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1. 发明申请

US20060267187A1 Power module package structure 有权
标题翻译：电源模块封装结构
公开(公告)号：US20060267187A1
公开(公告)日：2006-11-30
申请号：US11233578
申请日：2005-09-22
申请人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
发明人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
IPC分类号： H01L23/34
CPC分类号： H01L23/49575 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2924/00012
摘要： A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.
摘要翻译：公开了功率模块封装结构。控制电路制造在电路板上，而不是直接在主衬底上制造。由于基板的尺寸缩小，所以制造成本降低。此外，功率芯片放置在具有高导热性的材料上。从功率芯片产生的热量可以快速传输。因此，可以提高功率模块封装的可靠性。

2. 发明申请

US20060220188A1 Package structure having mixed circuit and composite substrate 审中-公开
标题翻译：具有混合电路和复合衬底的封装结构
公开(公告)号：US20060220188A1
公开(公告)日：2006-10-05
申请号：US11192498
申请日：2005-07-29
申请人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
发明人： Chun-Tiao Liu , Da-Jung Chen , Chun-Liang Lin , Jeng-Jen Li , Cheng Hsu , Chau Wen
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/4911 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The present invention provides a package structure, which includes a substrate, wherein the circuit has been configured within the substrate; a lead-frame having lead on the first surface of the substrate; at least one first electronic device located on the lead-frame; a second electronic device located on the first surface of the substrate whose the circuit has been configured therein; a plurality of conductive wires, which used for electrically coupling the first electronic device and second electronic device, and the second electronic device with the lead-frame; a molding compound, which used to seal the portion of substrate, the first electronic device, the second electronic device, and the portion of the lead-frame; and a metal plate, which located on the second surface of the substrate, and used to remove the heat that is generated from the first electronic device.
摘要翻译：本发明提供一种封装结构，其包括基板，其中所述电路已经配置在所述基板内; 引线框架，其在所述基板的第一表面上具有引线; 位于引线框架上的至少一个第一电子设备; 位于基板的第一表面上的第二电子器件，其电路已经配置在其中; 用于将第一电子设备和第二电子设备电耦合的多条导线以及具有引线框架的第二电子设备; 用于密封所述基板的所述部分，所述第一电子设备，所述第二电子设备以及所述引线框架的所述部分的模塑料; 以及金属板，其位于所述基板的第二表面上，并且用于去除从所述第一电子设备产生的热量。

3. 发明申请

US20090145010A1 INNER SCATTERING BILLBOARD 审中-公开
标题翻译：内部散射板
公开(公告)号：US20090145010A1
公开(公告)日：2009-06-11
申请号：US11951020
申请日：2007-12-05
申请人： Chao-Fang CHUNG , Yu-Nan Liu , Chung-Ying Yu , Cheng Hsu , Ming-Chun Lin , Yung-Liang Chang , Pei-Yu Hsu
发明人： Chao-Fang CHUNG , Yu-Nan Liu , Chung-Ying Yu , Cheng Hsu , Ming-Chun Lin , Yung-Liang Chang , Pei-Yu Hsu
IPC分类号： G09F13/00
CPC分类号： G09F13/18
摘要： An inner scattering billboard includes a light directing body, an advertising membrane and a light source. The light directing body contains a plurality of light directing particles inside to diffuse and direct light. Thus light rays emitted from the light source into the light directing body are scattered to allow the light directing body to become a planar light source of even luminosity. The advertising membrane has an advertising symbol located on the surface to be evenly illuminated. The billboard can be made thinner. An LED may be adopted as the light source to save electric power and reduce user's operation cost.
摘要翻译：内部散射广告牌包括导光体，广告膜和光源。导光体在内部包含多个导光颗粒以使光线扩散和引导。因此，从光源发射到光导体中的光线被散射，以使得光导体成为均匀亮度的平面光源。广告膜具有位于表面上的均匀照明的广告符号。广告牌可以变薄。可以采用LED作为光源来节省电力，降低用户的运营成本。

4. 发明授权

US07177798B2 Natural language interface using constrained intermediate dictionary of results 有权
标题翻译：自然语言界面使用约束中间词典的结果
公开(公告)号：US07177798B2
公开(公告)日：2007-02-13
申请号：US09861860
申请日：2001-05-21
申请人： Cheng Hsu , Veera Boonjing
发明人： Cheng Hsu , Veera Boonjing
IPC分类号： G06F17/27
CPC分类号： G10L15/18 , G10L15/063
摘要： A method for processing a natural language input provided by a user includes: providing a natural language query input to the user; performing, based on the input, a search of one or more language-based databases; providing, through a user interface, a result of the search to the user; identifying, for the one or more language-based databases, a finite number of database objects; and determining a plurality of combinations of the finite number of database objects. The one or more language-based databases include at least one metadata database including at least one of a group of information types including case information, keywords, information models, and database values.
摘要翻译：用于处理由用户提供的自然语言输入的方法包括：向用户提供自然语言查询输入; 基于输入来执行对一个或多个基于语言的数据库的搜索; 通过用户界面向用户提供搜索结果; 为一个或多个基于语言的数据库识别有限数量的数据库对象; 以及确定所述有限数量的数据库对象的多个组合。一个或多个基于语言的数据库包括至少一个元数据数据库，其包括包括案例信息，关键字，信息模型和数据库值的一组信息类型中的至少一个。

5. 发明申请

US20070295953A1 Germanium phototransistor with floating body 有权
标题翻译：具有浮体的锗光电晶体管
公开(公告)号：US20070295953A1
公开(公告)日：2007-12-27
申请号：US11891574
申请日：2007-08-10
申请人： Jong-Jan Lee , Cheng Hsu , Jer-Shen Maa , Douglas Tweet
发明人： Jong-Jan Lee , Cheng Hsu , Jer-Shen Maa , Douglas Tweet
IPC分类号： H01L31/00
CPC分类号： H01L31/1136 , H01L31/028 , H01L31/1808 , Y02E10/547
摘要： A floating body germanium (Ge) phototransistor and associated fabrication process are presented. The method includes: providing a silicon (Si) substrate; selectively forming an insulator layer overlying the Si substrate; forming an epitaxial Ge layer overlying the insulator layer using a liquid phase epitaxy (LPE) process; forming a channel region in the Ge layer; forming a gate dielectric, gate electrode, and gate spacers overlying the channel region; and, forming source/drain regions in the Ge layer. The LPE process involves encapsulating the Ge with materials having a melting temperature greater than a first temperature, and melting the Ge using a temperature lower than the first temperature. The LPE process includes: forming a dielectric layer overlying deposited Ge; melting the Ge; and, in response to cooling the Ge, laterally propagating an epitaxial growth front into the Ge from an underlying Si substrate surface.
摘要翻译：提出了一种浮体锗（Ge）光电晶体管及其制造工艺。该方法包括：提供硅（Si）衬底; 选择性地形成覆盖Si衬底的绝缘体层; 使用液相外延（LPE）工艺形成覆盖绝缘体层的外延Ge层; 在Ge层中形成沟道区; 形成覆盖所述沟道区的栅极电介质，栅电极和栅极间隔; 并且在Ge层中形成源/漏区。 LPE工艺包括用具有大于第一温度的熔化温度的材料包封Ge，并且使用低于第一温度的温度来熔化Ge。 LPE工艺包括：形成覆盖沉积Ge的介电层; 融化Ge; 并且响应于冷却Ge，将外延生长前沿从下面的Si衬底表面横向传播到Ge中。

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