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1. 发明授权

US09345132B2 Substrate structure and the process manufacturing the same 有权
标题翻译：基板结构和工艺制造相同
公开(公告)号：US09345132B2
公开(公告)日：2016-05-17
申请号：US13761172
申请日：2013-02-07
申请人： Yu-Ru Chang , Yu-Fang Hsia , Ling-Chih Chou
发明人： Yu-Ru Chang , Yu-Fang Hsia , Ling-Chih Chou
IPC分类号： H05K1/03 , H05K1/02 , H01L23/498 , H01L23/60
CPC分类号： H05K1/0298 , H01L23/49822 , H01L23/49838 , H01L23/60 , H01L2924/0002 , H05K1/0286 , H05K1/11 , H05K1/18 , H05K3/10 , H05K3/22 , H05K3/4694 , H05K2201/09127 , H05K2201/09972 , H05K2203/0228 , Y10T29/49155 , H01L2924/00
摘要： The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the invention can achieve multiple substrate functions without impacting the customer's PCB or system board design and provide cost effective and fast cycle time for engineering development phase.
摘要翻译：本发明公开了一种封装基板布局设计，以实现用于工程开发和验证的多个基板功能。衬底布局包含连接到封装衬底上的多个电源/接地区域的连接结构。通过封装基板上切割线的不同组合，本发明可以实现多种基板功能，而不会影响客户的PCB或系统板设计，并为工程开发阶段提供成本效益和快速的周期时间。

2. 发明申请

US20140216802A1 SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME 有权
标题翻译：基板结构及其制造方法
公开(公告)号：US20140216802A1
公开(公告)日：2014-08-07
申请号：US13761172
申请日：2013-02-07
申请人： Yu-Ru Chang , Yu-Fang Hsia , Ling-Chih Chou
发明人： Yu-Ru Chang , Yu-Fang Hsia , Ling-Chih Chou
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K1/0298 , H01L23/49822 , H01L23/49838 , H01L23/60 , H01L2924/0002 , H05K1/0286 , H05K1/11 , H05K1/18 , H05K3/10 , H05K3/22 , H05K3/4694 , H05K2201/09127 , H05K2201/09972 , H05K2203/0228 , Y10T29/49155 , H01L2924/00
摘要： The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the invention can achieve multiple substrate functions without impacting the customer's PCB or system board design and provide cost effective and fast cycle time for engineering development phase.
摘要翻译：本发明公开了一种封装基板布局设计，以实现用于工程开发和验证的多个基板功能。衬底布局包含连接到封装衬底上的多个电源/接地区域的连接结构。通过封装基板上切割线的不同组合，本发明可以实现多种基板功能，而不会影响客户的PCB或系统板设计，并为工程开发阶段提供成本效益和快速的周期时间。

3. 发明授权

US08748209B2 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same 有权
标题翻译：用于实现倒装芯片型电连接而不使用引线接合工艺的半导体芯片封装结构及其制造方法
公开(公告)号：US08748209B2
公开(公告)日：2014-06-10
申请号：US13150299
申请日：2011-06-01
申请人： Bily Wang , Hung-Chou Yang , Jeng-Ru Chang
发明人： Bily Wang , Hung-Chou Yang , Jeng-Ru Chang
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/48 , H01L24/96 , H01L33/62 , H01L2224/04042 , H01L2224/05599 , H01L2224/24137 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现倒装芯片电连接的半导体芯片封装结构包括封装单元，半导体芯片，第一绝缘层，第一导电层，第二绝缘层和第二导电层。包装单元具有接收槽。半导体芯片被容纳在接收槽中并且具有设置在其顶表面上的多个导电焊盘。第一绝缘层形成在导电焊盘之间以使导电焊盘绝缘。第一导电层形成在第一绝缘层和封装单元上，并且每个第一导电层的一侧电连接到相应的导电焊盘。第二绝缘层形成在第一导电层之间，以使第一导电层彼此绝缘。第二导电层分别形成在第一导电层的另一相对侧上。

4. 发明申请

US20130221542A1 Functional Spacer for SIP and Methods for Forming the Same 有权
标题翻译： SIP功能间隔器及其形成方法
公开(公告)号：US20130221542A1
公开(公告)日：2013-08-29
申请号：US13405018
申请日：2012-02-24
申请人： Yu-Ru Chang , Chung-Kai Wang , Ming-Che Wu
发明人： Yu-Ru Chang , Chung-Kai Wang , Ming-Che Wu
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L24/97 , H01L21/308 , H01L21/78 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L23/552 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/0231 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48464 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/8385 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06537 , H01L2225/06572 , H01L2924/00014 , H01L2924/10253 , H01L2924/15156 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.
摘要翻译：一种装置包括间隔件，其包括从隔离件的顶表面延伸到间隔件中的凹部，以及包括连续地连接到第一部分的第一部分和第二部分的导电特征。第一部分延伸到凹槽中。第二部分位于间隔物的顶表面上。模具附接到间隔件，并且第一模具的下部延伸到凹部中。

