基本信息:
- 专利标题： Substrate support bushing
- 专利标题（中）：基板支撑衬套
- 申请号：US11044245 申请日：2005-01-27
- 公开(公告)号：US20050220604A1 公开(公告)日：2005-10-06
- 发明人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
- 申请人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; B65G49/06 ; C03C17/00 ; C23C16/458 ; F16C29/00 ; F16C29/04 ; H01L21/00 ; H01L21/205 ; H01L21/683 ; G01V8/00
摘要：
An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.
摘要（中）：
提供了一种用于在处理室内支撑衬底的装置。 在一个方面，提供了一种基板支撑构件，其包括具有穿过其中形成的孔的壳体，至少部分地设置在孔内的支撑销和围绕壳体设置的多个轴承元件。 在一个方面，轴承元件包括具有穿过其形成的中心孔的辊，外形轮廓和至少部分地设置穿过中心孔的轴。 在另一方面，轴承元件包括球组件，该球组件包括较大球形构件和围绕较大球形构件布置的四个较小球形构件。
公开/授权文献:
- US08216422B2 Substrate support bushing 公开/授权日：2012-07-10