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1. 发明申请

US20060267187A1 Power module package structure 有权
标题翻译：电源模块封装结构
公开(公告)号：US20060267187A1
公开(公告)日：2006-11-30
申请号：US11233578
申请日：2005-09-22
申请人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
发明人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
IPC分类号： H01L23/34
CPC分类号： H01L23/49575 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2924/00012
摘要： A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.
摘要翻译：公开了功率模块封装结构。控制电路制造在电路板上，而不是直接在主衬底上制造。由于基板的尺寸缩小，所以制造成本降低。此外，功率芯片放置在具有高导热性的材料上。从功率芯片产生的热量可以快速传输。因此，可以提高功率模块封装的可靠性。

2. 发明申请

US20060220188A1 Package structure having mixed circuit and composite substrate 审中-公开
标题翻译：具有混合电路和复合衬底的封装结构
公开(公告)号：US20060220188A1
公开(公告)日：2006-10-05
申请号：US11192498
申请日：2005-07-29
申请人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
发明人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/4911 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The present invention provides a package structure, which includes a substrate, wherein the circuit has been configured within the substrate; a lead-frame having lead on the first surface of the substrate; at least one first electronic device located on the lead-frame; a second electronic device located on the first surface of the substrate whose the circuit has been configured therein; a plurality of conductive wires, which used for electrically coupling the first electronic device and second electronic device, and the second electronic device with the lead-frame; a molding compound, which used to seal the portion of substrate, the first electronic device, the second electronic device, and the portion of the lead-frame; and a metal plate, which located on the second surface of the substrate, and used to remove the heat that is generated from the first electronic device.
摘要翻译：本发明提供一种封装结构，其包括基板，其中所述电路已经配置在所述基板内; 引线框架，其在所述基板的第一表面上具有引线; 位于引线框架上的至少一个第一电子设备; 位于基板的第一表面上的第二电子器件，其电路已经配置在其中; 用于将第一电子设备和第二电子设备电耦合的多条导线以及具有引线框架的第二电子设备; 用于密封所述基板的所述部分，所述第一电子设备，所述第二电子设备以及所述引线框架的所述部分的模塑料; 以及金属板，其位于所述基板的第二表面上，并且用于去除从所述第一电子设备产生的热量。

3. 发明申请

US20060284340A1 Method for preventing the overflowing of molding compound during fabricating package device 审中-公开
标题翻译：在制造包装装置期间防止模塑料溢出的方法
公开(公告)号：US20060284340A1
公开(公告)日：2006-12-21
申请号：US11192651
申请日：2005-07-29
申请人： Chun-Tiao Liu , Da-Jung Chen , Jeng-Jen Li , Chun-Liang Lin , Chau Wen
发明人： Chun-Tiao Liu , Da-Jung Chen , Jeng-Jen Li , Chun-Liang Lin , Chau Wen
IPC分类号： B29C45/14
CPC分类号： B29C45/14655 , B29C45/14065 , B29C45/1418 , B29C45/14336 , B29C2045/14131 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method for preventing the overflowing of the molding compound is disclosed. The method provides a substrate that having at least a pair of outer leads. By the pressed downward the pair of outer leads as the thimble point, the substrate can contact with the mold completely without any gap therebetween, thus, the overflowing of the molding compound would not be occurred.
摘要翻译：公开了一种防止模塑料溢出的方法。该方法提供了具有至少一对外引线的基板。通过向下按压一对外引线作为套管点，基板可以完全与模具接触而没有间隙，因此不会发生模塑料的溢流。

4. 发明授权

US07405467B2 Power module package structure 有权
标题翻译：电源模块封装结构
公开(公告)号：US07405467B2
公开(公告)日：2008-07-29
申请号：US11233578
申请日：2005-09-22
申请人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Chieh Hsu , Chau Chun Wen
发明人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Chieh Hsu , Chau Chun Wen
IPC分类号： H01L23/495 , H01L21/00 , H01R9/00 , H01R43/00
CPC分类号： H01L23/49575 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2924/00012
摘要： A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.
摘要翻译：公开了功率模块封装结构。控制电路制造在电路板上，而不是直接在主衬底上制造。由于基板的尺寸缩小，所以制造成本降低。此外，功率芯片放置在具有高导热性的材料上。从功率芯片产生的热量可以快速传输。因此，可以提高功率模块封装的可靠性。

