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1. 发明授权

US4517290A Method for enzyme immunoassay and peptide-enzyme conjugate and antibody therefor 失效
标题翻译：酶免疫测定方法和肽酶结合物及其抗体
公开(公告)号：US4517290A
公开(公告)日：1985-05-14
申请号：US533619
申请日：1983-09-19
申请人： Susumu Iwasa , Isamu Yoshida , Koichi Kondo
发明人： Susumu Iwasa , Isamu Yoshida , Koichi Kondo
IPC分类号： C07K5/103 , C07K14/59 , C07K16/26 , C12N9/96 , G01N33/531 , G01N33/535 , G01N33/76 , G01N33/54 , A61K39/395 , G01N33/56
CPC分类号： C12N9/96 , C07K14/59 , C07K16/26 , C07K5/1008 , G01N33/531 , G01N33/535 , G01N33/76 , Y10S435/81 , Y10S435/961 , Y10S435/963 , Y10S435/967 , Y10S435/971 , Y10S435/975 , Y10S436/814 , Y10S530/806 , Y10S930/11
摘要： In an enzyme immunoassay, when a specific antibody produced by contacting a peptide essential to the formation of a specific antibody to a peptide antigen, a freeze-dried material of .beta.-D-galactosidase-enzyme conjugate or a peptide-enzyme conjugate prepared by coupling a labeling enzyme with a peptide of the general formula:H-R.sub.1 -Pro-Ser-Asp-Thr-Pro-Ile-Leu-Pro-Gln-OHwherein R.sub.1 is a peptide fragment consisting of 1 to 14 amino acid residues including Gly in the 14-position of the peptide Ala.sup.1 -Pro.sup.2 -Pro.sup.3 -Pro.sup.4 -Ser.sup.5 -Leu.sup.6 -Pro.sup.7 -Ser.sup.8 -Pro.sup.9 -Ser.sup.10 -Arg.sup.11 -Leu.sup.12 -Pro.sup.13 -Gly.sup.14 is used, a high reproducibility of the result of the enzyme immunoassay is obtained.
摘要翻译：在酶免疫测定中，当通过将形成特异性抗体所必需的肽与肽抗原接触而产生的特异性抗体，β-D-半乳糖苷酶 - 酶偶联物的冷冻干燥物质或通过偶联制备的肽 - 酶偶联剂具有以下通式的肽的标记酶：H-R1-Pro-Ser-Asp-Thr-Pro-Ile-Leu-Pro-Gln-OH，其中R1是由1至14个氨基酸残基组成的肽片段，包括Gly 在肽Ala1-Pro2-Pro3-Pro4-Ser5-Leu6-Pro7-Ser8-Pro9-Ser10-Arg11-Leu12-Pro13-G ly14的14位中，酶免疫测定结果的高再现性为获得。

2. 发明授权

US4496658A Method for enzyme immunoassay and production of antibody 失效
标题翻译：酶免疫测定法和抗体制备方法
公开(公告)号：US4496658A
公开(公告)日：1985-01-29
申请号：US311327
申请日：1981-10-14
申请人： Koichi Kondo , Susumu Iwasa , Isamu Yoshida
发明人： Koichi Kondo , Susumu Iwasa , Isamu Yoshida
IPC分类号： C07K14/59 , C07K16/26 , C12N9/96 , G01N33/531 , G01N33/535 , G01N33/543 , G01N33/76 , G01N33/54 , G01N33/56 , G01N33/58
CPC分类号： C07K14/59 , C07K16/26 , C12N9/96 , G01N33/531 , G01N33/535 , G01N33/54306 , G01N33/76 , Y10S435/975 , Y10S436/80 , Y10S436/804 , Y10S436/808 , Y10S436/813 , Y10S436/814 , Y10S436/819 , Y10S930/11 , Y10S930/28
摘要： In a method for immunochemical assay of human chorionic gonadotropin involving use of an antibody immobilized on a carrier, an antigen and an antibody to which a labeling agent has been attached, when the antibody supported on the carrier and the antibody coupled to a labeling agent are different antibodies which are not overlapping in antigen-determining site and one of said different antibodies is specifically reactive to human chorionic gonadotropin, a high reproducibility of the result of the immunochemical assay is obtained.
摘要翻译：在涉及使用固定在载体上的抗体，附着有标记试剂的抗原和抗体的人绒毛膜促性腺激素的免疫化学测定方法中，当载体上载有抗体和与标记试剂偶联的抗体时，在抗原决定部位和所述不同抗体之一中不重叠的不同抗体与人绒毛膜促性腺激素特异性反应，获得了免疫化学测定结果的高再现性。

