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1. 发明授权

US06784228B2 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same 失效
标题翻译：环氧树脂组合物，其固化物，新型环氧树脂，新型酚化合物及其制备方法
公开(公告)号：US06784228B2
公开(公告)日：2004-08-31
申请号：US10190491
申请日：2002-07-09
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Tomoyuki Imada
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Tomoyuki Imada
IPC分类号： C08K336
CPC分类号： C07D407/14 , C07D311/78 , C07D311/82 , C08G59/063 , C08G59/245
摘要： The present invention relates to an epoxy resin composition a cure article thereof, a novel epoxy resin used therein, a polyhydric phenol compound suited for used as an intermediate thereof, and a process for preparing the same. One of the objects to be achieved by the present invention is to exert the heat resistance, the moisture resistance, the dielectric performances and the flame-resistant effect required of electric or electronic materials such as semiconductor encapsulating materials and varnishes for circuit boards in the epoxy resin composition.
摘要翻译：环氧树脂组合物及其制备方法技术领域本发明涉及环氧树脂组合物及其固化物，其中使用的新型环氧树脂，适合用作其中间体的多元酚化合物及其制备方法。本发明要实现的目的之一是发挥电子或电子材料如半导体封装材料和环氧树脂电路板清漆所需要的耐热性，耐湿性，介电性能和阻燃效果树脂组合物。

2. 发明申请

US20060235183A1 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin 有权
标题翻译：环氧树脂组合物，环氧树脂生产工艺，新型环氧树脂，新型酚醛树脂
公开(公告)号：US20060235183A1
公开(公告)日：2006-10-19
申请号：US11455106
申请日：2006-06-19
申请人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
发明人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
IPC分类号： C08G65/40
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.
摘要翻译：在使用分子量增加的双官能环氧树脂用于赋予柔软性或改善介电性的技术领域中，本发明在用于制备固化环氧树脂制品时具有显着改善的耐湿性和耐水性。环氧树脂组合物包含具有以下结构的双官能环氧树脂（A）：其中在芳香核中具有键合位置的芳族烃基（a 1）和具有醚键的烃基（a 2）或其它烃基（ a 3）通过缩醛键（a 4）键合，并且还具有缩水甘油氧基键合到芳香族烃基（a 1）的结构。和固化剂（B）作为必需成分。

3. 发明授权

US07365147B2 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin 有权
标题翻译：环氧树脂组合物，环氧树脂生产工艺，新型环氧树脂，新型酚醛树脂
公开(公告)号：US07365147B2
公开(公告)日：2008-04-29
申请号：US11455108
申请日：2006-06-19
申请人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
发明人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
IPC分类号： C08G59/06 , C08G59/04 , C08G59/02 , C08L63/00
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.
摘要翻译：在使用分子量增加的双官能环氧树脂用于赋予柔软性或改善介电性的技术领域中，本发明在用于制备固化环氧树脂制品时具有显着改善的耐湿性和耐水性。环氧树脂组合物包括具有以下结构的双官能环氧树脂（A）：其中在芳香核中具有键合位置的芳族烃基（a1）和具有醚键的烃基（a2）或另一个烃基（a3）通过缩醛键（a4）键合，并且还具有缩水甘油氧基键合到芳香族烃基（a1）的结构。和固化剂（B）作为必需成分。

4. 发明授权

US07456247B2 Phenolic resin formed from a difunctional phenol and a divinyl ether 有权
标题翻译：由双官能苯酚和二乙烯基醚形成的酚醛树脂
公开(公告)号：US07456247B2
公开(公告)日：2008-11-25
申请号：US11455106
申请日：2006-06-19
申请人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
发明人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
IPC分类号： C08G67/00
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： A phenolic resin, which is the reaction product of a difunctional phenol compound and a divinyl ether having a cycloalkane structure, is provided. The phenolic resin is used to form a difunctional epoxy resin. The resulting epoxy resin features relatively increased molecular weight, and it is used to impart flexibility or improved dielectric properties. It also provides improved moisture and water resistance when used to produce a cured epoxy resin article.
摘要翻译：提供了酚醛树脂，其为双官能酚化合物与具有环烷烃结构的二乙烯基醚的反应产物。酚醛树脂用于形成双官能环氧树脂。所得到的环氧树脂具有相对增加的分子量，并且其用于赋予柔性或改善的介电性能。当用于生产固化的环氧树脂制品时，它还提供改善的防潮和防水性。

5. 发明申请

US20060241274A1 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin 有权
公开(公告)号：US20060241274A1
公开(公告)日：2006-10-26
申请号：US11455108
申请日：2006-06-19
申请人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
发明人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
IPC分类号： C08G59/06
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.

