基本信息:
- 专利标题: 雷射標記系統之標記校準方法
- 专利标题(英):Method of calibrating marking in laser marking system
- 专利标题(中):激光标记系统之标记校准方法
- 申请号:TW092109454 申请日:2003-04-23
- 公开(公告)号:TW592866B 公开(公告)日:2004-06-21
- 发明人: 金炳煥 KIM, BYOUNG HWAN , 李晸求 LEE, JEONG KU , 邊英植 BYUN, YOUNG SIK , 權九徹 KWON, GOO CHEOL , 金泰政 KIM, TAE JUNG
- 申请人: EO科技股份有限公司 EO TECHNICS CO., LTD.
- 申请人地址: 韓國
- 专利权人: EO科技股份有限公司 EO TECHNICS CO., LTD.
- 当前专利权人: EO科技股份有限公司 EO TECHNICS CO., LTD.
- 当前专利权人地址: 韓國
- 代理人: 詹銘文; 蕭錫清
- 优先权: 南韓 2002-23108 20020426 南韓 2003-9877 20030217
- 主分类号: B23K
- IPC分类号: B23K
(二)、本案代表圖之元件代表符號簡單說明:
100:控制器110:托盤122:水平移動台
120:托盤供應匣130:承載器150:步進馬達
160:雷射標記器
164:高速掃描導光系統聚焦鏡(f-theta lens)
170:後視攝影機180:卸載器
190:托盤收集匣
In a method for calibrating marking in a laser marking system including a laser marker performing marking while observing chips contained in cells of a tray using a plurality of vision cameras, and a post-vision camera detecting a marking error (a) each chip is assigned to be observed to a corresponding vision camera, (b) a coordinate of the vision camera and a coordinate of the laser marker are matched, (c) a predetermined first symbol is marked on a chip or at a position corresponding vision camera, and one point of the first symbol is taught as a reference point, (d) the first symbol and the reference point of the chip are observed using the corresponding vision camera and a second symbol is marked on the chip with respect to the reference point, (e) the second symbol on a selected chip is observed and one point of the second symbol is taught as a comparison point, and (f) a position of the comparison point is detected from the reference point on the chip and the marking error in each cell is calculated.
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
B | 作业;运输 |
--B23 | 机床;不包含在其他类目中的金属加工 |
----B23K | 钎焊或脱焊;焊接;用钎焊或焊接方法包覆或镀敷;局部加热切割,如火焰切割;用激光束加工 |