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1. 发明申请

WO2019005487A1 IMAGE GENERATION IN AN ELECTRONIC DEVICE USING ULTRASONIC TRANSDUCERS 审中-公开
公开(公告)号：WO2019005487A1
公开(公告)日：2019-01-03
申请号：PCT/US2018/037364
申请日：2018-06-13
申请人： INVENSENSE, INC.
发明人： GARLEPP, Bruno W. , SALVIA, James Christian , DANEMAN, Michael , APTE, Nikhil , TSAI, Julius Ming-Lin
IPC分类号： G06K9/00
摘要： A method for generating a composite image having an increased image pixel density by an array of ultrasonic transducers having a given spatial density is provided. The method comprises capturing a first set of pixels at an ultrasonic sensor using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of ultrasonic transducers. The first beamforming pattern and the second beamforming pattern are different. Pixels of the second set of pixels correspond to positions between pixels of the first set of pixels. The method additionally comprises combining the first and second sets of pixels to form the composite image.

2. 发明申请

WO2016022439A1 PIEZOELECTRIC ACOUSTIC RESONATOR BASED SENSOR 审中-公开
标题翻译：基于压电声学谐振器的传感器
公开(公告)号：WO2016022439A1
公开(公告)日：2016-02-11
申请号：PCT/US2015/043329
申请日：2015-07-31
申请人： INVENSENSE, INC.
发明人： LIU, Fang , TSAI, Julius Ming-Lin , LI, Xiang , DANEMAN, Mike
IPC分类号： G06F3/043
CPC分类号： G01L1/165 , G06F3/0436 , H03K17/96 , H03K17/9643 , H03K2217/96003
摘要： A piezoelectric acoustic resonator based sensor is presented herein. A device can include an array of piezoelectric transducers and an array of cavities that has been attached to the array of piezoelectric transducers to form an array of resonators. A resonator of the array of resonators can be associated with a first frequency response corresponding to a first determination that the resonator has been touched, and a second frequency response corresponding to a second determination that the resonator has not been touched. The array of piezoelectric transducers can include a piezoelectric material; a first set of electrodes that has been formed a first side of the piezoelectric material; and a second set of electrodes that has been formed on second side of the piezoelectric material.
摘要翻译：本文介绍了一种基于压电声谐振器的传感器。器件可以包括压电换能器的阵列和已经附接到压电换能器阵列以形成谐振器阵列的空腔阵列。谐振器阵列的谐振器可以与对应于谐振器已被触摸的第一确定的第一频率响应和对应于谐振器未被触摸的第二确定的第二频率响应相关联。压电换能器阵列可包括压电材料; 已经形成为压电材料的第一侧的第一组电极; 以及已经形成在压电材料的第二侧上的第二组电极。

3. 发明申请

WO2017192903A2 DEVICE MOUNTABLE PACKAGING OF ULTRASONIC TRANSDUCERS 审中-公开
标题翻译：器件可安装超声波传感器的包装
公开(公告)号：WO2017192903A2
公开(公告)日：2017-11-09
申请号：PCT/US2017/031140
申请日：2017-05-04
申请人： INVENSENSE, INC.
发明人： TSAI, Julius Ming-Lin
IPC分类号： B06B1/02
摘要： An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.
摘要翻译：包括用于产生和接收超声波信号的超声波换能器阵列以及覆盖超声波换能器阵列的声学耦合层的电子设备，其中超声波信号通过声学耦合层传播。 p>

4. 发明申请

WO2017192903A3 DEVICE MOUNTABLE PACKAGING OF ULTRASONIC TRANSDUCERS 审中-公开
公开(公告)号：WO2017192903A3
公开(公告)日：2017-11-09
申请号：PCT/US2017/031140
申请日：2017-05-04
申请人： INVENSENSE, INC.
发明人： TSAI, Julius Ming-Lin
IPC分类号： B06B1/02 , B06B1/06 , G06K9/00
摘要： An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.