6. 发明授权

US07087702B2 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin 有权
公开(公告)号：US07087702B2
公开(公告)日：2006-08-08
申请号：US10682920
申请日：2003-10-14
申请人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
发明人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
IPC分类号： C08G59/00
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.

7. 发明授权

US07569654B2 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin 有权
标题翻译：环氧树脂组合物，环氧树脂生产工艺，新型环氧树脂，新型酚醛树脂
公开(公告)号：US07569654B2
公开(公告)日：2009-08-04
申请号：US11454911
申请日：2006-06-19
申请人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
发明人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
IPC分类号： C08L63/00 , C08G59/00 , C08G59/06
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.
摘要翻译：在使用分子量增加的双官能环氧树脂用于赋予柔软性或改善介电性的技术领域中，本发明在用于制备固化环氧树脂制品时具有显着改善的耐湿性和耐水性。环氧树脂组合物包括具有以下结构的双官能环氧树脂（A）：其中在芳香核中具有键合位置的芳族烃基（a1）和具有醚键的烃基（a2）或另一个烃基（a3）通过缩醛键（a4）键合，并且还具有缩水甘油氧基键合到芳香族烃基（a1）的结构。和固化剂（B）作为必需成分。

8. 发明申请

US20060247392A1 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin 有权
公开(公告)号：US20060247392A1
公开(公告)日：2006-11-02
申请号：US11454911
申请日：2006-06-19
申请人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
发明人： Ichiro Ogura , Nobuya Nakamura , Tomoyuki Imada
IPC分类号： C08L63/00 , C08G59/00 , B32B27/38
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.

9. 发明申请

US20140023969A1 POSITIVE PHOTORESIST COMPOSITION, COATING FILM THEREOF, AND NOVOLAC PHENOL RESIN 有权
标题翻译：阳性光电组合物，其涂料膜和NOVOLAC酚醛树脂
公开(公告)号：US20140023969A1
公开(公告)日：2014-01-23
申请号：US14110311
申请日：2012-04-10
申请人： Tomoyuki Imada , Takakazu Kage , Norifumi Imaizumi
发明人： Tomoyuki Imada , Takakazu Kage , Norifumi Imaizumi
IPC分类号： G03F7/039
CPC分类号： G03F7/039 , C08G8/08 , C08G8/12 , C08G8/20 , C08L61/06 , C08L2205/02 , C09D161/06 , G03F7/0233 , G03F7/0236
摘要： A positive photoresist composition includes 3 to 80 parts by mass of a novolac phenol resin (B) relative to 100 parts by mass of a cresol novolac resin (A). The novolac phenol resin (B) has a repeating structural unit represented by formula (1) [In the formula, R represents a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms and X represents a structure (x1) represented by formula (2)
摘要翻译：相对于100质量份的甲酚酚醛清漆树脂（A），正型光致抗蚀剂组合物包含3〜80质量份酚醛清漆型酚醛树脂（B）。酚醛清漆型酚醛树脂（B）具有式（1）所示的重复结构单元[式中，R表示氢原子或碳原子数1〜12的烃基，X表示由式（1）表示的结构（x1） 2）

10. 发明授权

US08623585B2 Positive-type photoresist composition 有权
标题翻译：正型光致抗蚀剂组合物
公开(公告)号：US08623585B2
公开(公告)日：2014-01-07
申请号：US13884788
申请日：2011-10-25
申请人： Tomoyuki Imada , Takakazu Kage , Norifumi Imaizumi
发明人： Tomoyuki Imada , Takakazu Kage , Norifumi Imaizumi
IPC分类号： G03F7/004 , G03F7/032 , C08L61/06 , C08G8/28
CPC分类号： G03F7/004 , C08G8/04 , C08G8/20 , C08L61/12 , G03F7/0236
摘要： Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5−p); and s is an integer of 1 to (9−p).)
摘要翻译：提供一种正型光致抗蚀剂组合物，其含有通过将通式（1）或（2）表示的芳族化合物（A）与脂肪族醛（B）缩合制备的酚醛清漆型酚醛树脂（C）作为必要成分。该正性光致抗蚀剂组合物同时具有高灵敏度和高耐热性，并且适合用作例如IC和LSI等半导体器件的制造中的正性光致抗蚀剂，LCD等显示器的制造和印版的制造。（式中，R 1，R 2，R 3各自独立地表示碳原子数1〜8的烷基，m，n，p分别为0〜4的整数，q为1〜 p）; s为1〜（9-p）的整数。）

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