专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2006261187A Method of manufacturing substrate with built-in component 审中-公开
标题翻译：使用内置组件制造衬底的方法
公开(公告)号：JP2006261187A
公开(公告)日：2006-09-28
申请号：JP2005072694
申请日：2005-03-15
申请人： Multi:Kk , Oki Electric Ind Co Ltd , 株式会社マルチ , 沖電気工業株式会社
发明人： KOIWA ICHIRO , WATANABE MITSUHIRO
IPC分类号： H01L23/12 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate with a built-in component which can be connected to a built-in chip without conducting laser processing and via plating.
SOLUTION: A wiring pattern 11a is formed on a copper substrate (for example, clad foil) 10, and the chip 20 which is a thin electronic component is mounted on the wiring pattern 11a. Next, with the chip 20 and a thermosetting resin member (prepreg) 30 interposed between the clad foil 10 and an inner layer material 40, the clad foil 10 and the inner layer material 40 are pressurized by heating to embed and stack the chip 20 inside the prepreg 30. Thereafter, the clad foil 10 is patterned to electrically connect the chip 20 and the inner layer material 40.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有内置部件的基板的制造方法，所述内置部件可以连接到内置芯片而不进行激光加工和通孔电镀。解决方案：布线图案11a形成在铜基板（例如，复合箔）10上，并且作为薄电子部件的芯片20安装在布线图案11a上。接下来，利用芯片20和插入在包层箔10和内层材料40之间的热固性树脂构件（预浸料坯）30，通过加热对复合箔10和内层材料40进行加压，将芯片20嵌入并堆叠此后，将复合箔10图案化以将芯片20和内层材料40电连接。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006093419A Semiconductor device and its mounting method 审中-公开
标题翻译：半导体器件及其安装方法
公开(公告)号：JP2006093419A
公开(公告)日：2006-04-06
申请号：JP2004277282
申请日：2004-09-24
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Multi:Kk , Oki Electric Ind Co Ltd , Univ Waseda , 学校法人早稲田大学 , 株式会社マルチ , 株式会社関東学院大学表面工学研究所 , 沖電気工業株式会社
发明人： KOIWA ICHIRO , ASHIKAGA KINYA , WATANABE MITSUHIRO , AISAKA TETSUYA , HONMA HIDEO
IPC分类号： H01L21/60
CPC分类号： H01L24/02 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor device for inexpensively mounting a chip on a mounted substrate of a semiconductor without increasing a mounting area. SOLUTION: The mounted substrate 210 is prepared and a capacitor chip 200 where a high dielectric capacitor is formed is prepared as a semiconductor chip where two or more elements are formed. The semiconductor chip is laminated on the mounted substrate. Conductive terminals 90 formed to the semiconductor chip and the mounted substrate are connected by wire bonding. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于在不增加安装面积的情况下将芯片廉价地安装在半导体的安装的基板上的半导体器件的安装方法。解决方案：准备安装的基板210，并且准备形成高介电电容器的电容器芯片200作为形成两个或更多个元件的半导体芯片。将半导体芯片层叠在安装的基板上。形成于半导体芯片和安装基板的导电端子90通过引线接合连接。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2007036172A Multilayer circuit board 审中-公开
标题翻译：多层电路板
公开(公告)号：JP2007036172A
公开(公告)日：2007-02-08
申请号：JP2005342569
申请日：2005-11-28
申请人： Multi:Kk , Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , 株式会社マルチ
发明人： YAMANAKA HIROYUKI , TAKAHASHI YOSHITO , KANAI ATSUSHI , WATANABE MITSUHIRO
IPC分类号： H05K3/46 , H01L23/12 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To obtain a highly reliable multilayer circuit board in which heat collected by a heat conduction material can be dissipated efficiently with small number of components. SOLUTION: A circuit pattern 3 is provided on one surface of an insulating substrate 1 and a heat dissipation plate 5 is provided on the other surface of the insulating substrate 1. A surface metal layer 13 for mounting a heating element 15 is provided on one surface of the insulating substrate 1. An internal metal layer 17 bonded to the surface metal layer 13 by intermetallic bonding is arranged in the insulating substrate 1 thus constituting a heat conduction material 12. Profile and dimensions of the surface metal layer 13 and the internal metal layer 17 are determined such that all or the great portion of heat generated from the heating element 15 is transmitted through the heat conduction material 12 to the heat dissipation plate 5. Consequently, the great portion of heat generated from the heating element 15 can be collected at the heat conduction material 12 thence transmitted to the heat dissipation plate 5. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得一种高度可靠的多层电路板，其中由导热材料收集的热量可以用少量的部件有效地散发。解决方案：电路图案3设置在绝缘基板1的一个表面上，散热板5设置在绝缘基板1的另一个表面上。设置用于安装加热元件15的表面金属层13 在绝缘基板1的一个表面上。通过金属间接合结合到表面金属层13的内部金属层17布置在绝缘基板1中，从而构成导热材料12.表面金属层13和内部金属层17被确定为使得从加热元件15产生的全部或大部分热量通过导热材料12传递到散热板5.因此，从加热元件15产生的大部分热可以被收集在导热材料12上，然后被传送到散热板5.版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2003060352A Multilayer printed wiring board 审中-公开
标题翻译：多层印刷接线板
公开(公告)号：JP2003060352A
公开(公告)日：2003-02-28
申请号：JP2001241210
申请日：2001-08-08
申请人： Asahi Kasei Corp , Multi:Kk , 旭化成株式会社 , 株式会社マルチ
发明人： YAMADA TAKASHI , WATANABE MITSUHIRO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is superior in mechanical strength, heat resistance, adhesion strength, durability and dimensional stability, and has high insulation reliability, even if an insulation layer is thinned and enables high density of a wiring.
