein
    • Mark Joseph WihlTao-Yi FuMarek ZywnoDamon Floyd KvammeMichael E. Fein
    • G06K900
    • G03F1/84G01N21/95607G01N2021/95676
    • An automated photomask inspection apparatus including an XY state (12) for transporting a substrate (14) under test in a serpentine path in an XY plane, an optical system (16) comprising a laser (30), a transmission light detector (34), a reflected light detector (36), optical elements defining reference beam paths and illuminating beam paths between the laser, the substrate and the detectors and an acousto-optical beam scanner (40, 42) for reciprocatingly scanning the illuminating and reference beams relative to the substrate surface, and an electronic control, analysis and display system for controlling the operation of the stage and optical system and for interpreting and storing the signals output by the detectors. The apparatus can operate in a die-to-die comparison mode or a die-to-database mode.
    • 一种自动化光掩模检查装置,包括用于在XY平面中的蛇形路径中传送被测试的基板的XY状态(12),包括激光器(30),透射光检测器(34)的光学系统(16) ,反射光检测器(36),限定参考光束路径的光学元件和激光器,衬底和检测器之间的照明光束路径,以及用于相对于照射和参考光束往复扫描照射和参考光束的声光束扫描器(40,42) 基板表面,以及用于控制平台和光学系统的操作以及用于解释和存储由检测器输出的信号的电子控制,分析和显示系统。 该设备可以以管芯到管芯的比较模式或管芯到数据库模式工作。
    • 6. 发明授权
    • Automated photomask inspection apparatus and method
    • 自动光掩模检查装置及方法
    • US5563702A
    • 1996-10-08
    • US274310
    • 1994-07-13
    • David G. EmeryZain K. SaidinMark J. WihlTao-Yi FuMarek ZywnoDamon F. KvammeMichael E. Fein
    • David G. EmeryZain K. SaidinMark J. WihlTao-Yi FuMarek ZywnoDamon F. KvammeMichael E. Fein
    • G01B11/30G01N21/88G01N21/93G01N21/94G01N21/956G03F1/00H01L21/027H01L21/66
    • G03F1/84G01N21/95607G01N2021/95676
    • A method and apparatus for inspecting patterned transmissive substrates, such as photomasks, for unwanted particles and features occurring on the transmissive, opaque portions and at the transition regions of the opaque and transmissive portions of the substrate. A transmissive substrate is illuminated by a laser through an optical system comprised of a laser scanning system, individual transmitted and reflected light collection optics and detectors collect and generate signals representative of the light transmitted and reflected by the substrate as the substrate is scanned repeatedly in one axis in a serpentine pattern by a laser beam which is focused on the patterned substrate surface. The defect identification of the substrate is performed using only those transmitted and reflected light signals, and other signals derived from them, such as the second derivative of each of them. The actual defect identification is then performed by comparing combinations of at least two of those measured and derived signals. Simultaneously, defect and particle inspection using the same measured transmitted and reflected light signals. Additionally, phase shift and line widths on the substrate can also be performed simultaneously using the same transmitted light signal that is collected for defect analysis.
    • 一种用于检查图案化的透射基底(例如光掩模)用于不期望的颗粒和特征的方法和装置,其出现在基底的不透明部分和透射部分的透射性不透明部分和过渡区域上。 透射基板由激光器通过包括激光扫描系统,单独的透射和反射光收集光学器件的光学系统照射,并且检测器收集并产生代表由衬底透射和反射的光的信号,因为衬底被一次扫描 通过聚焦在图案化衬底表面上的激光束以蛇形图案。 仅使用透射和反射光信号以及从它们得到的其他信号(例如它们的二次导数)来执行衬底的缺陷识别。 然后通过比较这些测量和导出的信号中的至少两个的组合来执行实际的缺陷识别。 同时,使用相同测量的透射和反射光信号进行缺陷和粒子检测。 此外,基板上的相移和线宽也可以使用用于缺陷分析收集的相同的透射光信号同时进行。
    • 8. 发明授权
    • Methods and systems for inspection of a specimen using different inspection parameters
    • 使用不同检查参数检验样品的方法和系统
    • US07738089B2
    • 2010-06-15
    • US10933873
    • 2004-09-03
    • Steve R. LangePaul Frank MarellaNat CeglioShiow-Hwei HwangTao-Yi Fu
    • Steve R. LangePaul Frank MarellaNat CeglioShiow-Hwei HwangTao-Yi Fu
    • G01N21/00
    • G01N21/9501G01N21/8806
    • Methods and systems for inspection of a specimen using different parameters are provided. One computer-implemented method includes determining optimal parameters for inspection based on selected defects. This method also includes setting parameters of an inspection system at the optimal parameters prior to inspection. Another method for inspecting a specimen includes illuminating the specimen with light having a wavelength below about 350 nm and with light having a wavelength above about 350 nm. The method also includes processing signals representative of light collected from the specimen to detect defects or process variations on the specimen. One system configured to inspect a specimen includes a first optical subsystem coupled to a broadband light source and a second optical subsystem coupled to a laser. The system also includes a third optical subsystem configured to couple light from the first and second optical subsystems to an objective, which focuses the light onto the specimen.
