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    • 1. 发明授权
    • Method for the formation of resist pattern
    • 形成抗蚀剂图案的方法
    • US6071673A
    • 2000-06-06
    • US138073
    • 1998-08-21
    • Etsuko IguchiToshimasa NakayamaTaiichiro Aoki
    • Etsuko IguchiToshimasa NakayamaTaiichiro Aoki
    • G03F7/004C09D5/00G03F7/09G03F7/11H01L21/027G03F7/00
    • G03F7/091Y10S430/151
    • The present invention provides a method for the formation of a pattern, which comprises applying an antireflective coating film-forming composition solution comprising (A) a compound which undergoes crosslinking reaction when irradiated with actinic rays and (B) a dye to a substrate to form a coating film thereon, entirely irradiating the coating film with actinic rays to form an antireflective coating film, applying a resist solution to the antireflective coating film, drying the coated material to form a resist layer, and then subjecting the coated material to lithographic treatment to form a resist pattern on the antireflective coating film. The method enables the formation of a resist pattern having an excellent dimensional accuracy and section shape without causing the formation of an intermixed layer between the resist composition and antireflective coating film.
    • 本发明提供了形成图案的方法,其包括施加抗反射涂膜组合物溶液,其包含(A)当用光化射线照射时经历交联反应的化合物和(B)染料至基底以形成 其上涂覆膜,用光化射线全面照射涂膜以形成抗反射涂膜,将抗蚀剂溶液施加到抗反射涂膜上,干燥涂覆的材料以形成抗蚀剂层,然后将涂覆的材料进行平版印刷处理 在抗反射涂膜上形成抗蚀剂图案。 该方法能够形成具有优异的尺寸精度和截面形状的抗蚀剂图案,而不会在抗蚀剂组合物和抗反射涂膜之间形成混合层。
    • 2. 发明授权
    • Composition for forming antireflective coating film and method for forming resist pattern using same
    • 用于形成抗反射涂膜的组合物和使用其形成抗蚀剂图案的方法
    • US06268108B1
    • 2001-07-31
    • US09116460
    • 1998-07-16
    • Etsuko IguchiMasakazu KobayashiHiroshi KomanoToshimasa Nakayama
    • Etsuko IguchiMasakazu KobayashiHiroshi KomanoToshimasa Nakayama
    • G03F7004
    • G03F7/091
    • The present invention provides a composition for forming an antireflective coating film which is not liable to intermixing between the resist composition layer and the antireflective coating layer and a method for forming a resist pattern having an excellent dimensional accuracy and section shape. The composition consists of (A) a compound which produces an acid upon irradiation with actinic rays, (B) a compound which undergoes crosslinking reaction in the presence of an acid, (C) a dye and (D) an organic solvent. The method for forming a resist pattern comprises applying the composition for forming an antireflective coating film to a semiconductor substrate, drying the composition coated, irradiating the entire surface of the coated material with actinic rays so that it undergoes crosslinking reaction to form an antireflective coating film thereon, applying a resist composition to the antireflective coating film, drying the coated material, and then subjecting the coated material to lithographic processing to form a resist pattern thereon.
