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    • 5. 发明授权
    • Method of making connections in a back-lit circuit
    • 在背光电路中进行连接的方法
    • US08053353B2
    • 2011-11-08
    • US12431439
    • 2009-04-28
    • François Roy
    • François Roy
    • H01L21/4763
    • H01L27/14689H01L21/76898H01L23/481H01L27/14636H01L27/1464H01L2924/0002H01L2924/00
    • A method for forming, on a surface of a thinned-down semiconductor substrate, a contact connected to a metal track of an interconnect stack formed on the opposite surface of the thinned-down substrate, including the steps of: forming, on the side of a first surface of a substrate, an insulating region penetrating into the substrate and coated with a conductive region and with an insulating layer crossed by conductive vias, the vias connecting a metal track of the interconnect stack to the conductive region; gluing the external surface of the interconnect stack on a support and thinning down the substrate; etching the external surface of the thinned-down substrate and stopping on the insulating region; etching the insulating region and stopping on the conductive region; and filling the etched opening with a metal.
    • 在薄型半导体衬底的表面上形成连接到形成在薄型衬底的相对表面上的互连叠层的金属轨道的接触的方法,包括以下步骤:在 衬底的第一表面,穿透到衬底中并涂覆有导电区域并且具有由导电通孔交叉的绝缘层的绝缘区域,将互连叠层的金属轨道连接到导电区域的通孔; 将互连叠层的外表面胶合在支撑件上并使基板变薄; 蚀刻薄的衬底的外表面并停止在绝缘区上; 蚀刻绝缘区域并停止在导电区域上; 并用金属填充蚀刻开口。