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1. 发明专利

JP2015026781A リードフレーム、電力変換装置、半導体装置及び半導体装置の製造方法有权
标题翻译：引线框架，功率转换器件，半导体器件及制造半导体器件的方法
公开(公告)号：JP2015026781A
公开(公告)日：2015-02-05
申请号：JP2013156787
申请日：2013-07-29
申请人：トヨタ自動車株式会社 , Toyota Motor Corp , 株式会社デンソー , Denso Corp
发明人： KADOGUCHI TAKUYA , HIRANO TAKAHIRO , HARADA ARATA , NISHIHATA MASAYOSHI , OKUMURA TOMOMI
IPC分类号： H01L23/50 , H01L23/28
CPC分类号： H01L23/49562 , H01L23/49575 , H01L24/48 , H01L24/85 , H01L24/89 , H01L2224/48247 , H01L2224/85001 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要：【課題】アイランドの間の距離の低減を可能としつつ、モールド成形時のリードの変形を抑制することが出来るリードフレームを提供する。【解決手段】リードフレーム1は、複数個の第1リード100と、複数個の第2リード200と、複数個の第1リード100を横断し、外周枠20と複数個の第1リード100とを連結する第1連結部31と、複数個の第2リード200を横断し、外周枠20と複数個の第2リード200とを連結する第2連結部32と、第1連結部31と第2連結部32との間を連結し、第2方向での延在範囲は第1アイランド11及び第2アイランド12間の所定の空間よりも手前で終端する中間部40と、第1リード100、第2リード200、第1連結部31及び第2連結部32の少なくともいずれかに形成され又は設けられ、モールド成形時の第1リード100及び第2リード200の変形を抑制する変形抑制部511,512とを含む。【選択図】図2
摘要翻译：要解决的问题：提供能够抑制成型时的引线变形的引线框架，同时能够减小岛之间的距离。解决方案：引线框架1包括：多个第一引线100; 多个第二引线200; 与多个第一引线100交叉的第一耦合部31和外周框架20与多个第一引线100之间的联接; 与多个第二引线200交叉的第二耦合部32和外周框架20与多个第二引线200之间的联接; 联接在第一联接部31和第二联接部32之间的中间部40，并且在第二方向上的延伸范围在该侧从第一岛11和第二岛12之间的预定间隔终止; 以及形成或设置在第一引线100，第二引线200，第一连接部31和第二连接部32中的至少任一个上的变形抑制部511,512，以抑制第一引线100和第二引线 200在成型。

2. 发明专利

JP2009224560A Semiconductor device and production method therefor 审中-公开
标题翻译：半导体器件及其生产方法
公开(公告)号：JP2009224560A
公开(公告)日：2009-10-01
申请号：JP2008067426
申请日：2008-03-17
申请人： Denso Corp , 株式会社デンソー
发明人： OKUMURA TOMOMI
IPC分类号： H01L23/36 , H01L21/60
CPC分类号： H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which consists of a semiconductor chip connected to a bonding wire and sandwiched between a pair of heat sinks, and can avoid contact of the bonding wire with heat sinks located at a side of the bonding wire even if an opposite interval between both heat sinks is made narrow without using a block for securing the interval. SOLUTION: The loop-like bonding wire 8 projects in a direction where the bonding wire is detached from one face of the semiconductor chip 1. An opposed faces 3a, opposing one face of the semiconductor chip 1 on a first heat sink 3, is located closer to one face of the semiconductor chip 1 than a top part 8a of the bonding wire 8. An opening part 3d is an opening part opposite to the bonding wire 8 of the opposed faces 3a of the first heat sink 3. A part on the top side 8a of the bonding wire 8 is set in the opening part 3d in the state apart from the first heat sink 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件，其由连接到接合线并且夹在一对散热器之间的半导体芯片组成，并且可以避免接合线与位于一侧散热片侧的散热器的接触即使两个散热器之间的相反间隔变窄，也不使用用于固定间隔的块来实现接合线。解决方案：环状接合线8沿着从半导体芯片1的一个面分离接合线的方向突出。与第一散热器3上的半导体芯片1的一个面相对的相对面3a 位于比接合线8的顶部8a更靠近半导体芯片1的一个面的位置。开口部3d是与第一散热器3的相对面3a的接合线8相对的开口部。接合线8的顶面8a的部分在与第一散热器3分离的状态下设置在开口部3d中。（C）2010，JPO＆INPIT