    • 本发明提供了一种用于形成不易于在抗蚀剂组合物层和抗反射涂层之间混合的抗反射涂膜的组合物和形成具有优异的尺寸精度和截面形状的抗蚀剂图案的方法。 组合物由(A)在光化射线照射时产生酸的化合物,(B)在酸存在下进行交联反应的化合物,(C)染料和(D)有机溶剂。 形成抗蚀剂图案的方法包括将用于形成抗反射涂膜的组合物施加到半导体衬底上,干燥涂覆的组合物,用光化射线照射涂覆材料的整个表面,使其经历交联反应以形成抗反射涂膜 在其上涂布抗蚀剂组合物到抗反射涂膜上,干燥涂覆的材料,然后对涂覆材料进行光刻处理以在其上形成抗蚀剂图案。
    • 3. 发明授权
    • Photoresist laminate and method for patterning using the same
    • 光刻胶层压板和使用其的图案化方法
    • US5925495A
    • 1999-07-20
    • US924260
    • 1997-09-05
    • Mitsuru SatoKatsumi OomoriEtsuko IguchiKiyoshi IshikawaFumitake KanekoToshimasa Nakayama
    • Mitsuru SatoKatsumi OomoriEtsuko IguchiKiyoshi IshikawaFumitake KanekoToshimasa Nakayama
    • G03F7/004G03F7/038G03F7/09G03F7/11H01L21/027H01L21/302H01L21/3065G03C1/492
    • G03F7/091G03F7/0045Y10S430/12Y10S430/122
    • A proposal is made for the photolithographic formation of a patterned resist layer on a substrate without the troubles due to reflection of the exposure light on the substrate surface. Thus, patterning is conducted on a photoresist laminate comprising (a) a substrate; (b) a specific anti-reflection coating layer formed on one surface of the substrate; and (c) a photoresist layer formed on the anti-reflection coating layer from a specific negative-working chemical-sensitization photoresist composition comprising an oxime sulfonate acid generating agent. The patterning procedure comprises the steps of: (A) exposing, pattern-wise to actinic rays, the photoresist layer of the photoresist laminate; (B) subjecting the photoresist layer to a heat treatment; (C) subjecting the photoresist layer to a development treatment to dissolve away the photoresist layer in the areas unexposed to actinic rays in step (A) so as to expose bare the anti-reflection coating layer in the areas unexposed to the actinic rays leaving a patterned resist layer in the areas exposed to the actinic rays; and (D) removing the pattern-wise exposed anti-reflection coating layer by dry etching with the patterned photoresist layer as a mask.
    • 提出了在基板上的图案化抗蚀剂层的光刻形成,而不会由于基板表面上的曝光光的反射而引起的问题。 因此,在包含(a)基底的光致抗蚀剂层压件上进行图案化; (b)形成在所述基板的一个表面上的特定抗反射涂层; 以及(c)由抗反酸涂层形成的抗氧化剂层,其特征在于包含肟磺酸生成剂的特定负性化学增感光致抗蚀剂组合物。 图案化步骤包括以下步骤:(A)以光致抗蚀剂层压板的光致抗蚀剂层将光致抗蚀剂层以图形方式曝光于光化射线; (B)对光致抗蚀剂层进行热处理; (C)在步骤(A)中对光致抗蚀剂层进行显影处理以将光致抗蚀剂层溶解在未暴露于光化射线的区域中,以便露出未暴露于光化离子的区域中的防反射涂层 在暴露于光化射线的区域中的图案化抗蚀剂层; 和(D)通过用图案化的光致抗蚀剂层作为掩模的干蚀刻去除图案化的曝光的抗反射涂层。
    • 5. 发明授权
    • Positive resist composition comprising a mixture of two
polyhydroxystyrenes having different acid cleavable groups and an acid
generating compound
    • 包含两种具有不同的酸可分解基团的聚羟基苯乙烯和产酸化合物的混合物的正性抗蚀剂组合物
    • US5736296A
    • 1998-04-07
    • US625931
    • 1996-04-01
    • Mitsuru SatoKazuyuki NittaAkiyoshi YamazakiEtsuko IguchiYoshika SakaiKazufumi SatoToshimasa Nakayama
    • Mitsuru SatoKazuyuki NittaAkiyoshi YamazakiEtsuko IguchiYoshika SakaiKazufumi SatoToshimasa Nakayama
    • G03F7/004G03F7/039
    • G03F7/039G03F7/0045Y10S430/106
    • Disclosed is an improved, chemically-amplifying positive resist composition for radiations, especially UV rays, deep-UV rays, excimer laser beams, X-rays, electron beams. The composition comprises (A) a resin component whose solubility in an alkaline aqueous solution is increased by the action of acids, (B) a compound which generates an acid when exposed to radiations, and (A) a resin component, (B) an acid-generating agent and (C) an organic carboxylic acid compound, in which said resin component (A) is a mixture comprising (a) a polyhydroxystyrene where from 10 to 60 mol % of the hydroxyl groups have been substituted by residues of a general formula (I): ##STR1## wherein R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a methyl group or an ethyl group, and R.sup.3 represents a lower alkyl group having 1 to 4 carbon atoms; and (b) a polyhydroxystyrene where from 10 to 60 mol % of the hydroxyl groups have been substituted by tert-butoxycarbonyloxy groups. The composition has a high sensitivity, a high resolution, high heat resistance, good width characteristic in focus depth and good post-exposure storage stability, has good storage stability as a resist solution, and gives resist patterns with good profiles, without depending on the substrate to which it is applied. The composition is useful for forming fine patterns in producing ultra-LSIs.
