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1. 发明授权

US5868305A Jet soldering system and method 失效
标题翻译：射流焊接系统及方法
公开(公告)号：US5868305A
公开(公告)日：1999-02-09
申请号：US935525
申请日：1997-09-22
申请人： Hal G. Watts, Jr. , Robert J. Balog , Gary T. Freeman
发明人： Hal G. Watts, Jr. , Robert J. Balog , Gary T. Freeman
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： H05K3/3457 , B23K3/0607 , B23K2201/42 , H05K2203/013
摘要： An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and a gas-delivery system associated with the solder ejector. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines an orifice for producing a stream of molten solder droplets along a selected trajectory relative to the substrate support to deposit molten solder onto the substrate in a selected pattern. The gas delivery system has an input for receiving pressurized inert gas and an output aligned with the directed stream of molten droplets for discharging from the orifice of the solder ejector a flow of inert gas aligned with the ejected molten solder droplets. A method for depositing a selected pattern of solder onto a substrate is also described.
摘要翻译：一种用于将选择的焊料图案沉积到包括衬底支撑件，焊料喷射器和与焊料喷射器相关联的气体输送系统的衬底上的装置。衬底支撑件具有用于承载要在其上安装一个或多个电子部件的衬底的结构。焊料喷射器具有壳体，其限定出孔口，用于沿着相对于衬底支撑件的选定轨迹产生熔融焊料液流，以将选定图案中的熔融焊料沉积到衬底上。气体输送系统具有用于接收加压惰性气体的输入和与熔融液滴的定向流对准的输出，用于从焊料喷射器的孔排出与喷出的熔融焊料液滴对准的惰性气体流。还描述了将选择的焊料图案沉积到衬底上的方法。

2. 发明授权

US5947022A Apparatus for dispensing material in a printer 失效
标题翻译：用于在打印机中分配材料的装置
公开(公告)号：US5947022A
公开(公告)日：1999-09-07
申请号：US966057
申请日：1997-11-07
申请人： Gary T. Freeman , Robert J. Balog , Mark Rossmeisl
发明人： Gary T. Freeman , Robert J. Balog , Mark Rossmeisl
IPC分类号： B23K3/06 , H05K3/12 , H05K3/34 , B05C17/04
CPC分类号： H05K3/1233 , B23K3/0607 , B23K3/0692 , H05K2203/0126 , H05K2203/0783 , H05K2203/1105 , H05K3/3484
摘要： A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device having a number of perforations arranged to form the pattern, a support apparatus that supports the substrate in a printing position, and a material dispenser having a substantially cylindrical chamber to contain the viscous material. The chamber has an opening through which the material is dispensed. The material dispenser is positioned over the device and constructed and arranged to dispense the viscous material through the perforations in the device onto the substrate. In embodiments of the present invention, the material dispenser is adapted to receive standard cartridges containing the viscous material, and the printer further includes a pressurized air source for forcing the viscous material from the cartridges into the material dispenser and from the material dispenser through the perforations on the device and onto the substrate.
摘要翻译：一种在基板上形成图案的预定位置印刷粘性材料的打印机。打印机包括框架，具有布置成形成图案的多个穿孔的装置，在打印位置支撑基板的支撑装置以及具有基本上圆柱形的腔室以容纳粘性材料的材料分配器。该室具有一个开口，材料通过该开口分配。材料分配器定位在装置上方并构造和布置成将粘性材料通过装置中的穿孔分配到基底上。在本发明的实施例中，材料分配器适于容纳包含粘性材料的标准盒，并且打印机还包括加压空气源，用于迫使来自盒的粘性材料进入材料分配器，并且从材料分配器通过穿孔在设备上和衬底上。