SOLUTION: A both-sided wiring board B1 with a capacitor is manufactured by laminating an aramid film 20 and copper foils 22, 22 adhered to both sides thereof by means of epoxy adhesive prepreg sheets 21, 21. A two-sided wiring board B2 having an inductor is manufactured by laminating an aramid film 30 and copper foils 31, 32 adhered to both sides thereof by means of epoxy adhesive prepreg sheets 31, 31. After the two-sided wiring boards B1, B2 are laminated with a glass cloth prepreg between, copper foils 52, 52 are laminated in both sides thereof, and a multilayer printed wiring board 4 of 8 layers, which has a copper foil wherein a circuit is formed, each copper foil being connected by a through-hole, is manufactured.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供机械强度，耐热性，粘合强度，耐久性和尺寸稳定性优异的多层印刷线路板，并且即使绝缘层变薄并且能够实现高密度的布线，也具有高的绝缘可靠性。解决方案：具有电容器的双面布线板B1通过用环氧树脂粘合剂预浸料片21,21层压芳族聚酰胺膜20和粘合到其两侧的铜箔22,22来制造。具有两面布线板B2的双面布线板B2具有通过利用环氧树脂粘合剂预浸料31和31将芳族聚酰胺薄膜30和粘合到其两面的铜箔31,32层叠在一起，制成电感器。在双面布线板B1，B2与玻璃布预浸料，铜箔52,52的两面层叠，并且制造了具有铜箔的8层的多层印刷电路板4，其中形成有电路，每个铜箔通过通孔连接。

5. 发明专利

JP2007159339A Electrical connection box 审中-公开
标题翻译：电气连接盒
公开(公告)号：JP2007159339A
公开(公告)日：2007-06-21
申请号：JP2005354626
申请日：2005-12-08
申请人： Multi:Kk , Yazaki Corp , 株式会社マルチ , 矢崎総業株式会社
发明人： SUZUKI KATSUYA , MATSUURA RYUJI , WATANABE MITSUHIRO , KANAZAWA AKIYOSHI
IPC分类号： H02G3/16 , B60R16/02
摘要： PROBLEM TO BE SOLVED: To provide an electrical connection box which can be reduced in size and weight. SOLUTION: The electrical connection box 1 is provided with a main cover 2, a lower cover 3, and a printed wiring board 4 as a power distribution circuit stored in the covers 2 and 3. In the printed wiring board 4, a plurality of wiring patterns 42A, 42B and 42C different in film thickness and width in accordance with strength of flowing current are formed on an insulating substrate 41, and surfaces of the wiring patterns 42A, 42B and 42C are arranged on the same plane. An electrical component 6 smaller than that used for a bus bar is mounted on the printed wiring board 4 by a welding means of brazing. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以减小尺寸和重量的电接线盒。解决方案：电连接盒1设有主盖2，下盖3和印刷线路板4作为存储在盖2和3中的配电电路。在印刷布线板4中，在绝缘基板41上形成有根据流动电流强度而在膜厚和宽度上不同的多个布线图案42A，42B和42C，布线图案42A，42B和42C的表面布置在同一平面上。通过钎焊的焊接装置，在印刷电路板4上安装小于母线用的电气部件6。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007134410A Printed wiring board with resistor circuit and method of manufacturing same 有权
标题翻译：具有电阻电路的印刷电路板及其制造方法
公开(公告)号：JP2007134410A
公开(公告)日：2007-05-31
申请号：JP2005323815
申请日：2005-11-08
申请人： Multi:Kk , Toyo Kohan Co Ltd , 東洋鋼鈑株式会社 , 株式会社マルチ
发明人： WATANABE MITSUHIRO , SAIJO KINJI , OSAWA SHINJI , YOSHIDA KAZUO , NANBU KOJI
IPC分类号： H05K1/16 , H01C13/02
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board with a resistor circuit in which circuit widths of a signal transmission circuit and those of a power supply circuit are made close as much as possible as circuit widths of a signal transmission circuit and those of a power supply circuit have been currently required to be different largely, and which can substantially be miniaturized, and to provide a method of manufacturing the same.