    • 公开了用于辐射,特别是紫外线,深紫外线,准分子激光束,X射线,电子束的改进的化学增幅正性抗蚀剂组合物。 该组合物包含(A)通过酸的作用在碱性水溶液中的溶解度增加的树脂成分,(B)暴露于辐射时产生酸的化合物,(A)树脂成分,(B) 酸性发生剂和(C)有机羧酸化合物,其中所述树脂组分(A)是包含(a)多羟基苯乙烯的混合物,其中10至60mol%的羟基已被一般的残基取代 式(I):其中R 1表示氢原子或甲基,R 2表示甲基或乙基,R 3表示碳原子数1〜4的低级烷基。 和(b)聚羟基苯乙烯,其中10至60摩尔%的羟基已被叔丁氧羰基氧基取代。 该组合物具有高灵敏度,高分辨率,高耐热性,聚焦深度的良好宽度特性和良好的曝光后储存稳定性,作为抗蚀剂溶液具有良好的储存稳定性,并且具有良好外形的抗蚀剂图案,而不依赖于 底物。 该组合物可用于在制造超LSI时形成精细图案。
    • 6. 发明授权
    • Positive resist composition
    • 正抗蚀剂组成
    • US6159652A
    • 2000-12-12
    • US20408
    • 1998-02-09
    • Mitsuru SatoKazuyuki NittaAkiyoshi YamazakiEtsuko IguchiYoshika SakaiKazufumi SatoToshimasa Nakayama
    • Mitsuru SatoKazuyuki NittaAkiyoshi YamazakiEtsuko IguchiYoshika SakaiKazufumi SatoToshimasa Nakayama
    • G03F7/004G03F7/039
    • G03F7/039G03F7/0045Y10S430/106
    • Disclosed is an improved, chemically-amplifying positive resist composition for radiations, especially UV rays, deep-UV rays, excimer laser beams, X-rays, electron beams. The composition comprises (A) a resin component whose solubility in an alkaline aqueous solution is increased by the action of acids, (B) a compound which generates an acid when exposed to radiations, and (A) a resin component, (B) an acid-generating agent and (C) an organic carboxylic acid compound, in which said resin component (A) is a mixture comprising (a) a polyhydroxystyrene where from 10 to 60 mol % of the hydroxyl groups have been substituted by residues of a general formula (I): ##STR1## wherein R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a methyl group or an ethyl group, and R.sup.3 represents a lower alkyl group having 1 to 4 carbon atoms;and (b) a polyhydroxystyrene where from 10 to 60 mol % of the hydroxyl groups have been substituted by tert-butoxy-carbonyloxy groups. The composition has a high sensitivity, a high resolution, high heat resistance, good width characteristic in focus depth and good post-exposure storage stability, has good storage stability as a resist solution, and gives resist patterns with good profiles, without depending on the substrate to which it is applied. The composition is useful for forming fine patterns in producing ultra-LSIs.