3. 发明授权

US5669970A Stencil apparatus for applying solder paste 失效
标题翻译：用于涂抹焊膏的模板装置
公开(公告)号：US5669970A
公开(公告)日：1997-09-23
申请号：US458710
申请日：1995-06-02
申请人： Robert J. Balog , David P. Prince
发明人： Robert J. Balog , David P. Prince
IPC分类号： B05C17/06 , B41C1/14 , B41N1/24 , H05K3/12 , B05C1/00
CPC分类号： B05C17/06 , B41C1/14 , B41N1/24 , H05K3/1225
摘要： A stencil for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said stencil including a sheet having holes therethrough in a pattern corresponding to the desired pattern, a smooth upper surface for receiving the solder paste thereon, and a smooth lower surface for contacting the surface of the circuit board, the upper surface having relieved portions so as to increase the friction between the upper surface and the solder paste being squeegeed thereover.
摘要翻译：一种用于以期望的图案施加焊膏以将电子部件安装在电路板的表面上的模板，所述模板包括具有穿过其中的孔的片材，其中图案对应于所需图案，用于在其上接收焊膏的光滑的上表面，以及用于与电路板的表面接触的光滑的下表面，上表面具有释放部分，以便增加上表面和焊膏之间的摩擦。

4. 发明授权

US5938102A High speed jet soldering system 失效
标题翻译：高速喷射焊接系统
公开(公告)号：US5938102A
公开(公告)日：1999-08-17
申请号：US583641
申请日：1996-01-05
申请人： Eric Phillip Muntz , Melissa E. Orme-Marmarelis , Gerald C. Pham-Van-Diep , Robert J. Balog
发明人： Eric Phillip Muntz , Melissa E. Orme-Marmarelis , Gerald C. Pham-Van-Diep , Robert J. Balog
IPC分类号： B23K3/06 , H05K3/12 , H05K3/34 , B23K3/00
CPC分类号： H05K3/3457 , B23K3/0607 , B23K3/0623 , B22F2009/0836 , B23K2201/40 , B23K2201/42 , H05K2203/013 , H05K3/1241 , H05K3/125
摘要： Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.
摘要翻译：将选定的焊点图案沉积到要安装一个或多个电子部件的基板上，将基板安装在基板支撑件上并沿着扫描轴线相对于焊料喷射器移动，液滴沿风扇轴线偏转通过选择性地施加电荷并使带电的液滴通过电场而横向于扫描轴。

5. 发明申请

US20080271092A1 Methods and apparatus for controlling a satellite antenna 审中-公开
标题翻译：用于控制卫星天线的方法和装置
公开(公告)号：US20080271092A1
公开(公告)日：2008-10-30
申请号：US11789659
申请日：2007-04-25
申请人： Martin A. Kits van Heyningen , Robert J. Balog , Richard F. Driscoll
发明人： Martin A. Kits van Heyningen , Robert J. Balog , Richard F. Driscoll
IPC分类号： H04N7/20
CPC分类号： H04N7/20 , H04H40/90
摘要： Methods and apparatus are provided for issuing instructions to a satellite antenna configured to receive a transmission from any of a group of satellites and to provide a signal to a receiver. In accordance with one embodiment, the receiver is queried (e.g., by a control module, which in one embodiment is a device equipped with a microprocessor and memory storing instructions defining the query) to determine information relating to a channel selected by a user. Based on the information, a determination is made whether the antenna should receive a transmission from a satellite other than a currently selected satellite. If so, the antenna is instructed (e.g., by the control module) to locate the other satellite. In another embodiment, methods and apparatus are provided for use in systems having multiple receivers, including one master receiver coupled to the antenna and one or more other slave receivers which do not issue instructions to the antenna. In accordance with this embodiment, a determination is made whether a user of a slave receiver has selected a channel provided by a transmission from a satellite other than a currently selected satellite, and if so, the antenna is caused (e.g., by a control module coupled to the slave receiver) to locate the other satellite.
摘要翻译：提供了方法和装置，用于向配置成从一组卫星中的任何一个接收传输的卫星天线发出指令，并向接收机提供信号。根据一个实施例，查询接收机（例如，通过控制模块，其在一个实施例中是装备有微处理器的设备和存储定义查询的指令的存储器），以确定与由用户选择的频道有关的信息。基于该信息，确定天线是否应当从除当前选择的卫星以外的卫星接收传输。如果是这样，则指示天线（例如，由控制模块）定位另一颗卫星。在另一个实施例中，方法和装置被提供用于具有多个接收机的系统中，包括耦合到天线的一个主接收机和不向天线发出指令的一个或多个其他从接收机。根据本实施例，确定从接收机的用户是否从由当前选择的卫星以外的卫星发送的信道中选择了一个信道，如果是，则引起天线（例如，由控制模块耦合到从接收机）以定位另一卫星。

