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    • 7. 发明授权
    • Method and apparatus for jetting, manufacturing and attaching uniform
solder balls
    • 用于喷射,制造和附着均匀焊球的方法和装置
    • US5855323A
    • 1999-01-05
    • US746602
    • 1996-11-13
    • Frederick G. YostDarrel R. FrearDavid T. Schmale
    • Frederick G. YostDarrel R. FrearDavid T. Schmale
    • B05B17/06B23K3/06H05K3/34B05B1/24B05B1/08
    • H05K3/3457B05B17/0638B23K3/0623H05K2203/013H05K2203/0134
    • An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.
    • 一种将滚珠形式的熔融焊料直接喷射到所有金属化互连区域上的设备和方法,用于一个步骤中的球栅阵列封装,不需要焊膏。 使用连接到压电晶体的活塞将熔融的焊料从孔网喷射出来。 当电压施加到晶体时,其膨胀迫使活塞通过孔板中的孔挤出所需体积的焊料。 当电压降低时,活塞反转运动,在孔板表面处产生熔融焊料中的不稳定性,从而形成落入金属化基板上的球形焊球。 熔融焊球落在基板上并与金属化焊盘形成冶金结合。 焊球的尺寸由孔板中的孔的尺寸,活塞脉冲的持续时间和活塞的位移的组合决定。 球的布局由网格中的钩子的位置决定。 通过更换网格板可以轻松实现球体尺寸和布局的变化。 本发明还允许简单地制备用于随后供给BGA用户的均匀球。