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1. 发明申请

WO2014149588A1 ACOUSTIC SENSOR WITH INTEGRATED PROGRAMMABLE ELECTRONIC INTERFACE 审中-公开
标题翻译：具有集成可编程电子接口的声学传感器
公开(公告)号：WO2014149588A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/019758
申请日：2014-03-02
申请人： INVENSENSE, INC. , CAGDASER, Baris , LIM, Martin , ASSADERAGHI, Fariborz
发明人： CAGDASER, Baris , LIM, Martin , ASSADERAGHI, Fariborz
IPC分类号： H04R3/04 , H04R7/04
CPC分类号： H04R19/04 , H04R19/005 , H04R2201/003
摘要： An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an acoustic pressure to the MEMS transducer.
摘要翻译：集成的MEMS声传感器具有MEMS传感器和可编程电子接口。可编程电子接口包括非易失性存储器并耦合到MEMS换能器。使用可编程电气功能，可编程电子接口可操作以感测通过向MEMS换能器施加声压而引起的MEMS换能器中的变化。

2. 发明申请

WO2007061963A2 METHOD OF MAKING AN X-Y AXIS DUAL-MASS TUNING FORK GYROSCOPE WITH VERTICALLY INTEGRATED ELECTRONICS AND WAFER-SCALE HERMETIC PACKAGING 审中-公开
标题翻译：使用垂直集成电子技术制造X-Y轴双质量调谐陀螺仪的方法和WAFER-SCALE包装
公开(公告)号：WO2007061963A2
公开(公告)日：2007-05-31
申请号：PCT/US2006/044919
申请日：2006-11-17
申请人： INVENSENSE INC. , NASIRI, Steven, S. , SEEGER, Joseph , LIM, Martin , FLANNERY, Jr., Anthony Francis , CASTRO, Alexander
发明人： NASIRI, Steven, S. , SEEGER, Joseph , LIM, Martin , FLANNERY, Jr., Anthony Francis , CASTRO, Alexander
IPC分类号： G01P9/04
CPC分类号： G01C19/56 , G01C19/5712 , G01C19/5719 , G01C19/574
摘要： A dual-axis sensor for measuring X and Y components of angular velocity in an X-Y sensor plane is provided. The dual-axis sensor includes a first subsensor for measuring the X component of angular velocity, and a second subsensor for measuring the Y component of angular velocity. The first subsensor and the second subsensor are contained within a single hermetic seal within the dual-axis sensor.
摘要翻译：提供了用于测量X-Y传感器平面中的角速度的X和Y分量的双轴传感器。双轴传感器包括用于测量角速度的X分量的第一子传感器和用于测量角速度的Y分量的第二子传感器。第一子传感器和第二子传感器包含在双轴传感器内的单个气密封中。

3. 发明申请

WO2013003784A2 PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT 审中-公开
标题翻译：具有暴露于环境的部件的密封MEMS器件的工艺
公开(公告)号：WO2013003784A2
公开(公告)日：2013-01-03
申请号：PCT/US2012/045061
申请日：2012-06-29
申请人： INVENSENSE, INC. , DANEMAN, Michael, J. , LIM, Martin , SEEGER, Joseph , TCHERTKOV, Igor , NASIRI, Steven, S.
发明人： DANEMAN, Michael, J. , LIM, Martin , SEEGER, Joseph , TCHERTKOV, Igor , NASIRI, Steven, S.
IPC分类号： H01L21/50 , H01L29/84
CPC分类号： H01L23/10 , B81B2201/0264 , B81B2201/047 , B81B2207/115 , B81C1/00238 , B81C2203/0109 , B81C2203/0145 , B81C2203/0792 , G01P15/0802 , G01P15/125 , G02B26/0833 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment.
摘要翻译：公开了一种用于向MEMS器件提供暴露于外部环境的部分的方法和系统。该方法包括将处理晶片结合到器件晶片以形成具有设置在手柄和器件晶片之间的介电层的MEMS衬底。该方法包括光刻地限定器件晶片上的至少一个间隔，并将至少一个支架结合到集成电路衬底，以在MEMS衬底和集成电路衬底之间形成密封空腔。该方法包括在处理晶片，支座或集成电路基板中限定至少一个开口，以暴露一部分将器件晶片的一部分暴露于外部环境。