6. 发明授权

US06572702B1 High speed electronic assembly system and method 失效
标题翻译：高速电子组装系统及方法
公开(公告)号：US06572702B1
公开(公告)日：2003-06-03
申请号：US09745324
申请日：2000-12-21
申请人： Gary T. Freeman , Ronald C. Lasky , Robert J. Balog , Joseph Belmonte , Thomas C. Prentice , Brian P. Prescott
发明人： Gary T. Freeman , Ronald C. Lasky , Robert J. Balog , Joseph Belmonte , Thomas C. Prentice , Brian P. Prescott
IPC分类号： B05C1100
CPC分类号： B23P21/004 , H05K3/00 , H05K3/0091 , H05K3/1216 , H05K3/1241 , H05K13/00 , H05K13/0069
摘要： Aspects of the present invention are directed to methods and apparatus for producing substrates, including printed circuit boards, in production lines. In one aspect, the present invention provides a production system, a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use is production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.
摘要翻译：本发明的方面涉及生产线中用于制造包括印刷电路板的基底的方法和装置。一方面，本发明提供了一种生产系统，多条生产线，其中来自一条生产线的机器可用于替代其它生产线之一的机器。另一方面，本发明提供一种用于电路板生产线的印刷系统。打印系统包括第一打印机，第二打印机和传送站。另一方面，本发明提供一种用于生产线的分配系统。分配系统包括允许在多个电路板上并行处理的梭式输送机系统。

7. 发明授权

US06276589B1 Jet soldering system and method 失效
标题翻译：射流焊接系统及方法
公开(公告)号：US06276589B1
公开(公告)日：2001-08-21
申请号：US08724034
申请日：1996-09-23
申请人： Hal G. Watts, Jr. , Melissa E. Orme-Marmarelis , Eric Phillip Muntz , Gerald C. Pham-Van-Diep , Robert F. Smith, Jr. , Robert J. Balog , Gary T. Freeman
发明人： Hal G. Watts, Jr. , Melissa E. Orme-Marmarelis , Eric Phillip Muntz , Gerald C. Pham-Van-Diep , Robert F. Smith, Jr. , Robert J. Balog , Gary T. Freeman
IPC分类号： B23K306
CPC分类号： H05K3/3457 , B22F2009/0836 , B23K3/0607 , B23K3/0623 , B23K2101/40 , H05K2203/013
摘要： An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.
摘要翻译：一种用于将选择的焊料图案沉积到包括衬底支撑件，焊料喷射器和孔口限定结构的衬底上的装置。衬底支撑件具有用于承载要在其上安装一个或多个电子部件的衬底的结构。焊料喷射器具有限定用于容纳熔融焊料的空腔的壳体。孔口限定结构包括具有限定在其中的孔口的扁平盘，用于产生熔融焊料流;以及圆盘支撑结构，其支撑围绕孔口的盘，并且可更换地联接到空腔限定结构。还公开了一种将选择的焊料图案沉积到衬底上并且包括衬底支撑件的焊接喷射器，将焊膏引导到支撑件上的期望位置的喷射器对准器，其将焊料喷射器的取向调整为两个角度能够调节熔融焊料液滴流的轨迹的尺寸。

8. 发明授权

US06264090B1 High speed jet soldering system 有权
标题翻译：高速喷射焊接系统
公开(公告)号：US06264090B1
公开(公告)日：2001-07-24
申请号：US09246229
申请日：1999-02-08
申请人： Eric Phillip Muntz , Melissa E. Orme-Marmarelis , Gerald C. Pham-Van-Diep , Robert J. Balog
发明人： Eric Phillip Muntz , Melissa E. Orme-Marmarelis , Gerald C. Pham-Van-Diep , Robert J. Balog
IPC分类号： B23K3102
CPC分类号： H05K3/3457 , B22F2009/0836 , B23K3/0607 , B23K3/0623 , B23K2101/40 , B23K2101/42 , H05K3/1241 , H05K3/125 , H05K2203/013
摘要： Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.
摘要翻译：将选定的焊点图案沉积到要安装一个或多个电子部件的基板上，将基板安装在基板支撑件上并沿着扫描轴线相对于焊料喷射器移动，液滴沿风扇轴线偏转通过选择性地施加电荷并使带电的液滴通过电场而横向于扫描轴。

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