3. 发明专利

JP2009146950A Semiconductor device, and manufacturing method thereof 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2009146950A
公开(公告)日：2009-07-02
申请号：JP2007320020
申请日：2007-12-11
申请人： Denso Corp , 株式会社デンソー
发明人： MASAMITSU KUNIAKI , OKURA YASUTSUGU , OKUMURA TOMOMI
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To simplify a fixture constitution while eliminating the need for top-bottom inversion after a component setting in a fixture for component assembly is completed, when a semiconductor device is manufactured by setting a first solder, a semiconductor element, a second solder, and a second metal plate mounted in order on one surface of a first metal plate and making respective components to be bonded through solder reflow. SOLUTION: Hole parts 22 are provided at outer peripheral parts of mounting regions R1 and R2 of a semiconductor element 10 and the second metal plate 30 on one surface 21 of the first metal plate 20, and the fixture 200 is prepared which has a through-hole 201 and a projection part 202 projecting from the reverse surface such that a side surface of the projection part 202 and an inner wall of the through-hole 201 are on the same continuous plane. After the first metal plate 20 and fixture 200 are fixed by engaging the projection part 202 with the hole part 22, the first solder 40, semiconductor element 10, second solder 50, and second metal plate 30 are sequentially positioned by the inner wall of the through-hole 201 and mounted. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了简化固定装置结构，同时在部件组装用固定件中的部件设定完成之后，不需要上下倒置，当通过设定第一焊料制造半导体器件时，半导体元件，第二焊料和第二金属板，依次安装在第一金属板的一个表面上，并使各个部件通过焊料回流焊接。解决方案：在第一金属板20的一个表面21上，半导体元件10的安装区域R1和R2的外周部分和第二金属板30上设置有孔部件22，通孔201和从反面突出的突起部202，使得突出部202的侧面和通孔201的内壁在同一连续平面上。在通过将突出部分202与孔部分22接合来固定第一金属板20和固定装置200之后，第一焊料40，半导体元件10，第二焊料50和第二金属板30依次位于通孔201并安装。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008218455A Lead frame and lead frame housing tool 审中-公开
标题翻译：引导框架和引线框架外壳工具
公开(公告)号：JP2008218455A
公开(公告)日：2008-09-18
申请号：JP2007049411
申请日：2007-02-28
申请人： Denso Corp , 株式会社デンソー
发明人： KUSAMA HIROTOSHI , MASAMITSU KUNIAKI , OKUMURA TOMOMI , YAGI KENJI
IPC分类号： H01L23/50 , H01L23/48
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent deformation of the shape of each of bonding wires by preventing the deformation of leads in a lead frame in which a semiconductor chip is attached on an island and the semiconductor chip is wire-bonded with the leads. SOLUTION: A thick reinforcing protrusion 15 is formed on the external circumferential portion of the lead frame 16. The semiconductor chip is mounted on the island (lower terminal 3), and the semiconductor chip is connected to the leads 5 via bonding wires. With this configuration, if a force deforming the lead frame body is applied in handling the lead frame, the reinforcing function of the reinforcing protrusion 15 prevents the actual deformation of the lead frame body 16. The deformation or displacement of the leads 5 is thereby prevented and the deformation of the bonding wires connecting the leads 5 to the semiconductor is also prevented. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止每个接合线的形状的变形，通过防止半导体芯片附着在岛上的引线框架中的引线变形，并且半导体芯片与引线接合。解决方案：在引线框架16的外周部分上形成厚的加强突起15.半导体芯片安装在岛（下端子3）上，并且半导体芯片通过接合线连接到引线5 。通过这种结构，如果在处理引线框架时施加使引线框体变形的力，则加强突起15的加强功能防止引线框体16的实际变形。由此防止引线5的变形或位移并且还防止了将引线5连接到半导体的接合线的变形。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2013021227A Lead frame, semiconductor device, and manufacturing method 有权
标题翻译：引线框架，半导体器件和制造方法
公开(公告)号：JP2013021227A
公开(公告)日：2013-01-31
申请号：JP2011154919
申请日：2011-07-13
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： KADOGUCHI TAKUYA , MIYOSHI TATSUYA , OKUMURA TOMOMI
IPC分类号： H01L23/50