5. 发明申请

WO2017192890A1 A PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER (PMUT) 审中-公开
标题翻译：压电微机械超声换能器（PMUT）
公开(公告)号：WO2017192890A1
公开(公告)日：2017-11-09
申请号：PCT/US2017/031120
申请日：2017-05-04
申请人： INVENSENSE, INC.
发明人： NG, Eldwin , TSAI, Julius Ming-Lin , APTE, Nikhil
IPC分类号： H01L41/047 , B06B1/06
摘要： A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
摘要翻译：提供一种压电微机械超声波换能器（PMUT）装置。 PMUT包括衬底和连接到衬底的边缘支撑结构。膜连接到边缘支撑结构，使得在膜和基底之间限定空腔，其中膜被构造成允许在超声频率下移动。膜包括压电层以及耦合到压电层的相对侧的第一和第二电极。内部支撑结构设置在空腔内并连接到基底和膜。

6. 发明申请

WO2017192895A1 OPERATING A TWO-DIMENSIONAL ARRAY OF ULTRASONIC TRANSDUCERS 审中-公开
标题翻译：操作二维阵列的超声换能器
公开(公告)号：WO2017192895A1
公开(公告)日：2017-11-09
申请号：PCT/US2017/031127
申请日：2017-05-04
申请人： INVENSENSE, INC.
发明人： APTE, Nikhil , TSAI, Julius Ming-Lin , DANEMAN, Michael Julian , BERGER, Renata Melamud
IPC分类号： G10K11/34 , B06B1/06
摘要： In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers. The activation also includes receiving reflected ultrasonic signals at a second group of ultrasonic transducers of the plurality of ultrasonic transducers.
摘要翻译：在操作超声波换能器的二维阵列的方法中，限定包括超声波换能器的二维阵列的多个超声波换能器的多个阵列位置，多个阵列位置各自包括超声换能器的二维阵列的超声换能器的一部分。对于多个阵列位置中的每个阵列位置，激活与相应阵列位置相关联的多个超声波换能器。激活包括从多个超声波换能器的第一组超声波换能器发送超声波信号，其中第一组超声波换能器的至少一些超声波换能器相对于第一组超声波换能器的其他超声波换能器而言是相位延迟的。激活还包括在多个超声换能器的第二组超声换能器处接收反射的超声信号。

7. 发明申请

WO2016053587A1 MICROELECTROMECHANICAL SYSTEMS (MEMS) PRESSURE SENSOR HAVING A LEAKAGE PATH TO A CAVITY 审中-公开
标题翻译：微电子系统（MEMS）压力传感器有一个泄漏路径到CAVITY
公开(公告)号：WO2016053587A1
公开(公告)日：2016-04-07
申请号：PCT/US2015/049209
申请日：2015-09-09
申请人： INVENSENSE, INC.
发明人： TSAI, Julius Ming-Lin , KHENKIN, Aleksey S. , CAGDASER, Baris , SALVIA, James Christian , ASSADERAGHI, Fariborz
IPC分类号： G01L9/12 , G01L27/00
CPC分类号： G01L9/0073 , B81B3/0021 , B81B2201/0264 , G01L9/125 , G01L19/0092 , G01L27/002 , H04R19/005 , H04R19/04
摘要： Microelectromechanical systems (MEMS) pressure sensors having a leakage path are described. Provided implementations can comprise a MEMS pressure sensor system associated with a back cavity and a membrane that separates the back cavity and an ambient atmosphere. A pressure of the ambient atmosphere is determined based on a parameter associated with movement of the membrane.
摘要翻译：描述了具有泄漏路径的微机电系统（MEMS）压力传感器。所提供的实施方案可以包括与背腔相关联的MEMS压力传感器系统和分离后腔和环境气氛的膜。基于与膜的移动相关的参数来确定环境大气的压力。

8. 发明申请

WO2015172070A1 INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME 审中-公开
标题翻译：包含MEMS声学传感器和环境传感器的集成封装及其制造方法
公开(公告)号：WO2015172070A1
公开(公告)日：2015-11-12
申请号：PCT/US2015/029969
申请日：2015-05-08
申请人： INVENSENSE, INC.
发明人： TSAI, Julius Ming-Lin , CAGDASER, Baris , LIM, Martin , KHENKIN, Aleksey S.
IPC分类号： B81C1/00 , B81B7/02 , G01L23/08
CPC分类号： B81B7/02 , B81B2201/0214 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16152 , H04R1/04 , H04R19/04 , H04R29/004 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要： An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
摘要翻译：公开了至少一个环境传感器和至少一个MEMS声学传感器的集成封装。该包装包含共享端口，将两个传感器公开到环境中，其中环境传感器测量环境的特性并且声学传感器测量声波。该端口将环境传感器暴露于气流，声传感器暴露于声波。声学传感器的示例是麦克风，并且环境传感器的示例是湿度传感器。