4. 发明申请

WO2012125651A2 WAFER LEVEL PACKAGING OF MEMS DEVICES 审中-公开
标题翻译： MEMS器件的水平包装
公开(公告)号：WO2012125651A2
公开(公告)日：2012-09-20
申请号：PCT/US2012/028946
申请日：2012-03-13
申请人： INVENSENSE, INC. , DANEMAN, Michael, J. , NASIRI, Steven, S. , LIM, Martin
发明人： DANEMAN, Michael, J. , NASIRI, Steven, S. , LIM, Martin
IPC分类号： H01L29/84
CPC分类号： A45D27/42 , B81C1/00238 , B81C2203/0792 , H01L21/76898
摘要： A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.
摘要翻译：公开了MEMS器件。 MEMS器件包括MEMS衬底和具有前表面，后表面和一个或多个金属化层的CMOS衬底。前表面接合到MEMS基板上。 MEMS器件包括在CMOS衬底的背面上的一个或多个导电特征以及一个或多个金属化层与一个或多个导电特征之间的电连接。

5. 发明申请

WO2016090011A1 SYSTEMS AND APPARATUS HAVING TOP PORT INTEGRATED BACK CAVITY MICRO ELECTRO-MECHANICAL SYSTEM MICROPHONES AND METHODS OF FABRICATION OF THE SAME 审中-公开
标题翻译：具有顶端口集成背孔的系统和装置微机电系统微型计算机及其制造方法
公开(公告)号：WO2016090011A1
公开(公告)日：2016-06-09
申请号：PCT/US2015/063460
申请日：2015-12-02
申请人： INVENSENSE, INC.
发明人： LIU, Fang , LIM, Martin
IPC分类号： H04R19/00
CPC分类号： H04R1/08 , H04R19/005 , H04R2201/003
摘要： A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the MEMS device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves. The MEMS device also includes a second substrate coupled to and facing the diaphragm, and including circuitry, wherein the second substrate includes a recess region forming an integrated back cavity in the MEMS device. The MEMS device also includes an electrical connection electrically coupling the first substrate and the second substrate and configured to transmit an electrical signal indicative of the deflection of the diaphragm.
摘要翻译：提供了微机电系统（MEMS）装置。 MEMS器件包括：具有第一表面和第二表面的第一基底和通过第一基底设置的端口，其中端口被配置为接收声波，并且其中第一表面暴露于MEMS器件外部的环境; 以及耦合到第二表面并面对第二表面并且响应于接收的声波而被配置为响应于隔膜处的压力差而偏转的膜片。 MEMS器件还包括耦合到并面向隔膜的第二衬底，并且包括电路，其中第二衬底包括形成MEMS器件中的集成后腔的凹陷区域。 MEMS装置还包括电连接电连接第一基板和第二基板并被配置为传输指示隔膜的偏转的电信号。

6. 发明申请

WO2014163989A1 MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY 审中-公开
标题翻译：具有集成背腔的MEMS声学传感器
公开(公告)号：WO2014163989A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/019685
申请日：2014-02-28
申请人： INVENSENSE, INC.
发明人： ATA, Erhan, Polatkan , LIM, Martin , LI, Xiang , LLOYD, Stephen , DANEMAN, Michael, Julian
IPC分类号： H01L29/96 , H01L29/84 , H01L29/86
CPC分类号： B81B7/0061 , B81B3/001 , B81B2201/0257 , B81B2203/053 , B81B2203/058 , B81B2207/012 , H04R19/005
摘要： A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.
摘要翻译：公开了MEMS器件。 MEMS器件包括具有第一表面和第二表面的第一板; 以及附接到第一基板的锚。 MEMS器件还包括具有附接到第一板的第三表面和第四表面的第二板。连杆将锚固件连接到第一板，其中第一板和第二板在第一板的第一和第二表面之间存在声压差的情况下移位。第一板，第二板，连杆和锚固件都包含在由第一基板和第二基板形成的外壳中，其中第一和第二基板中的一个包含通孔，以将第一板的第一表面暴露于环境。