3. 发明授权

US4059491A Diluents for rubella virus hemagglutination-inhibition test 失效
标题翻译：稀释剂用于风疹病毒血细胞凝集抑制试验
公开(公告)号：US4059491A
公开(公告)日：1977-11-22
申请号：US764058
申请日：1977-01-31
申请人： Susumu Iwasa , Isamu Yoshida
发明人： Susumu Iwasa , Isamu Yoshida
IPC分类号： A61K39/00 , C12Q1/70 , G01N33/569 , H04R1/02 , G01N33/16 , C12K1/04
CPC分类号： H04R1/02 , G01N33/56983 , Y10T436/108331
摘要： In the rubella virus hemagglutination-inhibition test, the hemagglutination-inhibition antibody titers of the test sera can be determined with accuracy and high sensitivity by employing a novel diluent, which contains N-2-hydroxyethylpiperazine-N'-2'-ethanesulfonic acid in a low concentration and which is free from calcium ion, for the dilution of the rubella virus hemagglutinating antigen and of the test sera.
摘要翻译：在风疹病毒血细胞凝集抑制试验中，可以通过使用含有N-2-羟乙基哌嗪-N'-2'-乙磺酸的新型稀释剂，以准确性和高灵敏度测定血清凝血抑制抗体滴度低浓度且不含钙离子，用于稀释风疹病毒血凝抗原和测试血清。

4. 发明授权

US4270923A Pretreatment agent for subject fluid in pregnancy test 失效
标题翻译：妊娠试验中受试物质的预处理剂
公开(公告)号：US4270923A
公开(公告)日：1981-06-02
申请号：US107179
申请日：1979-12-26
申请人： Koichi Kondo , Isamu Yoshida , Takashi Kobayashi
发明人： Koichi Kondo , Isamu Yoshida , Takashi Kobayashi
IPC分类号： G01N33/53 , G01N33/74 , G01N33/76
CPC分类号： G01N33/76 , Y10S436/814 , Y10S436/818 , Y10S436/825
摘要： By using a new pretreatment agent consisting essentially of a carboxylic acid-type cation exchange resin fiber or a siliconized glass fiber, the interfering components and the elements of turbidity present in a subject fluid for immunologic pregnancy test can be specifically removed without entailing a substantial loss of human chorionic gonadotropin contained in the subject fluid.
摘要翻译：通过使用基本上由羧酸型阳离子交换树脂纤维或硅化玻璃纤维组成的新的预处理剂，可以特异性地除去存在于用于免疫妊娠试验的目标流体中的干扰成分和浊度元素，而不会引起实质损失的人绒毛膜促性腺激素。

5. 发明授权

US4292038A Formamide-containing latex agglutinating reagent for immunoassay 失效
标题翻译：含甲酰胺的乳胶凝集试剂进行免疫测定
公开(公告)号：US4292038A
公开(公告)日：1981-09-29
申请号：US116465
申请日：1980-01-29
申请人： Koichi Kondo , Isamu Yoshida , Takashi Kobayashi
发明人： Koichi Kondo , Isamu Yoshida , Takashi Kobayashi
IPC分类号： G01N33/543 , G01N33/54
CPC分类号： G01N33/54393 , Y10S436/814 , Y10S436/818 , Y10S436/825
摘要： By using a reagent for latex agglutination reaction which contains one or more members selected from the group consisting of a compound of the formula ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group or an amino group which may be substituted with a lower alkyl group and R.sup.2 and R.sup.3 are each a hydrogen atom or a lower alkyl group, and a di-lower alkyl sulfoxide, the non-specific agglutination can be remarkably prevented and thus greatly improving the reliability of the latex agglutination test results.
摘要翻译：通过使用含有一种或多种选自下列化合物的成员的胶乳凝集反应试剂：其中R1是氢原子，低级烷基或可被低级烷基取代的氨基烷基，R2和R3各自为氢原子或低级烷基，二低级烷基亚砜，可以显着防止非特异性凝集，大大提高胶乳凝集试验结果的可靠性。

6. 发明申请

US20080061431A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20080061431A1
公开(公告)日：2008-03-13
申请号：US11834724
申请日：2007-08-07
申请人： Shinichi Fujiwara , Masahide Harada , Hideto Yoshinari , Shosaku Ishihara , Shiro Yamashita , Isamu Yoshida , Ukyo Ikeda
发明人： Shinichi Fujiwara , Masahide Harada , Hideto Yoshinari , Shosaku Ishihara , Shiro Yamashita , Isamu Yoshida , Ukyo Ikeda
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/26165 , H01L2224/26175 , H01L2224/291 , H01L2224/29111 , H01L2224/33181 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/40499 , H01L2224/73263 , H01L2224/83136 , H01L2224/83139 , H01L2224/8314 , H01L2224/83385 , H01L2224/83801 , H01L2224/83815 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/83 , H01L2224/84
摘要： A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.
摘要翻译：本发明的半导体模块包括在填充基板的主表面上分别形成的第一导电层（膜）和第二导电层（膜），通过焊料与第一导电层（膜）的上表面连接的热扩散板导电层，通过焊料连接到热扩散板的上表面的半导体元件，以及引线，其一端通过焊料连接到第二导电层，另一端通过焊料连接到半导体元件，其中外周边半导体元件通过焊料连接到热扩散板的上表面的连接区域形成有从连接区域突出的突出部分和在焊料中的热扩散板的上表面中的半导体元件的转动连接过程被突出部分抑制。

