发明申请
US20050252684A1 Electroless copper plating machine thereof, and multi-layer printed wiring board
审中-公开
基本信息:
- 专利标题： Electroless copper plating machine thereof, and multi-layer printed wiring board
- 专利标题（中）：无电镀铜机，多层印刷线路板
- 申请号：US11113011 申请日：2005-04-25
- 公开(公告)号：US20050252684A1 公开(公告)日：2005-11-17
- 发明人： Takeyiki Itabashi , Haruo Akahoshi , Tadashi Iida , Yoshinori Ueda , Eiji Takai , Naoki Nishimura
- 申请人： Takeyiki Itabashi , Haruo Akahoshi , Tadashi Iida , Yoshinori Ueda , Eiji Takai , Naoki Nishimura
- 优先权： JP11-285322 19991006
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; C23C18/16 ; C23C18/31 ; C23C18/40 ; H05K3/18 ; H05K1/11 ; B05D3/04 ; B05D3/10 ; H01R12/04
摘要：
A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.
摘要（中）：
提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。 无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。 该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/46 | .多层电路的制造 |