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead frame, a semiconductor device, and a manufacturing method capable of appropriately selecting an application range of a primer.SOLUTION: A lead frame 1 according to the present invention is a lead frame 1 comprising external terminals 2, 6 extending in a predetermined extension direction. The lead frame 1 comprises tapering members 4, 8, in which dimensions in a thickness direction of the lead frame 1 on a vertical line vertical to the extension direction taper down toward a cross section between the vertical line and a profile line viewed from the thickness direction.
摘要翻译：要解决的问题：提供能够适当地选择底漆的涂布范围的引线框架，半导体器件和制造方法。解决方案：根据本发明的引线框架1是引线框架1，其包括沿预定延伸方向延伸的外部端子2,6。引线框架1包括锥形构件4,8，其中引线框架1的垂直于延伸方向的垂直线的厚度方向上的尺寸向下垂直于从垂直线和从厚度方向观察的型材线之间的横截面方向。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2012195363A Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：JP2012195363A
公开(公告)日：2012-10-11
申请号：JP2011056736
申请日：2011-03-15
申请人： Toyota Motor Corp , Denso Corp , トヨタ自動車株式会社 , 株式会社デンソー
发明人： KADOGUCHI TAKUYA , OKUMURA TOMOMI
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a technology which easily forms a heat sink.SOLUTION: A semiconductor module 10 includes heat sinks 14 and semiconductor elements 12 which are adhered to one surface 14e of the heat sink 14. Partial grooves 14a and partially protruding parts 14b are formed on the one surface 14e of the heat sink 14. Each partial groove 14a extends along an outer periphery of the semiconductor element 12. Each partially protruding part 14b extends along the partial groove 14a. Thus, it is possible to reduce the number of groove parts (recessed parts) compared to a case where the outer periphery of the semiconductor element is enclosed by hole-like recessed parts.
摘要翻译：要解决的问题：提供一种容易形成散热器的技术。解决方案：半导体模块10包括粘附到散热器14的一个表面14e的散热器14和半导体元件12.部分凹槽14a和部分突出部分14b形成在散热器14的一个表面14e上每个部分凹槽14a沿着半导体元件12的外周延伸。每个部分突出部分14b沿着部分凹槽14a延伸。因此，与半导体元件的外周被孔状凹部包围的情况相比，能够减少槽部（凹部）的数量。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2010087110A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2010087110A
公开(公告)日：2010-04-15
申请号：JP2008252788
申请日：2008-09-30
申请人： Denso Corp , 株式会社デンソー
发明人： OKUMURA TOMOMI , OKURA YASUTSUGU
IPC分类号： H01L23/40
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the heat dissipation property of a double-sided heat dissipation semiconductor device without increasing the plane size of a heatsink. SOLUTION: A semiconductor device 100 includes a semiconductor element 1; heatsinks 2 and 3 electrically and thermally joined to the front surface and rear surface of the semiconductor element 1, respectively; and cooling devices 9 thermally joined to heat dissipation surfaces 2b and 3b of the heatsinks 2 and 3 which are surfaces opposite to the semiconductor element 1. A projected portion of the semiconductor element 1 on each heat dissipation surface 2b and 3b of each heatsink 2 and 3 is a convex portion 10 projecting toward the cooling devices 9 which face the heat dissipation surfaces 2b and 3b. Meanwhile, a portion of each cooling device 9 which faces the corresponding convex portion 10 is a concave portion 11. Each of the convex portions 10 is engaged with one of the concave portions 11. Between each of the convex portions 10 and one of the concave portions 11, an insulation film 12 is formed to electrically insulate the convex portion 10 and the concave portion 11. The convex portion 10 and the concave portion 11 are in contact with each other via the insulation film 12. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提高双面散热半导体器件的散热性能，而不增加散热片的平面尺寸。解决方案：半导体器件100包括半导体元件1; 散热片2和3分别电连接和热连接到半导体元件1的前表面和后表面; 以及与散热器2和3的与半导体元件1相对的表面的散热面2b和3b热连接的冷却装置9.半导体元件1在每个散热器2的每个散热表面2b和3b上的突出部分和 3是朝向散热面2b，3b的冷却装置9突出的凸部10。同时，每个冷却装置9的与相应的凸部10相对的部分是凹部11.每个凸部10与凹部11中的一个接合。在每个凸部10和凹部部分11，形成绝缘膜12以使凸部10和凹部11电绝缘。凸部10和凹部11经由绝缘膜12彼此接触。版权所有：（C ）2010，JPO＆INPIT

