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1. 发明授权

US06784228B2 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same 失效
标题翻译：环氧树脂组合物，其固化物，新型环氧树脂，新型酚化合物及其制备方法
公开(公告)号：US06784228B2
公开(公告)日：2004-08-31
申请号：US10190491
申请日：2002-07-09
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Tomoyuki Imada
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Tomoyuki Imada
IPC分类号： C08K336
CPC分类号： C07D407/14 , C07D311/78 , C07D311/82 , C08G59/063 , C08G59/245
摘要： The present invention relates to an epoxy resin composition a cure article thereof, a novel epoxy resin used therein, a polyhydric phenol compound suited for used as an intermediate thereof, and a process for preparing the same. One of the objects to be achieved by the present invention is to exert the heat resistance, the moisture resistance, the dielectric performances and the flame-resistant effect required of electric or electronic materials such as semiconductor encapsulating materials and varnishes for circuit boards in the epoxy resin composition.
摘要翻译：环氧树脂组合物及其制备方法技术领域本发明涉及环氧树脂组合物及其固化物，其中使用的新型环氧树脂，适合用作其中间体的多元酚化合物及其制备方法。本发明要实现的目的之一是发挥电子或电子材料如半导体封装材料和环氧树脂电路板清漆所需要的耐热性，耐湿性，介电性能和阻燃效果树脂组合物。

2. 发明授权

US07985822B2 Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，新型酚醛树脂的制造方法以及新型环氧树脂的制造方法
公开(公告)号：US07985822B2
公开(公告)日：2011-07-26
申请号：US11661095
申请日：2005-08-31
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08G59/00
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

3. 发明申请

US20080255315A1 Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin 有权
标题翻译：环氧树脂组合物，其固化物，半导体封装材料，新型酚醛树脂，新型环氧树脂，新型苯酚树脂生产方法，以及新型环氧树脂生产方法
公开(公告)号：US20080255315A1
公开(公告)日：2008-10-16
申请号：US11661095
申请日：2005-08-31
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08G59/00 , C08G65/38
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

4. 发明授权

US08263714B2 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，新型酚醛树脂的制造方法以及新型环氧树脂的制造方法
公开(公告)号：US08263714B2
公开(公告)日：2012-09-11
申请号：US13157926
申请日：2011-06-10
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08L63/00 , C08L61/06 , C08G59/00 , C08G8/04 , C08G14/02 , C08G65/38
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

5. 发明授权

US06660811B2 Epoxy resin composition and curing product thereof 失效
标题翻译：环氧树脂组合物及其固化产物
公开(公告)号：US06660811B2
公开(公告)日：2003-12-09
申请号：US10059045
申请日：2002-01-30
申请人： Ichiro Ogura , Yoshiyuki Takahashi
发明人： Ichiro Ogura , Yoshiyuki Takahashi
IPC分类号： C08L6304
CPC分类号： H01L23/293 , C08G59/245 , C08G59/3218 , H01L23/145 , H01L2924/0002 , H01L2924/00
摘要： An epoxy resin composition comprising: (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 150° C. and having two or more repeating units each comprising: a methylene bond substituted by at least an aromatic ring; and a benzene ring substituted by at least a glycidyloxy group, wherein said aromatic ring is at least one member selected from the group consisting of (a) condensed aromatic rings and (b) combinations of aromatic rings in which two or more aromatic monocycles or condensed aromatic rings are connected directly to each other via a single bond; and (ii) a curing agent.
摘要翻译：一种环氧树脂组合物，其包含：（i）在150℃下熔融粘度为0.1dPa至5dPa的环氧树脂，并且具有两个或更多个重复单元，每个重复单元包含：被至少一个芳环取代的亚甲基键; 和至少被缩水甘油氧基取代的苯环，其中所述芳环是选自（a）稠合芳环和（b）芳环的组合中的至少一种，其中两个或更多个芳族单环或缩合芳环通过单键直接相互连接; 和（ii）固化剂。

6. 发明申请

US20110275739A1 EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，生产新型酚醛树脂的方法和生产新型环氧树脂的方法
公开(公告)号：US20110275739A1
公开(公告)日：2011-11-10
申请号：US13157926
申请日：2011-06-10
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08L63/00 , C08G65/40 , C08G59/04 , C08G59/62
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

