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    • 2. 发明申请
    • SEMICONDUCTOR MEMORY APPARATUS AND METHOD FOR OPERATING THE SAME
    • 半导体存储器及其操作方法
    • US20120131258A1
    • 2012-05-24
    • US13217421
    • 2011-08-25
    • Heat Bit PARK
    • Heat Bit PARK
    • G06F12/06
    • G11C8/12
    • A semiconductor memory apparatus includes, inter alia, a master chip and a plurality of slave chips. Each of the slave chips includes a plurality of banks. A first reception signal, a first timing signal, a bank address signal, and a slice selection signal to the slave chips may be provided by a master chip. The slave chips include a slice determining unit configured to compare the slice selection signal and a slice code and generate a slice enable signal, and a bank selecting unit configured to receive the bank address signal in response to the first reception signal and the slice enable signal and generate a bank enable signal in response to the bank address signal and the first timing signal.
    • 一种半导体存储器装置尤其包括主芯片和多个从芯片。 每个从属芯片包括多个存储体。 主芯片可以提供第一接收信号,第一定时信号,存储体地址信号和从芯片的片选择信号。 从芯片包括片确定单元,被配置为比较切片选择信号和切片码,并生成切片使能信号;以及存储体选择单元,被配置为响应于第一接收信号和切片使能信号接收存储体地址信号 并响应于所述存储体地址信号和所述第一定时信号产生存储体使能信号。
    • 3. 发明申请
    • SEMICONDUCTOR MEMORY APPARATUS INCLUDING DATA COMPRESSION TEST CIRCUIT
    • 半导体存储器包括数据压缩测试电路
    • US20110161753A1
    • 2011-06-30
    • US12836519
    • 2010-07-14
    • Heat Bit PARKTae Sik YUN
    • Heat Bit PARKTae Sik YUN
    • G11C29/04G06F11/22
    • G11C29/40
    • A semiconductor memory apparatus having stacked first and second chips includes a first chip test signal generation unit disposed in the first chip and configured to generate a first chip test signal in response to a first chip compression data determination signal in a test mode, a second chip test signal generation unit disposed in the second chip and configured to generate a second chip test signal in response to a second chip compression data determination signal in the test mode, and a final data determination unit configured to generate a final test to signal in response to the first and second chip test signals in the test mode.
    • 具有堆叠的第一和第二芯片的半导体存储器件包括:第一芯片测试信号生成单元,设置在第一芯片中,并且被配置为响应于测试模式中的第一芯片压缩数据确定信号产生第一芯片测试信号;第二芯片 测试信号生成单元,其设置在所述第二芯片中,并且被配置为响应于所述测试模式中的第二芯片压缩数据确定信号而产生第二芯片测试信号,以及最终数据确定单元,被配置为产生响应于 第一和第二芯片测试信号处于测试模式。
    • 5. 发明申请
    • SEMICONDUCTOR MEMORY APPARATUS
    • 半导体存储器
    • US20110103162A1
    • 2011-05-05
    • US12650882
    • 2009-12-31
    • Heat Bit PARK
    • Heat Bit PARK
    • G11C7/00G11C8/00
    • G11C5/063G11C5/025G11C7/18G11C2207/002
    • A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes: a plurality of memory banks disposed at a predetermined distance from each other in a first direction; a common column selection control unit disposed at an outside region of the plurality of memory banks in the first direction, and configured to commonly control access to column areas of the plurality of memory banks; and a common column selection signal transmission line configured to transfer a column selection signal for controlling data access to the corresponding memory cells of the plurality of memory banks. The common column selection control unit generates the column selection signal, and a delay length of the column selection signal is adjusted based on a length of a transmission path of the column selection signal.
    • 提供半导体存储装置。 半导体存储装置包括:沿第一方向彼此隔开预定距离地设置的多个存储体; 公共列选择控制单元,设置在所述多个存储体的第一方向的外部区域,并且被配置为共同地控制对所述多个存储体的列区域的访问; 以及公共列选择信号传输线,被配置为传送用于控制数据访问的列选择信号到多个存储体的相应存储单元。 公共列选择控制单元产生列选择信号,并且基于列选择信号的传输路径的长度来调整列选择信号的延迟长度。
    • 7. 发明申请
    • SEMICONDUCTOR MEMORY APPARATUS
    • 半导体存储器
    • US20110103160A1
    • 2011-05-05
    • US12650666
    • 2009-12-31
    • Heat Bit PARK
    • Heat Bit PARK
    • G11C7/00G11C8/00
    • G11C7/02G11C7/18
    • A semiconductor memory apparatus is provided. The semiconductor memory apparatus comprises: first and second memory banks located a predetermined distance from each other in a first direction; a common column selection control unit located at an outside region in the first and second memory banks in the first direction, and configured to commonly control access to column areas in the first and second memory banks and generate a column selection signal that controls data access to the corresponding memory cells in the first and second memory banks; a first data read/write unit configured to sense and amplify read data transferred from the first memory bank and transfer write data to the first memory bank; and a second data read/write unit configured to sense and amplify read data transferred from the second memory bank and transfer write data to the second memory bank. The first data read/write unit and the second data read/write unit are located so as to be spaced from each other in the first direction with the memory bank interposed therebetween.
    • 提供半导体存储装置。 半导体存储装置包括:第一和第二存储体,其位于第一方向上彼此预定的距离; 公共列选择控制单元,位于第一和第二存储体中的第一方向上的外部区域,并且被配置为共同地控制对第一和第二存储体中的列区域的访问,并且生成控制数据访问的列选择信号 第一和第二存储体中的对应的存储单元; 第一数据读/写单元,被配置为检测和放大从第一存储体传送的读数据并将写数据传送到第一存储体; 以及第二数据读/写单元,被配置为感测和放大从第二存储体传送的读数据并将写数据传送到第二存储体。 第一数据读/写单元和第二数据读/写单元被定位成在第一方向上彼此间隔开,存储体插入其间。