SOLUTION: The printed wiring board is obtained by etching a metal-clad laminated plate comprising a conductive layer and an insulating layer. In the printed wiring board with resistor circuit, a first circuit and a second circuit coexist as different in thickness on the same reference plane. In the method of manufacturing the printed wiring board, a selective etching characteristic of a nickel based heterogeneous metal layer and a copper layer is effectively used for a clad composite material in a state where three layers of a first copper layer/the nickel based heterogeneous metal layer/a second copper layer are sequentially laminated as a starting material.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有电阻电路的印刷线路板，其中信号传输电路和电源电路的电路宽度尽可能靠近信号传输电路的电路宽度和目前电源电路的要求在很大程度上是不同的，并且这些电路基本上可以小型化，并且提供其制造方法。解决方案：通过蚀刻包括导电层和绝缘层的覆金属层压板获得印刷线路板。在具有电阻电路的印刷电路板中，第一电路和第二电路在相同的参考平面上共存为不同的厚度。在制造印刷电路板的方法中，在三层第一铜层/镍基非均质金属的状态下，将镍基非均质金属层和铜层的选择性蚀刻特性有效地用于包层复合材料层/第二铜层作为起始材料依次层压。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006261239A Manufacturing method of printed wiring board with cooling layer 有权
标题翻译：具有冷却层的印刷线路板的制造方法
公开(公告)号：JP2006261239A
公开(公告)日：2006-09-28
申请号：JP2005073831
申请日：2005-03-15
申请人： Multi:Kk , Toyo Kohan Co Ltd , 東洋鋼鈑株式会社 , 株式会社マルチ
发明人： SAIJO KINJI , OSAWA SHINJI , YOSHIDA KAZUO , NANBU KOJI , WATANABE MITSUHIRO
IPC分类号： H05K3/06 , H01L23/473 , H05K1/02 , H05K3/46 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board with a cooling circuit for allowing a coolant such as water to circulate. SOLUTION: The manufacturing method of a printed wiring board with cooling layer including a coolant flowing route containing layer formed with a built-in coolant circulating route comprises a cooling circuit forming step as a first step, to form a cooling circuit with half-etching process of the surface of the coolant flowing route containing board, a laminating step to form a laminated body by laminating the surface of the coolant flowing route containing board forming the coolant circuit in contact with an insulating layer forming material, and a conductor circuit forming step to form the printed wiring board with a cooling layer by finally forming the conductor circuit through etching process of the surface of the coolant flowing route containing board. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种印刷线路板的制造方法，其具有用于使诸如水的冷却剂循环的冷却回路。解决方案：具有冷却层的印刷电路板的制造方法，所述冷却层包括形成有内置冷却剂循环路径的冷却剂流动路径容纳层，包括作为第一步骤的冷却回路形成步骤，以形成具有一半的冷却回路冷却剂流动路径包含板的表面的蚀刻工艺，通过层压形成与绝缘层形成材料接触的冷却剂回路的冷却剂流动路径容纳板的表面以及导体电路形成层压体的层压步骤通过冷却剂流动路径包含板的表面的蚀刻处理最终形成导体电路，形成具有冷却层的印刷线路板。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006147881A Printed wiring board and manufacturing method therefor 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2006147881A
公开(公告)日：2006-06-08
申请号：JP2004336480
申请日：2004-11-19
申请人： Multi:Kk , Toyo Kohan Co Ltd , 東洋鋼鈑株式会社 , 株式会社マルチ
发明人： WATANABE MITSUHIRO , SAIJO KINJI , OSAWA SHINJI , YOSHIDA KAZUO , NANBU KOJI
IPC分类号： H05K1/02 , H05K1/09 , H05K3/06 , H05K3/38 , H05K3/46
CPC分类号： H05K3/427 , H05K1/0265 , H05K1/116 , H05K3/062 , H05K3/20 , H05K3/4658 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0376 , H05K2201/09509 , H05K2201/09736 , H05K2203/0361 , H05K2203/0384 , H05K2203/1476 , Y10T156/10
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can be minimized substantially by bringing closer the circuit width of a signal circuit, which requires a design offering a large circuit width, and that of a power supply circuit or the like as much as possible, and to provide a method for manufacturing the printed wiring board. SOLUTION: The printed wiring board is made by etching a metal-attached laminated board including a conductive layer and an insulating layer, and has a first and second circuits that have thicknesses different from each other and that are formed in common on the same reference plane. Either the first circuit or the second circuit, which is a thicker one, is a lamination of a clad structure consisting of a first copper layer, a different kind of metal layer, and a second copper layer. In manufacturing the printed wiring board, a clad composite material consisting of the lamination of the first copper layer, the different kind of metal layer, and the second copper layer is used as a starting material, and the selective etching characteristics of the different kind of metal layer and the copper layers are utilized effectively. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供可以通过使需要提供大的电路宽度的设计的信号电路的电路宽度和电源电路等的电路宽度最小化来实现最小化的印刷电路板并且提供制造印刷电路板的方法。解决方案：印刷电路板通过蚀刻包括导电层和绝缘层的金属附着层叠板制成，并且具有第一和第二电路，其具有彼此不同的厚度，并且在第相同的参考平面。作为较厚的第一电路或第二电路，是由第一铜层，不同种类的金属层和第二铜层构成的包层结构的叠层。在制造印刷电路板时，使用由第一铜层，不同种类的金属层和第二铜层的叠层构成的包层复合材料作为起始材料，并且使用不同种类的金属层和铜层有效利用。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2007123382A Wiring board and its manufacturing method 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2007123382A
公开(公告)日：2007-05-17
申请号：JP2005310821
申请日：2005-10-26
申请人： Ain:Kk , Kanto Gakuin Univ Surface Engineering Research Institute , Multi:Kk , 株式会社アイン , 株式会社マルチ , 株式会社関東学院大学表面工学研究所
发明人： ONO KAORU , WATANABE MITSUHIRO
IPC分类号： H05K1/05 , H05K3/14 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which efficiently utilizes high heat dissipation of an aluminum substrate itself and can be commercially produced.
SOLUTION: An alumite layer 2 is formed on a surface of an aluminum substrate 1. The alumite layer 2 is changed into a high-insulating layer 2A with improved insulation by sealing treatment, and then a wiring 11 is arranged on the surface of the high-insulating layer 2A opposite to a surface being in contact with the aluminum substrate 1. A metal layer 12 is formed between the surface of the high-insulating layer 2A and a conductive layer 13 forming the wiring 11, by a physical vapor phase growth method such as sputtering method or the like or a chemical vapor phase growth method. The alumite layer 2 is preferably made of hard alumite.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种有效地利用铝基板本身的高散热并可以商业化生产的布线板。解决方案：在铝基板1的表面上形成耐酸铝层2.将铝酸盐层2通过密封处理改变为具有改善绝缘性的高绝缘层2A，然后将布线11布置在表面的高绝缘层2A与与铝基板1接触的表面相对。在高绝缘层2A的表面和形成布线11的导电层13之间，通过物理蒸气形成金属层12 相生长法如溅射法等或化学气相生长法。耐酸铝层2优选由硬质的耐酸铝制成。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2007036050A Process for producing multilayer circuit board 有权
标题翻译：生产多层电路板的方法
公开(公告)号：JP2007036050A
公开(公告)日：2007-02-08
申请号：JP2005219426
申请日：2005-07-28
申请人： Multi:Kk , Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , 株式会社マルチ
发明人： YAMANAKA HIROYUKI , TAKAHASHI YOSHITO , KANAI ATSUSHI , WATANABE MITSUHIRO
IPC分类号： H05K1/02 , H05K3/46 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To obtain a highly reliable multilayer circuit board in which heat collected by a heat conduction material can be dissipated efficiently with small number of components. SOLUTION: A circuit pattern 3 is provided on one surface of an insulating substrate 1 and a heat dissipation plate 5 is provided on the other surface of the insulating substrate 1. A surface metal layer 13 for mounting a heating element 15 is provided on one surface of the insulating substrate 1. An internal metal layer 17 bonded to the surface metal layer 13 by intermetallic bonding is arranged in the insulating substrate 1 thus constituting a heat conduction material 12. Profile and dimensions of the surface metal layer 13 and the internal metal layer 17 are determined such that all or the great portion of heat generated from the heating element 15 is transmitted through the heat conduction material 12 to the heat dissipation plate 5. Consequently, the great portion of heat generated from the heating element 15 can be collected at the heat conduction material 12 thence transmitted to the heat dissipation plate 5. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得一种高度可靠的多层电路板，其中由导热材料收集的热量可以用少量的部件有效地散发。解决方案：电路图案3设置在绝缘基板1的一个表面上，散热板5设置在绝缘基板1的另一个表面上。设置用于安装加热元件15的表面金属层13 在绝缘基板1的一个表面上。通过金属间接合结合到表面金属层13的内部金属层17布置在绝缘基板1中，从而构成导热材料12.表面金属层13和内部金属层17被确定为使得从加热元件15产生的全部或大部分热量通过导热材料12传递到散热板5.因此，从加热元件15产生的大部分热可以被收集在导热材料12上，然后被传送到散热板5.版权所有（C）2007，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式