8. 发明专利

JP2009253131A Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：JP2009253131A
公开(公告)日：2009-10-29
申请号：JP2008101133
申请日：2008-04-09
申请人： Denso Corp , 株式会社デンソー
发明人： KUSAMA HIROTOSHI , YAGI KENJI , OKUMURA TOMOMI
IPC分类号： H01L23/48
CPC分类号： H01L24/32 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To mount a semiconductor on a first metal plate without using a positioning tool, in a manufacturing method of a semiconductor device wherein a wire is connected to one surface of a semiconductor element, and a first metal plate and a second metal plate are solder-jointed to the other surface and the one surface of the semiconductor element by a once reflow process. SOLUTION: Guide wires 200 each having a shape extending along the outline of an element mounting region R are previously arranged outside of the element mounting region R being a region for mounting a semiconductor element 10 therein within one surface 31 of a first metal plate 30; and first solder 50, the semiconductor element 10 and second solder 60 are sequentially mounted on the one surface 31 of the first metal plate 30 by using the guide wires 200 as positioning marks. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在不使用定位工具的情况下将半导体安装在第一金属板上的半导体器件的制造方法中，其中线连接到半导体元件的一个表面，以及第一金属板和通过一次回流工艺将第二金属板焊接到另一表面和半导体元件的一个表面。解决方案：具有沿着元件安装区域R的轮廓延伸的形状的引导线200预先布置在作为用于将半导体元件10安装在第一金属的一个表面31内的区域的元件安装区域R的外侧板30; 并且通过使用引导线200作为定位标记，第一焊料50，半导体元件10和第二焊料60依次安装在第一金属板30的一个表面31上。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008141053A Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2008141053A
公开(公告)日：2008-06-19
申请号：JP2006327195
申请日：2006-12-04
申请人： Denso Corp , 株式会社デンソー
发明人： OKUMURA TOMOMI
IPC分类号： H01L21/56 , H01L23/34
CPC分类号： H01L2224/06181 , H01L2224/26175 , H01L2224/32245 , H01L2224/33 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent peeling of a sealant from a molded resin in a method of manufacturing a semiconductor device, wherein after an object in which semiconductor device elements are interposed between a pair of metal plates is sealed with a mold resin, holes formed by pins for fixing the work in a resin sealing process are sealed with a sealant. SOLUTION: The resin sealing process is carried out, wherein pins, each having a level difference at a position that corresponds to the space between the inner faces of the metal plates 3, 4 and is on a side face of the rim facing close to the second metal plate 4, are used as the pins for supporting the work 110, while holes, each having a level difference 11a at a position that corresponds to the level difference of the pin, are formed as the holes 11. In a sealant filling process, the sealant is filled in the holes 11 so as not to exceed the level differences 11a of the holes 11. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止半导体装置的制造方法中的密封剂从模制树脂剥离，其中半导体器件元件插入在一对金属板之间的物体被模制树脂密封由树脂密封工序固定工件的销形成的孔用密封剂密封。解决方案：进行树脂密封处理，其中销在每个在与金属板3,4的内表面之间的空间相对应的位置处具有水平差，并且位于边缘的侧面靠近第二金属板4被用作用于支撑工件110的销，而在与销的水平差对应的位置处具有水平差值11a的孔形成为孔11。密封剂填充过程中，密封剂填充在孔11中，以便不超过孔11的水平差11a。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007103909A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2007103909A
公开(公告)日：2007-04-19
申请号：JP2006175050
申请日：2006-06-26
申请人： Denso Corp , 株式会社デンソー
发明人： OKUMURA TOMOMI , SAKAMOTO ZENJI , HIRANO NAOHIKO , MASAMITSU KUNIAKI
IPC分类号： H01L23/40
CPC分类号： H01L23/051 , H01L23/492 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L23/49562 , H01L23/49575 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2224/83455 , H01L2224/83801 , H01L2224/92147 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/0132 , H01L2224/83 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To suppress to the utmost that the solder in a solder groove provided in a metal plate that is solder-joined to a block gets wet and spreads on the end surface of the block in a both-sided heat-radiating semiconductor device. SOLUTION: Semiconductor elements 1 and 2 are interposed between a pair of metal plates 3 and 4, and a block 6 is interposed between one metal plate 4 and the semiconductor elements 1 and 2. The metal plate 4 and the block 6 are connected through solder 5, and sealed by a molded resin 7. In a semiconductor device with the heat radiating surfaces 3a and 4a of a pair of metal plates 3 and 4 exposed from the molded resin, an annular groove 10 for preventing the spread of the solder 5 is formed at the outer periphery of a region where the solder 5 is arranged in the metal plate 4 that is soldered to the block 6. In the inner side of this groove 10, there is provided a member 10a with the greater wettability of the solder 5 than that of the end surface of the block 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了抑制设置在与块接触的金属板中的焊料槽中的焊料变得湿润并且在双面加热中在块的端面上扩散辐射半导体器件。解决方案：将半导体元件1和2插入在一对金属板3和4之间，并且块6插入在一个金属板4和半导体元件1和2之间。金属板4和块6是通过焊料5连接，并通过模制树脂7密封。在具有从模制树脂暴露的一对金属板3和4的散热表面3a和4a的半导体器件中，用于防止扩散的环形槽10 焊料5形成在焊料5布置在焊接到块6的金属板4中的区域的外周。在该槽10的内侧设置有具有较大润湿性的构件10a 焊料5比块6的端面的焊料5.版权所有：（C）2007，JPO＆INPIT

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