7. 发明授权

US08703845B2 Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material 失效
标题翻译：可固化树脂组合物，其固化产物，酚醛树脂，环氧树脂和半导体密封材料
公开(公告)号：US08703845B2
公开(公告)日：2014-04-22
申请号：US13822453
申请日：2011-09-27
申请人： Ichirou Ogura , Yoshiyuki Takahashi , Norio Nagae , Yousuke Hirota
发明人： Ichirou Ogura , Yoshiyuki Takahashi , Norio Nagae , Yousuke Hirota
IPC分类号： C08G59/32 , C08G59/62 , C08G59/06 , C08G61/02 , C08L63/00 , H01L21/56
CPC分类号： C08L63/00 , C08G8/36 , C08G59/621 , C08G2261/135 , C08G2261/3424 , C08G2261/592 , C08G2261/598 , C08G2261/76 , C08L61/14 , C08L65/00
摘要： A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.
摘要翻译：考虑到环境友好性，实现了高度的耐湿性和焊料性以及高阻燃性。酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基（ph1），含酚羟基的芳族烃基（ph2）和通式（2）表示的二价芳烷基（X）的结构部分 1）（其中Ar表示亚苯基或亚联苯基，Rs各自独立地表示氢原子或甲基），并且具有选自由以下组成的组中的多个芳族烃基的结构：萘基甲氧基或蒽基甲氧基含有芳香族烃基（ph1）和含酚性羟基的芳香族烃基（ph2）通过二价芳烷基（X）键合。该酚醛树脂用作环氧树脂的固化剂。

8. 发明授权

US08440781B2 Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin 有权
标题翻译：环氧树脂组合物及其固化制品，半导体封装材料，新型酚醛树脂和新型环氧树脂
公开(公告)号：US08440781B2
公开(公告)日：2013-05-14
申请号：US12634259
申请日：2009-12-09
申请人： Ichirou Ogura , Yoshiyuki Takahashi , Yutaka Sato
发明人： Ichirou Ogura , Yoshiyuki Takahashi , Yutaka Sato
IPC分类号： C08G65/48 , C08G65/38 , C08L61/00 , C08L61/06 , C08L63/00
CPC分类号： H01L23/293 , C08G16/02 , C08G59/621 , C08L63/00 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.
摘要翻译：本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性固化反应。一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-PBX-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂，或作为环氧树脂的酚醛树脂材料。

9. 发明申请

US20080047528A1 Fuel injection control apparatus and method in internal combustion engine 有权
标题翻译：内燃机燃油喷射控制装置及方法
公开(公告)号：US20080047528A1
公开(公告)日：2008-02-28
申请号：US11895599
申请日：2007-08-24
申请人： Yoshiyuki Takahashi , Yuji Narita , Hisanobu Suzuki
发明人： Yoshiyuki Takahashi , Yuji Narita , Hisanobu Suzuki
IPC分类号： F02M57/00
CPC分类号： F02D41/345 , F02D41/009 , Y02T10/44
摘要： A preset waiting period is previously set on the basis of a signal in correspondence to a detection of a start point of a detection of a no-tooth portion of a signal rotor. In the case of a control for injecting a fuel after the preset waiting period has elapsed, an output of a signal indicating a start point of an actual detection of the no-tooth portion by a waveform shaping portion is delayed due to the existence of the no-tooth portion. A control computer corrects the preset waiting period to be shorter by an amount corresponding the delay. Accordingly, an accuracy of a fuel injection start timing control is improved.
摘要翻译：基于对信号转子的无齿部的检测的起点的检测的信号，预先设定预设等待期间。在经过了预设等待时间之后的燃料喷射控制的情况下，表示由波形整形部分实际检测无齿部分的起始点的信号的输出由于存在无齿部分。控制计算机将预设等待时间更新为对应于延迟的量。因此，提高了燃料喷射开始正时控制的精度。

10. 发明授权

US07312177B2 Thermosensitive recording materials 有权
标题翻译：热敏记录材料
公开(公告)号：US07312177B2
公开(公告)日：2007-12-25
申请号：US10933391
申请日：2004-09-03
申请人： Ayako Shirai , Yoshiyuki Takahashi
发明人： Ayako Shirai , Yoshiyuki Takahashi
IPC分类号： B41M5/30
CPC分类号： B41M5/3336 , B41M5/3333 , C07C311/60
摘要： A thermosensitive recording material comprising a substrate sheet and a thermosensitive colored image-forming layer formed on at least one surface of the substrate sheet and comprising at least one colorless or light-colored dye precursor and a color-developing agent reactive with the dye precursor upon heating to thereby develop a color, wherein the color-developing agent comprises at least one compound of the formula (I): (wherein R1 represents a member selected from the group consisting of unsubstituted aromatic hydrocarbon groups and substituted aromatic hydrocarbon groups with at least one substituent selected from the group consisting of a methyl group and a chlorine atom, and R2 represents a divalent organic group).
摘要翻译：一种热敏记录材料，包括基材片和形成在基片的至少一个表面上的热敏着色图像形成层，并且包含至少一种无色或浅色染料前体和与染料前体反应的显色剂，加热从而显色，其中显色剂包含至少一种式（I）化合物：其中R 1表示选自未取代的芳族烃基和取代的芳族烃基与至少一个选自甲基和氯原子的取代基取代，R 2表示二价有机基团）。

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