9. 发明申请

WO2017192899A1 A TWO-DIMENSIONAL ARRAY OF CMOS CONTROL ELEMENTS 审中-公开
标题翻译： CMOS控制元件的二维阵列
公开(公告)号：WO2017192899A1
公开(公告)日：2017-11-09
申请号：PCT/US2017/031134
申请日：2017-05-04
申请人： INVENSENSE, INC.
发明人： SALVIA, James Christian , PERROTT, Michael H. , VOROS, Marian , NG, Eldwin , TSAI, Julius Ming-Lin , APTE, Nikhil
IPC分类号： H01L41/047 , B06B1/06 , H01L27/02 , B06B1/02 , G06K9/00 , H01L27/20 , H03H3/007
摘要： An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes two semiconductor devices. The plurality of CMOS control elements include a first subset of CMOS control elements, each CMOS control element of the first subset of CMOS control elements including a semiconductor device of a first class and a semiconductor device of a second class, and a second subset of CMOS control elements, each CMOS control element of the second subset of CMOS control elements including a semiconductor device of the first class and a semiconductor device of a third class. The plurality of CMOS control elements are arranged in the two-dimensional array such that CMOS semiconductor devices of a class are only adjacent to other CMOS semiconductor devices of the same class.
摘要翻译：电子设备包括布置成二维阵列的多个CMOS控制元件，其中多个CMOS控制元件中的每个CMOS控制元件包括两个半导体器件。多个CMOS控制元件包括第一子集的CMOS控制元件，第一子集的CMOS控制元件的每个CMOS控制元件包括第一类半导体器件和第二类半导体器件，以及第二子集CMOS 控制元件，第二子集的CMOS控制元件的每个CMOS控制元件包括第一类半导体器件和第三类半导体器件。多个CMOS控制元件排列成二维阵列，使得一类CMOS半导体器件仅与相同类别的其他CMOS半导体器件相邻。

10. 发明申请

WO2016053745A1 PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS 审中-公开
标题翻译：具有集成CMOS的压电麦克风
公开(公告)号：WO2016053745A1
公开(公告)日：2016-04-07
申请号：PCT/US2015/051923
申请日：2015-09-24
申请人： INVENSENSE, INC.
发明人： TSAI, Julius Ming-Lin , DANEMAN, Michael
IPC分类号： H04R17/02 , H04R31/00
CPC分类号： B81B7/02 , B81B2201/0257 , B81B2203/04 , B81B2207/015 , B81B2207/07 , B81B2207/094 , B81C1/00246 , B81C2201/0123 , B81C2201/013 , B81C2201/0183 , B81C2203/0714 , B81C2203/075 , H01L2224/48091 , H01L2924/15151 , H04R17/02 , H04R31/006 , H04R2201/003 , H01L2924/00014
摘要： A piezoelectric microphone and/or a piezoelectric microphone system is presented herein. In an implementation, a piezoelectric microphone includes a microelectromechanical systems (MEMS) layer and a complementary metal-oxide-semiconductor (CMOS) layer. The MEMS layer includes at least one piezoelectric layer and a conductive layer. The conductive layer is deposited on the at least one piezoelectric layer and is associated with at least one sensing electrode. The CMOS layer is deposited on the MEMS layer. Furthermore, a cavity formed in the CMOS layer includes the at least one sensing electrode
摘要翻译：此处呈现压电麦克风和/或压电麦克风系统。在一个实现中，压电麦克风包括微机电系统（MEMS）层和互补金属氧化物半导体（CMOS）层。 MEMS层包括至少一个压电层和导电层。导电层沉积在至少一个压电层上并且与至少一个感测电极相关联。 CMOS层沉积在MEMS层上。此外，形成在CMOS层中的空腔包括至少一个感测电极

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