7. 发明授权

US06861294B2 Semiconductor devices and methods of making the devices 失效
标题翻译：半导体器件和制造器件的方法
公开(公告)号：US06861294B2
公开(公告)日：2005-03-01
申请号：US10673459
申请日：2003-09-30
申请人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
发明人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
IPC分类号： H01L21/56 , H01L23/31 , H01L21/44
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3107 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
摘要翻译：一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在对应于每个外部端子的位置。模具具有在其分割元件之间具有通风口的分隔结构。

8. 发明授权

US06662921B2 Wheel steering apparatus 有权
标题翻译：车轮转向装置
公开(公告)号：US06662921B2
公开(公告)日：2003-12-16
申请号：US10187366
申请日：2002-07-02
申请人： Isamu Yoshida , Keisuke Kazuno , Koji Sato
发明人： Isamu Yoshida , Keisuke Kazuno , Koji Sato
IPC分类号： B62D300
CPC分类号： F16D41/067 , F16H25/20 , F16H25/2204 , Y10T74/18576 , Y10T74/18696
摘要： To provide a wheel steering apparatus capable of exhibiting a stabilized vehicle steerability without transmitting an external disturbance torque to a motor rotor even when the wheel receives an axially acting external force, this wheel steering apparatus includes a reciprocatingly movable rod 3 drivingly connected with a support member 2 for steerably supporting a wheel 1, and a ball screw mechanism 5 for reciprocatingly moving the rod 3 in response to rotation of a drive motor 4. In a rotational transmission system for transmitting rotation of the drive motor 4 to a nut member 5b of the ball screw mechanism 5, a clutch assembly 6 defining a reverse input limiting means is provided for preventing a rotar of the drive motor 4 from being rotated by the external force acting on the wheel 1. This clutch assembly 6 used is of a design wherein although rotation can be transmitted from an input shaft to an output shaft, no rotation is transmitted from the output shaft to the input shaft.
摘要翻译：为了提供即使在车轮受到轴向作用的外力的情况下也能够显示稳定的车辆操纵性而不向外部扰动转矩传递的车轮转向装置，该车轮转向装置包括与支撑部件驱动连接的往复运动杆3 2，用于可转动地支撑车轮1;以及滚珠丝杠机构5，用于响应于驱动马达4的旋转使杆3往复运动。在用于将驱动马达4的旋转传递到螺母构件5b的旋转传动系统中滚珠丝杠机构5，限定反向输入限制装置的离合器组件6被设置成用于防止驱动马达4的转子由于作用在车轮1上的外力而旋转。所使用的离合器组件6具有如下设计：旋转可以从输入轴传递到输出轴，不会从输出轴向输入轴转动。

9. 发明授权

US06178839B2 Ball screw with lubricating grease and seal member of solid lubricating composition 有权
标题翻译：滚珠丝杠带润滑脂和固体润滑组合物的密封件
公开(公告)号：US06178839B2
公开(公告)日：2001-01-30
申请号：US09203499
申请日：1998-12-01
申请人： Isamu Yoshida , Masahiro Nobutomo , Takayuki Owada
发明人： Isamu Yoshida , Masahiro Nobutomo , Takayuki Owada
IPC分类号： F16H2524
CPC分类号： F16H25/2418 , F16H25/2204 , F16H57/0497 , Y10T74/19772
摘要： A plurality of balls 3 are disposed for rolling and circulation in a spiral calculation passage defined between a spiral screw groove surface 1a formed on the outer periphery of a screw shaft 1 and a spiral screw groove surface 2a formed on the inner periphery of a ball nut 2. The opposite ends of the ball nut are each formed with a seal mounting portion 2b, in which a seal member 4 made of solid lubricating composition is mounted, sealing off the ball nut 2. The ball nut 2 has lubricating grease G sealed therein.
摘要翻译：多个滚珠3设置成在形成在螺杆轴1的外周上的螺旋形螺旋槽表面1a和形成在滚珠螺母的内周上的螺旋形螺纹槽表面2a之间的螺旋计算通道中滚动和循环滚珠螺母的两端各自形成有密封安装部分2b，其中安装了由固体润滑剂组合物制成的密封构件4，密封球螺母2.滚珠螺母2上密封有润滑脂G 。

10. 发明授权

US6124629A Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip 失效
标题翻译：半导体装置包括使密封的半导体芯片的后表面露出的树脂密封构件
公开(公告)号：US6124629A
公开(公告)日：2000-09-26
申请号：US168097
申请日：1998-10-08
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
摘要翻译：由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

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