5. 发明申请

US20070096293A1 Package device with electromagnetic interference shield 有权
标题翻译：封装器件带有电磁干扰屏蔽
公开(公告)号：US20070096293A1
公开(公告)日：2007-05-03
申请号：US11336973
申请日：2006-01-23
申请人： Chau Wen , Da-Jung Chen , Chun-Liang Lin , Chih-Chan Day
发明人： Chau Wen , Da-Jung Chen , Chun-Liang Lin , Chih-Chan Day
IPC分类号： H01L23/12 , H01L23/52
CPC分类号： H01L23/3107 , H01L23/36 , H01L23/4334 , H01L23/495 , H01L23/552 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/16152 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.
摘要翻译：本发明提供了一种用于减小电磁/射频干扰的封装装置，其包括在第一基板的下表面上具有屏蔽结构的第一基板和屏蔽结构上的绝缘层。第一基板包括在其中填充有导体的通孔。位于第一基板的底表面上的多个引线框架。位于两个引线框之间的第二基板。然后，封装以覆盖上述结构的模塑料形成包装装置。因此，封装器件的屏蔽路径由多个引线框架，第一基板内的导体，屏蔽结构构成，并且接地以将电磁/射频放出封装器件，因此，电磁可以减少封装器件的射频干扰。

6. 发明授权

US07411278B2 Package device with electromagnetic interference shield 有权
标题翻译：封装器件带有电磁干扰屏蔽
公开(公告)号：US07411278B2
公开(公告)日：2008-08-12
申请号：US11336973
申请日：2006-01-23
申请人： Chau Chun Wen , Da-Jung Chen , Chun-Liang Lin , Chih-Chan Day
发明人： Chau Chun Wen , Da-Jung Chen , Chun-Liang Lin , Chih-Chan Day
IPC分类号： H01L23/552
CPC分类号： H01L23/3107 , H01L23/36 , H01L23/4334 , H01L23/495 , H01L23/552 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/16152 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.
摘要翻译：本发明提供了一种用于减小电磁/射频干扰的封装装置，其包括在第一基板的下表面上具有屏蔽结构的第一基板和屏蔽结构上的绝缘层。第一基板包括在其中填充有导体的通孔。位于第一基板的底表面上的多个引线框架。位于两个引线框之间的第二基板。然后，封装以覆盖上述结构的模塑料形成包装装置。因此，封装器件的屏蔽路径由多个引线框架，第一基板内的导体，屏蔽结构构成，并且接地以将电磁/射频放出封装器件，因此，电磁可以减少封装器件的射频干扰。

7. 发明授权

US08937333B2 White organic light-emitting diode 有权
标题翻译：白色有机发光二极管
公开(公告)号：US08937333B2
公开(公告)日：2015-01-20
申请号：US12883118
申请日：2010-09-15
申请人： Chun-Liang Lin , Chieh-Wei Chen , Chung-Chun Lee
发明人： Chun-Liang Lin , Chieh-Wei Chen , Chung-Chun Lee
IPC分类号： H01L33/00 , H01L27/32
CPC分类号： H01L27/3209
摘要： A white organic light-emitting diode (WOLED) includes a transparent electrode, a blue-complementary light-emitting layer, a translucent electrode, a blue light-emitting layer, and a non-transparent electrode. The blue-complementary light-emitting layer is disposed on the transparent electrode. The transparent electrode and the translucent electrode include a first voltage. The blue light-emitting layer is disposed on the translucent layer. The non-transparent electrode is disposed on the blue light-emitting layer. The translucent electrode and the non-transparent electrode include a second voltage.
摘要翻译：白色有机发光二极管（WOLED）包括透明电极，蓝色互补发光层，透光性电极，蓝色发光层和非透明电极。蓝色互补发光层设置在透明电极上。透明电极和透光电极包括第一电压。蓝色发光层设置在半透明层上。非透明电极设置在蓝色发光层上。半透明电极和非透明电极包括第二电压。

8. 发明申请

US20130082590A1 ORGANIC ELECTROLUMINESCENT LIGHTING ELEMENT ARRAY AND ORGANIC ELECTROLUMINESCENT LIGHTING ELEMENT 有权
标题翻译：有机电致发光元件阵列和有机电致发光照明元件
公开(公告)号：US20130082590A1
公开(公告)日：2013-04-04
申请号：US13330695
申请日：2011-12-20
申请人： Chih-Hung Tsai , Yuan-Chen Chin , Chun-Liang Lin , Chun-Hsiang Fang
发明人： Chih-Hung Tsai , Yuan-Chen Chin , Chun-Liang Lin , Chun-Hsiang Fang
IPC分类号： H05B33/14
CPC分类号： H01L27/3246 , H01L27/3276 , H01L51/5268 , H01L51/5275
摘要： An organic electroluminescent (OEL) lighting element disposed on a substrate includes a first electrode, a second electrode, an OEL layer, an auxiliary electrode, a patterned scattering layer, and a patterned dielectric layer. The second electrode is opposite to the first electrode having a first refraction index. The OEL layer is disposed between the first electrode and the second electrode. The auxiliary electrode is disposed between the first electrode and the second electrode, electrically connected to the first electrode, and separated from the OEL layer by a gap. The patterned scattering layer is disposed between the first electrode and the auxiliary electrode, covers the auxiliary electrode, and has a second refraction index greater than or substantially equal to the first refraction index. The patterned dielectric layer is disposed between the auxiliary electrode and the second electrode, covers the auxiliary electrode, and is disposed between the auxiliary electrode and the OEL layer.
摘要翻译：设置在基板上的有机电致发光（OEL）照明元件包括第一电极，第二电极，OEL层，辅助电极，图案化散射层和图案化电介质层。第二电极与具有第一折射率的第一电极相对。 OEL层设置在第一电极和第二电极之间。辅助电极设置在第一电极和第二电极之间，与第一电极电连接，并且与OEL层隔开间隙。图案化散射层设置在第一电极和辅助电极之间，覆盖辅助电极，并且具有大于或基本上等于第一折射率的第二折射率。图案化电介质层设置在辅助电极和第二电极之间，覆盖辅助电极，并且设置在辅助电极和OEL层之间。

