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1. 发明专利

JP2007036172A Multilayer circuit board 审中-公开
标题翻译：多层电路板
公开(公告)号：JP2007036172A
公开(公告)日：2007-02-08
申请号：JP2005342569
申请日：2005-11-28
申请人： Multi:Kk , Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , 株式会社マルチ
发明人： YAMANAKA HIROYUKI , TAKAHASHI YOSHITO , KANAI ATSUSHI , WATANABE MITSUHIRO
IPC分类号： H05K3/46 , H01L23/12 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To obtain a highly reliable multilayer circuit board in which heat collected by a heat conduction material can be dissipated efficiently with small number of components. SOLUTION: A circuit pattern 3 is provided on one surface of an insulating substrate 1 and a heat dissipation plate 5 is provided on the other surface of the insulating substrate 1. A surface metal layer 13 for mounting a heating element 15 is provided on one surface of the insulating substrate 1. An internal metal layer 17 bonded to the surface metal layer 13 by intermetallic bonding is arranged in the insulating substrate 1 thus constituting a heat conduction material 12. Profile and dimensions of the surface metal layer 13 and the internal metal layer 17 are determined such that all or the great portion of heat generated from the heating element 15 is transmitted through the heat conduction material 12 to the heat dissipation plate 5. Consequently, the great portion of heat generated from the heating element 15 can be collected at the heat conduction material 12 thence transmitted to the heat dissipation plate 5. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得一种高度可靠的多层电路板，其中由导热材料收集的热量可以用少量的部件有效地散发。解决方案：电路图案3设置在绝缘基板1的一个表面上，散热板5设置在绝缘基板1的另一个表面上。设置用于安装加热元件15的表面金属层13 在绝缘基板1的一个表面上。通过金属间接合结合到表面金属层13的内部金属层17布置在绝缘基板1中，从而构成导热材料12.表面金属层13和内部金属层17被确定为使得从加热元件15产生的全部或大部分热量通过导热材料12传递到散热板5.因此，从加热元件15产生的大部分热可以被收集在导热材料12上，然后被传送到散热板5.版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007036050A Process for producing multilayer circuit board 有权
标题翻译：生产多层电路板的方法
公开(公告)号：JP2007036050A
公开(公告)日：2007-02-08
申请号：JP2005219426
申请日：2005-07-28
申请人： Multi:Kk , Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , 株式会社マルチ
发明人： YAMANAKA HIROYUKI , TAKAHASHI YOSHITO , KANAI ATSUSHI , WATANABE MITSUHIRO
IPC分类号： H05K1/02 , H05K3/46 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To obtain a highly reliable multilayer circuit board in which heat collected by a heat conduction material can be dissipated efficiently with small number of components. SOLUTION: A circuit pattern 3 is provided on one surface of an insulating substrate 1 and a heat dissipation plate 5 is provided on the other surface of the insulating substrate 1. A surface metal layer 13 for mounting a heating element 15 is provided on one surface of the insulating substrate 1. An internal metal layer 17 bonded to the surface metal layer 13 by intermetallic bonding is arranged in the insulating substrate 1 thus constituting a heat conduction material 12. Profile and dimensions of the surface metal layer 13 and the internal metal layer 17 are determined such that all or the great portion of heat generated from the heating element 15 is transmitted through the heat conduction material 12 to the heat dissipation plate 5. Consequently, the great portion of heat generated from the heating element 15 can be collected at the heat conduction material 12 thence transmitted to the heat dissipation plate 5. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得一种高度可靠的多层电路板，其中由导热材料收集的热量可以用少量的部件有效地散发。解决方案：电路图案3设置在绝缘基板1的一个表面上，散热板5设置在绝缘基板1的另一个表面上。设置用于安装加热元件15的表面金属层13 在绝缘基板1的一个表面上。通过金属间接合结合到表面金属层13的内部金属层17布置在绝缘基板1中，从而构成导热材料12.表面金属层13和内部金属层17被确定为使得从加热元件15产生的全部或大部分热量通过导热材料12传递到散热板5.因此，从加热元件15产生的大部分热可以被收集在导热材料12上，然后被传送到散热板5.版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007203681A Method for treating surface of copper layer, laminate including treated copper layer, and wiring board 审中-公开
标题翻译：铜层表面处理方法，包括处理铜层的层压板及接线板
公开(公告)号：JP2007203681A
公开(公告)日：2007-08-16
申请号：JP2006027836
申请日：2006-02-06
申请人： Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社
发明人： TAKAHASHI YOSHITO , KANAI ATSUSHI
IPC分类号： B32B15/08 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method for treating the surface of a copper layer which can ensure a sufficient grab in combining the copper layer and a resin insulating layer in one piece.