    • 提供了使用不同参数检查试样的方法和系统。 一种计算机实现的方法包括基于所选择的缺陷来确定用于检查的最佳参数。 该方法还包括在检查之前将检查系统的参数设置为最佳参数。 用于检查样品的另一种方法包括用波长低于约350nm的光和波长高于约350nm的光照射样品。 该方法还包括处理代表从样品收集的光的信号,以检测样品上的缺陷或过程变化。 配置成检查样本的一个系统包括耦合到宽带光源的第一光学子系统和耦合到激光器的第二光学子系统。 该系统还包括配置成将来自第一和第二光学子系统的光耦合到物镜的第三光学子系统,其将光聚焦到样本上。
    • 9. 发明授权
    • Confocal wafer depth scanning inspection method
    • 共焦晶圆深度扫描检测方法
    • US07109458B2
    • 2006-09-19
    • US11079614
    • 2005-03-14
    • Christopher R. FairleyTao-Yi FuBin-Ming Benjamin TsaiScott A. Young
    • Christopher R. FairleyTao-Yi FuBin-Ming Benjamin TsaiScott A. Young
    • G02B7/04
    • G01N21/9501G02B3/0056G02B21/0024G02B21/0028G02B21/008G02B27/40
    • A semiconductor wafer inspection system and method is provided which uses a multiple element arrangement, such as an offset fly lens array. The preferred embodiment uses a laser to transmit light energy toward a beam expander, which expands the light energy to create an illumination field. An offset fly lens array converts light energy from the illumination field into an offset pattern of illumination spots. A lensing arrangement, including a first lens, a transmitter/reflector, an objective, and a Mag tube imparts light energy onto the specimen and passes the light energy toward a pinhole mask. The pinhole mask is mechanically aligned with the offset fly lens array. Light energy passing through each pinhole in the pinhole mask is directed toward a relay lens, which guides light energy onto a sensor. The offset fly lens array corresponds to the pinhole mask. The offset pattern of the offset fly lens array is chosen such that spots produced can be recombined into a continuous image, and the system utilizes a time delay and integration charge coupled device for rapid sensing along with an autofocus system that measures and cancels topological features of the specimen.
    • 提供了使用多重元件布置的半导体晶片检查系统和方法,例如偏移飞行透镜阵列。 优选实施例使用激光将光能传递到光束扩展器,其扩展光能以产生照明场。 偏移飞行透镜阵列将来自照明场的光能转换成照明点的偏移图案。 包括第一透镜,发射器/反射器,物镜和Mag管的透镜装置将光能量施加到样本上并将光能传递给针孔掩模。 针孔掩模与偏置飞行透镜阵列机械对准。 通过针孔掩模中的每个针孔的光能被引向中继透镜,该中继透镜将光能引导到传感器上。 偏移飞行透镜阵列对应于针孔掩模。 选择偏移飞行透镜阵列的偏移图案,使得所产生的斑点可以重新组合成连续图像,并且系统利用时间延迟和积分电荷耦合器件与快速感测以及自动对焦系统一起测量和消除拓扑特征 标本。
    • 10. 发明授权
    • High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
    • 采用先进光学技术的高通量明场/暗视场检测系统
    • US06288780B1
    • 2001-09-11
    • US08991927
    • 1997-12-16
    • Christopher R FairleyTao-Yi FuGershon PerelmanBin-Ming Benjamin Tsai
    • Christopher R FairleyTao-Yi FuGershon PerelmanBin-Ming Benjamin Tsai
    • G01N2100
    • G01N21/9501G01N21/8806G01N21/95607G01N21/95623G01N2021/8825
    • The broadband brightfield/darkfield wafer inspection system provided receives broadband brightfield illumination information via a defect detector, which signals for initiation of darkfield illumination. The defect detector forms a two dimensional histogram of the defect data and a dual mode defect decision algorithm and post processor assess defects. Darkfield radiation is provided by two adjustable height laser beams which illuminate the surface of the wafer from approximately 6 to 39 degrees. Each laser is oriented at an azimuth angle 45 degrees from the orientation of the Manhattan geometry on the wafer, and 90 degrees in azimuth from one another. Vertical angular adjustability is provided by modifying cylindrical lens position to compensate for angular mirror change by translating an adjustable mirror, positioning the illumination spot into the sensor field of view, rotating and subsequently moving the cylindrical lens. A brightfield beamsplitter in the system is removable, and preferably replaced with a blank when performing darkfield illumination. Light level control for the system is provided by a dual polarizer first stage. Light exiting from the second polarizer passes through a filter which absorbs a portion of the light and comprises the second stage of light control. The beam then passes through a polarizing beamsplitter. The second channel is further reflected and polarized and both beams thereafter illuminate the substrate.
    • 提供的宽带明场/暗场晶片检查系统经由缺陷检测器接收宽带明场照明信息,该缺陷检测器信号用于开始暗场照明。 缺陷检测器形成缺陷数据的二维直方图,并且双模缺陷判定算法和后处理器评估缺陷。 暗场辐射由两个可调节的高度激光束提供,其将晶片的表面从约6度39度照射。 每个激光器的方位角与晶片上的曼哈顿几何形状的取向成45度,并且彼此相差90度。 通过改变柱面透镜位置​​来补偿角度反射镜的变化,通过平移可调节的反射镜,将照明光斑定位在传感器视场内,旋转和随后移动柱面透镜来提供垂直角度调整性。 系统中的明场分束器是可拆卸的,并且当执行暗场照明时,优选地用空白物替换。 系统的光级控制由双偏振器第一级提供。 从第二偏振片射出的光通过吸收一部分光的滤光器,并包括第二级光控制。 然后光束通过偏振分光镜。 第二通道被进一步反射和偏振,并且两个光束此后照亮基板。