5. 发明授权

US08198538B2 Capacitor devices having multi-sectional conductors 有权
标题翻译：具有多段导体的电容器件
公开(公告)号：US08198538B2
公开(公告)日：2012-06-12
申请号：US12392272
申请日：2009-02-25
申请人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Huey-Ru Chang , Ray-Fong Hong
发明人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Huey-Ru Chang , Ray-Fong Hong
IPC分类号： H05K1/09
CPC分类号： H05K1/162 , H01G4/228 , H01G4/248 , H01G4/33 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H05K1/112 , H05K2201/09309 , H05K2201/09663 , H05K2201/09736 , H05K2201/09845 , H05K2201/10674
摘要： A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.
摘要翻译：提供了一种电容器件。该电容性装置包括第一电极和第一电极之下并与第一电极间隔开的第二电极，其中第一电极和第二电极中的至少一个包括多个导电步骤部分，所述多个导电步骤部分具有不同的高度电容性装置还包括在第一电极和第二电极之间的绝缘区域; 以及形成在第一电极和第二电极之一上的至少一个槽。

6. 发明申请

US20100102134A1 METHOD FOR PRODUCING CODE PATTERNS, AND CODE PATTERNS 审中-公开
标题翻译：生成代码模式的方法和代码模式
公开(公告)号：US20100102134A1
公开(公告)日：2010-04-29
申请号：US12350769
申请日：2009-01-08
申请人： Cheng-Ru Chang , Wei-Kuo Mai
发明人： Cheng-Ru Chang , Wei-Kuo Mai
IPC分类号： G06K19/06
CPC分类号： G06K19/06046 , G06K19/06037
摘要： A plurality of code patterns including at least two code patterns is provided. The code patterns represent identical information. Adjacent ones of the code patterns of the code patterns meet at an angle. The code patterns at least reduce visual impact.
摘要翻译：提供了包括至少两个代码模式的多个代码模式。代码模式表示相同的信息。代码模式的相邻代码模式以某种角度相遇。代码模式至少减少视觉冲击。

7. 发明申请

US20090267704A1 CAPACITOR DEVICES WITH A FILTER STRUCTURE 有权
标题翻译：具有滤波器结构的电容器件
公开(公告)号：US20090267704A1
公开(公告)日：2009-10-29
申请号：US12395065
申请日：2009-02-27
申请人： Huey-Ru CHANG , Min-Lin Lee , Jiin-Shing Perng , Sheng-Che Hung , Shinn-Juh Lai
发明人： Huey-Ru CHANG , Min-Lin Lee , Jiin-Shing Perng , Sheng-Che Hung , Shinn-Juh Lai
IPC分类号： H03H7/01
CPC分类号： H03H1/02 , H01G4/40 , H05K1/0231 , H05K1/0233 , H05K1/162 , H05K1/165 , H05K1/181 , H05K1/185 , H05K2201/1006
摘要： A capacitor device is provided. The capacitor device includes at least one capacitor. The capacitor device also includes a first capacitor and a first filter coupling the first capacitor and a conductive region, wherein the first capacitor has a first resonance frequency and the first filter is configured to operate at a first frequency band covering the first resonance frequency.
摘要翻译：提供电容器装置。电容器装置包括至少一个电容器。电容器装置还包括第一电容器和耦合第一电容器和导电区域的第一滤波器，其中第一电容器具有第一谐振频率，并且第一滤波器被配置为在覆盖第一谐振频率的第一频带上操作。

8. 发明授权

US07259034B2 Self-alignment manufacturing method of the microlens and the aperture using in optical devices 有权
标题翻译：微透镜的自对准制造方法和光学器件中使用的孔径
公开(公告)号：US07259034B2
公开(公告)日：2007-08-21
申请号：US11052875
申请日：2005-02-09
申请人： Yi Chiu , Wen Syang Hsu , Yu-Ru Chang
发明人： Yi Chiu , Wen Syang Hsu , Yu-Ru Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , H01L27/14627 , H01L31/02327
摘要： The present invention discloses a self-alignment manufacturing method of a microlens and an aperture using in an optical device. The method manufactures the aperture and the circular opening in the opaque film on a transparent substrate, and utilizes the self-alignment backside exposure technology to precisely integrate the aperture and the microlens made by macromolecule material without any combination step. The claimed method is simpler than conventional technology and can precisely align and integrate the microlens and the aperture with a continuous batch manufacture. Since the aperture and the circular opening are concentric circles and formed in same step, the microlens and the aperture can be precisely aligned with the backside exposure. The claimed invention can effectively improve the optical resolution and efficiency of the optical access and measurement devices.
摘要翻译：本发明公开了一种在光学装置中使用的微透镜和孔径的自对准制造方法。该方法在透明基板上制造不透明膜中的孔径和圆形开口，并利用自对准背面曝光技术精确地将孔径和由大分子材料制成的微透镜整合，而无需任何组合步骤。要求保护的方法比常规技术简单，并且可以通过连续批量制造精确对准和整合微透镜和孔。由于光圈和圆形开口是同心圆并且在同一步骤中形成，因此微透镜和光圈可以与背面曝光精确对准。所要求保护的发明可以有效地提高光学接入和测量装置的光学分辨率和效率。