SOLUTION: The surface of the copper layer is given a blackening treatment, and further, the treated surface is given a coupling agent treatment. In this respect, a reduction treatment is preferably performed following the blackening treatment, and further, the coupling agent treatment is applied to the surface to be treated. This treatment method is, for example, applied to a rolled copper foil with not less than 100 μm thickness, then the treated surface of the copper foil is superposed on a prepreg layer, and both copper foil and prepreg layer are thermally pressurized in one piece into a laminate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种处理铜层的表面的方法，其可以确保将铜层和树脂绝缘层组合在一起的足够的抓地力。解决方案：铜层的表面进行黑化处理，此外，处理表面被给予偶联剂处理。在这方面，优选在黑化处理之后进行还原处理，此外，将偶联剂处理施加到待处理的表面。该处理方法例如适用于不小于100μm厚的轧制铜箔，然后将铜箔的处理表面重叠在预浸料层上，并将铜箔和预浸料层两者热压成一体成层压板。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007329371A Laminate circuit board 有权
标题翻译：层压电路板
公开(公告)号：JP2007329371A
公开(公告)日：2007-12-20
申请号：JP2006160534
申请日：2006-06-09
申请人： Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社
发明人： YAMANAKA HIROYUKI , TAKAHASHI YOSHITO
IPC分类号： H05K3/46 , H01L23/12 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a laminate circuit board with high heat dissipation characteristics and high connection reliability, even in an arrangement where a heating element is mounted and a heat dissipation member formed with a metal material is disposed. SOLUTION: In the laminate circuit board, a heat conductive member 2 formed with a material with higher heat conductivity than an insulating material constituting an insulating substrate 15 is disposed in the insulating substrate 15. On one end surface of the heat conductive member 2, a heating element 1 with a large amount of heat production is disposed on the heat conductive member 2 freely to transfer heat. On the other surface of the insulating substrate 15; a resin insulating layer 3, a first low elasticity resin layer 4, and a heat dissipation member 6 are disposed in this order and integrated. A heat conductivity of the resin insulating layer 3 is 2 W/mK or more. The first low elasticity resin layer 4 has a thickness of 20 μm or more, and has tensile elasticity of 10 GPa in a temperature region at -40°C or higher by viscoelastic measurement. Further, the first low elasticity resin layer 4 is not disposed in a heating element mounting part corresponding region 5 and in this region 5 a protruded resin insulating layer is existent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在安装有加热元件的布置中并且设置了形成有金属材料的散热构件，也提供具有高散热特性和高连接可靠性的层压电路板。解决方案：在层叠电路板中，在绝缘基板15上设置有形成有具有比构成绝缘基板15的绝缘材料的导热性高的材料的导热构件2.在导热构件的一个端面如图2所示，具有大量发热量的加热元件1自由地设置在导热构件2上以传递热量。在绝缘基板15的另一个表面上; 树脂绝缘层3，第一低弹性树脂层4和散热构件6依次设置并整合。树脂绝缘层3的导热率为2W / mK以上。第一低弹性树脂层4的厚度为20μm以上，通过粘弹性测定，在-40℃以上的温度区域具有10GPa的拉伸弹性。此外，第一低弹性树脂层4不配置在加热元件安装部对应区域5中，在该区域5中，存在突出的树脂绝缘层。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006152329A Surface treatment method for copper layer and laminated board and wiring plate including the copper layer subjected to the treatment 审中-公开
标题翻译：铜层和层压板和接线板的表面处理方法，包括受处理铜层的表面处理方法
公开(公告)号：JP2006152329A
公开(公告)日：2006-06-15
申请号：JP2004341267
申请日：2004-11-25
申请人： Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社
发明人： TAKAHASHI YOSHITO , KANAI ATSUSHI
IPC分类号： C23F1/00 , B32B15/08 , C23C22/63 , C23C28/00 , C23F1/18 , H05K3/00 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method for a copper layer by which sufficient adhesion is secured when a copper layer and a resin insulation layer are integrated.
SOLUTION: The surface of a copper layer is subjected to etching type chemical roughening treatment in such a manner that ruggedness in which the height from a bottom to a crest exceeds 5 μm is inclusively formed, and further, the above treated face is subjected to blackening reduction treatment. The above etching type chemical roughening treatment is performed in such a manner that ruggedness in which the height from a bottom to a crest preferably exceeds 8 μm, and more preferably, exceeds 12 μm is inclusively formed. Further, after the blackening reduction treatment, coupling agent treatment may be added thereto. The above treatment method is applied, e.g., to rolled copper foil having a thickness of ≥100 μm, the treatment face thereof is superimposed on a prepreg layer, and they are integrated by heating-pressure forming, so that a laminated boars is obtained.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种铜层的表面处理方法，当铜层和树脂绝缘层被一体化时，通过该铜层可以确保足够的粘合力。解决方案：铜层的表面经受蚀刻型化学粗糙化处理，其中包括从底部到峰顶的高度超过5μm的凹凸，并且进一步地，上述处理的面是进行黑化还原处理。上述蚀刻型化学粗化处理以从底部到顶部的高度优选超过8μm，更优选超过12μm的凹凸的方式进行包含。此外，在黑化还原处理之后，可以加入偶联剂处理。将上述处理方法应用于例如厚度≥100μm的轧制铜箔，其处理面叠加在预浸料层上，通过加热加压成形而一体化，从而得到层叠的公猪。版权所有（C）2006，JPO＆NCIPI

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