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    • 4. 发明申请
    • Apparatus and Method for Supplying Lubricant in Endless Hot Rolling Equipment
    • 无极热轧设备中润滑剂的设备及方法
    • US20080257647A1
    • 2008-10-23
    • US12091797
    • 2006-11-07
    • Chul-Hee KimSeung-Lak Son
    • Chul-Hee KimSeung-Lak Son
    • B21B27/10
    • B21B27/10B21B38/04B21B45/0251
    • A lubricant supply apparatus for endless hot rolling equipment includes a width-detecting sensor for detecting widths of steel sheets continuously supplied toward a roller, a controller connected to the width-detecting sensor, a lubricant pump connected to and controlled by the controller to supply a lubricant to a lubricant line, solenoid valves disposed on sub lines formed by dividing the lubricant line and controlled by the controller to supply or cut off the lubricant, a water pump connected to and controlled by the controller to supply water to a water line, mixers for mixing the lubricant and the water supplied to the water line for each of the sub lines, and nozzles connected respectively to the mixers and disposed according to a width of the roller so as to spray a mixture onto the roller according to the widths of the steel sheets.
    • 用于环形热轧设备的润滑剂供应装置包括:宽度检测传感器,用于检测连续向辊供给的钢板的宽度,连接到宽度检测传感器的控制器,连接到控制器并由控制器控制的润滑剂泵, 润滑剂线路的润滑剂,设置在通过分配润滑剂管线并由控制器控制以供应或切断润滑剂的副管线上的电磁阀,连接到控制器并由控制器控制以向水管线供水的水泵,混合器 用于将润滑剂和供应到每个子管线的水管线的水以及分别连接到混合器并且根据辊的宽度设置的喷嘴混合,以便根据辊的宽度将混合物喷射到辊上 钢板。
    • 5. 发明授权
    • Apparatus and method for supplying lubricant in endless hot rolling equipment
    • 在循环热轧设备中供应润滑剂的设备和方法
    • US08096159B2
    • 2012-01-17
    • US12091797
    • 2006-11-07
    • Chul-Hee KimSeung-Lak Son
    • Chul-Hee KimSeung-Lak Son
    • B21B27/06
    • B21B27/10B21B38/04B21B45/0251
    • A lubricant supply apparatus for endless hot rolling equipment includes a width-detecting sensor for detecting widths of steel sheets continuously supplied toward a roller, a controller connected to the width-detecting sensor, a lubricant pump connected to and controlled by the controller to supply a lubricant to a lubricant line, solenoid valves disposed on sub lines formed by dividing the lubricant line and controlled by the controller to supply or cut off the lubricant, a water pump connected to and controlled by the controller to supply water to a water line, mixers for mixing the lubricant and the water supplied to the water line for each of the sub lines, and nozzles connected respectively to the mixers and disposed according to a width of the roller so as to spray a mixture onto the roller according to the widths of the steel sheets.
    • 用于环形热轧设备的润滑剂供应装置包括:宽度检测传感器,用于检测连续向辊供给的钢板的宽度,连接到宽度检测传感器的控制器,连接到控制器并由控制器控制的润滑剂泵 润滑剂线路的润滑剂,设置在通过分配润滑剂管线并由控制器控制以供应或切断润滑剂的副管线上的电磁阀,连接到控制器并由控制器控制以向水管供水的水泵,混合器 用于将润滑剂和供应到每个子管线的水管线的水以及分别连接到混合器并且根据辊的宽度设置的喷嘴混合,以便根据辊的宽度将混合物喷射到辊上 钢板。
    • 7. 发明授权
    • Method for adhering masking film
    • 粘附掩膜的方法
    • US5688354A
    • 1997-11-18
    • US445857
    • 1995-05-22
    • Kyoun-hee KoIl-ho KimChul-hee KimWoung-kwan An
    • Kyoun-hee KoIl-ho KimChul-hee KimWoung-kwan An
    • H01L21/677B65H35/00B65H37/04H01L21/00H01L21/301H01L21/304H01L21/308B32B31/18
    • H01L21/67132B65H35/0013B65H37/04H01L21/6836H01L2221/68327Y10T156/1052Y10T156/108Y10T156/12Y10T156/1343Y10T156/1712Y10T156/1734Y10T156/1741
    • A masking film adhering method for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.
    • 一种用于平滑且精确地输送将晶片粘附到掩模膜被切割的切割位置的掩模膜带的掩模膜粘附方法。 通过使掩蔽胶片带和晶片通过上下粘合辊将晶片粘贴到掩膜胶带上。 然后,从切割台上分离掩模胶片带,使得具有粘贴在其上的晶片的掩模胶片带可能通过在晶片完全通过粘合辊时向上移动上粘合辊而不会附着到切割台上 。 在将掩模膜输送到切割位置之后,保持掩模膜和切割台之间的预定距离,沿着晶片的形状切割掩模胶片带。 防止由于晶片的重量而导致的掩模膜的凹陷,避免了掩模膜带与切割台的粘合。 可以将晶片准确地放置在掩模胶片带的切割位置上,以防止晶片被切割器损坏。