发明申请
US20140125918A1 DIE STRUCTURE, TRANSFER MOLDING APPARATUS, TRANSFER MOLDING METHOD, OPTICAL MEMBER, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE
有权
基本信息:
- 专利标题： DIE STRUCTURE, TRANSFER MOLDING APPARATUS, TRANSFER MOLDING METHOD, OPTICAL MEMBER, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE
- 专利标题（中）：DIE结构，转印成型设备，转印成型方法，光学部件，区域光源装置，液晶显示装置和移动装置
- 申请号：US13763014 申请日：2013-02-08
- 公开(公告)号：US20140125918A1 公开(公告)日：2014-05-08
- 发明人： Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Kazutaka Kaneko , Yuzuru Fujie , Naoki Hashimoto , Taichi Suzuki , Masayuki Kojima
- 申请人： OMRON CORPORATION
- 申请人地址： JP Kyoto
- 专利权人： OMRON Corporation
- 当前专利权人： OMRON Corporation
- 当前专利权人地址： JP Kyoto
- 优先权： JP2012-243980 20121105
- 主分类号： B29C59/02
- IPC分类号： B29C59/02
摘要：
A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.
摘要（中）：
传递成型方法包括将树脂片插入相对设置的第一管芯和第二管芯之间的插入步骤，将树脂片夹在第一和第二管芯之间的夹持步骤，同时转印的转印面 与树脂片的至少一个表面接触的部件和传递模塑步骤，加热第一和第二模具中的至少一个，以至少使树脂片材的表面部分 并且当通过形成在转印表面中的凹部形成厚部时，通过与凹部连接的凹槽部分，残留在凹部中的剩余空气排出。
公开/授权文献:
IPC结构图谱:
| B | 作业；运输 |
| --B29 | 塑料的加工；一般处于塑性状态物质的加工 |
| ----B29C | 塑料的成型或连接；塑性状态物质的一般成型；已成型产品的后处理，如修整 |
| ------B29C59/00 | 表面成型，如压花；所用的设备 |
| --------B29C59/02 | .用机械方法，如压制 |