    • 公开了用于辐射,特别是紫外线,深紫外线,准分子激光束,X射线,电子束的改进的化学增幅正性抗蚀剂组合物。 该组合物包含(A)通过酸的作用在碱性水溶液中的溶解度增加的树脂成分,(B)暴露于辐射时产生酸的化合物,(A)树脂成分,(B) 酸性发生剂和(C)有机羧酸化合物,其中所述树脂组分(A)是包含(a)多羟基苯乙烯的混合物,其中10至60mol%的羟基已被一般的残基取代 式(I):其中R1表示氢原子或甲基,R2表示甲基或乙基,R3表示碳原子数1〜4的低级烷基。 和(b)聚羟基苯乙烯,其中10至60摩尔%的羟基已被叔丁氧基 - 羰基氧基取代。 该组合物具有高灵敏度,高分辨率,高耐热性,聚焦深度的良好宽度特性和良好的曝光后储存稳定性,作为抗蚀剂溶液具有良好的储存稳定性,并且具有良好外形的抗蚀剂图案,而不依赖于 底物。 该组合物可用于在制造超LSI时形成精细图案。
    • 7. 发明授权
    • Photoresist laminate and method for patterning using the same
    • 光刻胶层压板和使用其的图案化方法
    • US6083665A
    • 2000-07-04
    • US273262
    • 1999-03-22
    • Mitsuru SatoKatsumi OomoriEtsuko IguchiKiyoshi IshikawaFumitake KanekoToshimasa Nakayama
    • Mitsuru SatoKatsumi OomoriEtsuko IguchiKiyoshi IshikawaFumitake KanekoToshimasa Nakayama
    • G03F7/004G03F7/038G03F7/09G03F7/11H01L21/027H01L21/302H01L21/3065G03F7/40
    • G03F7/091G03F7/0045Y10S430/12Y10S430/122
    • A proposal is made for the photolithographic formation of a patterned resist layer on a substrate without the troubles due to reflection of the exposure light on the substrate surface. Thus, patterning is conducted on a photo-resist laminate comprising (a) a substrate; (b) a specific anti-reflection coating layer formed on one surface of the substrate; and (c) a photoresist layer formed on the anti-reflection coating layer from a specific negative-working chemical-sensitization photoresist composition. The patterning procedure comprises the steps of: (A) exposing, pattern-wise to actinic rays, the photoresist layer of the photoresist laminate; (B) subjecting the photoresist layer to a heat treatment; (C) subjecting the photoresist layer to a development treatment to dissolve away the photoresist layer in the areas unexposed to actinic rays in step (A) so as to expose bare the anti-reflection coating layer in the areas unexposed to the actinic rays leaving a patterned resist layer in the areas exposed to the actinic rays; and (D) removing the pattern-wise exposed anti-reflection coating layer by dry etching with the patterned photoresist layer as a mask.
    • 提出了在基板上的图案化抗蚀剂层的光刻形成,而不会由于基板表面上的曝光光的反射而引起的问题。 因此,在包含(a)基材的光致抗蚀剂层压体上进行图案化; (b)形成在所述基板的一个表面上的特定抗反射涂层; 和(c)由特定的负性化学增感光致抗蚀剂组合物形成在抗反射涂层上的光致抗蚀剂层。 图案化步骤包括以下步骤:(A)以光致抗蚀剂层压板的光致抗蚀剂层将光致抗蚀剂层以图形方式曝光于光化射线; (B)对光致抗蚀剂层进行热处理; (C)在步骤(A)中对光致抗蚀剂层进行显影处理以将光致抗蚀剂层溶解在未暴露于光化射线的区域中,以便露出未暴露于光化离子的区域中的防反射涂层 在暴露于光化射线的区域中的图案化抗蚀剂层; 和(D)通过用图案化的光致抗蚀剂层作为掩模的干蚀刻去除图案化的曝光的抗反射涂层。