7. 发明授权

EP2973727B1 MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY 有权
公开(公告)号：EP2973727B1
公开(公告)日：2020-08-26
申请号：EP14779630.4
申请日：2014-02-28
申请人： InvenSense, Inc.
发明人： ATA, Erhan, Polatkan , LIM, Martin , LI, Xiang , LLOYD, Stephen , DANEMAN, Michael, Julian
IPC分类号： B81B3/00 , B81B7/00 , H04R19/00

8. 发明申请

WO2018191009A1 GAS SENSING METHOD AND DEVICE 审中-公开
公开(公告)号：WO2018191009A1
公开(公告)日：2018-10-18
申请号：PCT/US2018/024565
申请日：2018-03-27
申请人： INVENSENSE, INC.
发明人： LIU, Fang , HARTWELL, Peter , LIM, Martin , YANG, Yushi
IPC分类号： G01N27/12 , G01N27/18 , G01N33/00
摘要： The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.

9. 发明申请

WO2017044267A1 GAS SENSOR PLATFORM AND THE METHOD OF MAKING THE SAME 审中-公开
标题翻译：气体传感器平台及其制造方法
公开(公告)号：WO2017044267A1
公开(公告)日：2017-03-16
申请号：PCT/US2016/047359
申请日：2016-08-17
申请人： INVENSENSE, INC.
发明人： LIU, Fang , LIM, Martin , CAGDASER, Baris
IPC分类号： G01N27/12 , G01N27/414
CPC分类号： G01N27/046 , G01K7/16 , G01N27/128 , G01N27/4148
摘要： The present invention relates to low power, low cost, and compact gas sensors and methods for making the same. In one embodiment, the gas sensor includes a heating element embedded in a suspended structure overlying a substrate. The heating element is configured to generate an amount of heat to bring the chemical sensing element to an operating temperature. The chemical sensing element is thermally coupled to the heating element. The chemical sensing element is also exposed to an environment that contains the gas to be measured. In one embodiment, the chemical sensing element comprises a metal oxide compound having an electrical resistance based on the concentration of a gas in the environment and the operating temperature of the chemical sensing element. In this embodiment, the operating temperature of the chemical sensing element is greater than room temperature and determined by the amount of heat generated by the heating element.
摘要翻译：本发明涉及低功率，低成本和小型气体传感器及其制造方法。在一个实施例中，气体传感器包括嵌入在衬底上的悬挂结构中的加热元件。加热元件构造成产生一定量的热量以使化学传感元件达到工作温度。化学传感元件热耦合到加热元件。化学传感元件也暴露于含有待测气体的环境中。在一个实施方案中，化学传感元件包括基于环境中的气体浓度和化学传感元件的操作温度具有电阻的金属氧化物化合物。在该实施例中，化学传感元件的工作温度大于室温，并由加热元件产生的热量确定。

10. 发明申请

WO2015172070A1 INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME 审中-公开
标题翻译：包含MEMS声学传感器和环境传感器的集成封装及其制造方法
公开(公告)号：WO2015172070A1
公开(公告)日：2015-11-12
申请号：PCT/US2015/029969
申请日：2015-05-08
申请人： INVENSENSE, INC.
发明人： TSAI, Julius Ming-Lin , CAGDASER, Baris , LIM, Martin , KHENKIN, Aleksey S.
IPC分类号： B81C1/00 , B81B7/02 , G01L23/08
CPC分类号： B81B7/02 , B81B2201/0214 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16152 , H04R1/04 , H04R19/04 , H04R29/004 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要： An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
摘要翻译：公开了至少一个环境传感器和至少一个MEMS声学传感器的集成封装。该包装包含共享端口，将两个传感器公开到环境中，其中环境传感器测量环境的特性并且声学传感器测量声波。该端口将环境传感器暴露于气流，声传感器暴露于声波。声学传感器的示例是麦克风，并且环境传感器的示例是湿度传感器。

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