9. 发明申请

US20120160308A1 PHOTOVOLTAIC CELL MODULE 审中-公开
标题翻译：光电池模块
公开(公告)号：US20120160308A1
公开(公告)日：2012-06-28
申请号：US13069420
申请日：2011-03-23
申请人： Hsin-Rong Tseng , Chun-Liang Lin
发明人： Hsin-Rong Tseng , Chun-Liang Lin
IPC分类号： H01L31/06
CPC分类号： H01L27/302
摘要： A photovoltaic cell module includes a substrate, a first photovoltaic cell and a second photovoltaic cell. The substrate has first and second surfaces. The first photovoltaic cell includes a first electrode layer on the first surface, a first active layer covering the first electrode, and a second electrode covering the first active layer, and the first active layer absorbs the light having a first wavelength range. The second photovoltaic cell is serially connected with the first photovoltaic cell and includes a third electrode layer on the second surface, a second active layer covering the third electrode, and a fourth electrode covering the second active layer, and the second active layer absorbs the light having a second wavelength range. A surface of the second electrode layer of the first photovoltaic cell serves as a light incident surface and a surface of the second photovoltaic cell serves as a light reflective surface.
摘要翻译：光伏电池模块包括衬底，第一光伏电池和第二光伏电池。衬底具有第一和第二表面。第一光伏电池包括第一表面上的第一电极层，覆盖第一电极的第一有源层和覆盖第一有源层的第二电极，并且第一有源层吸收具有第一波长范围的光。第二光伏电池与第一光伏电池串联连接，在第二表面上包括第三电极层，覆盖第三电极的第二有源层和覆盖第二有源层的第四电极，第二有源层吸收光具有第二波长范围。第一光电池的第二电极层的表面用作光入射表面，第二光电池的表面用作光反射表面。

10. 发明授权

US08152319B2 Backlight module and liquid crystal display 有权
标题翻译：背光模块和液晶显示屏
公开(公告)号：US08152319B2
公开(公告)日：2012-04-10
申请号：US12474423
申请日：2009-05-29
申请人： Chun-Liang Lin , Ya-Ling Hsu , Ying-Li Wang , Chun-Chieh Wang , Chen-Hsien Liao
发明人： Chun-Liang Lin , Ya-Ling Hsu , Ying-Li Wang , Chun-Chieh Wang , Chen-Hsien Liao
IPC分类号： G09F13/04 , G09F13/08
CPC分类号： G02B5/3025 , G02B5/045 , G02F1/133603 , G02F1/133605 , G02F1/13362 , G02F2001/133545 , G02F2001/133614
摘要： A backlight module and a liquid crystal display are disclosed. In the backlight module having a reflector base, a phosphor layer is disposed on the reflector base, and a plurality of blue light emitting diode (LEDs) are disposed above the reflector base and the phosphor layer for emitting a first light beam. An optical film is disposed above the reflector base, the phosphor layer and the blue LEDs for allowing P-polarized light of the first light beam to pass therethrough and reflecting S-polarized light of the first light beam to the phosphor layer so as to excite the phosphor layer to generate a second light beam of which the wavelengths are different from those of the first light beam. After being reflected to the optical film by the reflector base, the second light beam transmits through the optical film, and mixes with the first light beam to generate white light.
摘要翻译：公开了背光模块和液晶显示器。在具有反射器基座的背光模块中，在反射器基座上设置荧光体层，在反射器基板的上方配置有多个蓝色发光二极管（LED），以及用于发射第一光束的荧光体层。光学膜设置在反射器底部上方，荧光体层和蓝色LED用于允许第一光束的P偏振光通过，并将第一光束的S偏振光反射到荧光体层，以激发所述荧光体层产生波长与所述第一光束的波长不同的第二光束。在通过反射器基底反射到光学膜之后，第二光束透射通过光学膜，并与第一光束混合以产生白光。

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