9. 发明申请

US20070117247A1 Manufacturing method of microstructure 审中-公开
标题翻译：微观结构的制造方法
公开(公告)号：US20070117247A1
公开(公告)日：2007-05-24
申请号：US11594116
申请日：2006-11-08
申请人： Hsin-Chang Tsai , Yu-Ru Chang , Tai-Kang Shing
发明人： Hsin-Chang Tsai , Yu-Ru Chang , Tai-Kang Shing
IPC分类号： H01L21/00
CPC分类号： G03F7/70375 , G03F7/70275
摘要： A manufacturing method of a microstructure includes the steps of: providing a substrate; forming a photoresist layer on the substrate; providing a first mask, which has at least one opaque area and at least one first lens, over the photoresist layer; providing a light source for illuminating the photoresist layer through the first mask; removing a portion of the photoresist layer to form at least one recess having a lateral wall, a depth and a width. An inclined angle of the lateral wall is not less than 5 degrees and the ratio of the depth to the width is not less than 2.
摘要翻译：微结构的制造方法包括以下步骤：提供基板; 在基板上形成光致抗蚀剂层; 在所述光致抗蚀剂层上提供具有至少一个不透明区域和至少一个第一透镜的第一掩模; 提供用于通过所述第一掩模照射所述光致抗蚀剂层的光源; 去除光致抗蚀剂层的一部分以形成具有侧壁，深度和宽度的至少一个凹部。侧壁的倾斜角度不小于5度，深度与宽度之比不小于2。

10. 发明申请

US20050191627A1 Enzymes 审中-公开
标题翻译：酶
公开(公告)号：US20050191627A1
公开(公告)日：2005-09-01
申请号：US10491183
申请日：2002-09-26
申请人： Junming Yang , Aina Dyung Lu , Henry Yue , Vicki Elliott , Bridget Warren , Brendan Duggan , Ian Forsythe , Ernestine Lee , April Hafalia , Jayalaxmi Ramkumar , Narinder Chawla , Mariah Baughn , Shanya Becha , Ann Gorvad , Uyen Tran , Joana Li , Monique Yao , Craig Ison , Jennifer Griffin , Soo Lee , Hsin-Ru Chang , Brooke Emerling , Tom Tang , Preeti Lal , Amy Kable , Joseph Marquis , Xin Jiang , Alan Jackson , Yeganeh Zebarjadian , Anita Swarnakar , Amy Wilson , Pei Jin , Thomas Richardson , Umesh Bhatia , John Burrill , Sally Lee , Julie Blake , Anne Ho , Wenjin Zheng , Jin Gao
发明人： Junming Yang , Aina Dyung Lu , Henry Yue , Vicki Elliott , Bridget Warren , Brendan Duggan , Ian Forsythe , Ernestine Lee , April Hafalia , Jayalaxmi Ramkumar , Narinder Chawla , Mariah Baughn , Shanya Becha , Ann Gorvad , Uyen Tran , Joana Li , Monique Yao , Craig Ison , Jennifer Griffin , Soo Lee , Hsin-Ru Chang , Brooke Emerling , Tom Tang , Preeti Lal , Amy Kable , Joseph Marquis , Xin Jiang , Alan Jackson , Yeganeh Zebarjadian , Anita Swarnakar , Amy Wilson , Pei Jin , Thomas Richardson , Umesh Bhatia , John Burrill , Sally Lee , Julie Blake , Anne Ho , Wenjin Zheng , Jin Gao
IPC分类号： C07H21/04 , C12N9/00 , C12Q1/68 , G01N33/53
CPC分类号： C12N9/00
摘要： Various embodiments of the invention provide human enzymes (ENZM) and polynucleotides which identify and encode ENZM. Embodiments of the invention also provide expression vectors, host cells, antibodies, agonists, and antagonists. Other embodiments provide methods for diagnosing, treating, or preventing disorders associated with aberrant expression of ENZM.
摘要翻译：本发明的各种实施方案提供了识别和编码ENZM的人类酶（ENZM）和多核苷酸。本发明的实施方案还提供表达载体，宿主细胞，抗体，激动剂和拮抗剂。其他实施方案提供用于诊断，治疗或预防与ENZM异常表达相关的紊乱的方法。

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