基本信息:
- 专利标题： 中介物、其半導體封裝及其半導體封裝的製備方法
- 专利标题（英）：Interposer, semiconductor package with the same and method for preparing a semiconductor package with the same
- 专利标题（中）：中介物、其半导体封装及其半导体封装的制备方法
- 申请号：TW105133426 申请日：2016-10-17
- 公开(公告)号：TW201801277A 公开(公告)日：2018-01-01
- 发明人： 林柏均 , LIN, PO CHUN
- 申请人： 南亞科技股份有限公司 , NANYA TECHNOLOGY CORPORATION
- 申请人地址： 新北市
- 专利权人： 南亞科技股份有限公司,NANYA TECHNOLOGY CORPORATION
- 当前专利权人： 南亞科技股份有限公司,NANYA TECHNOLOGY CORPORATION
- 当前专利权人地址： 新北市
- 代理人： 陳長文; 馮博生
- 优先权： 15/194,195 20160627
- 主分类号： H01L23/535
- IPC分类号： H01L23/535
One aspect of the present disclosure provides an interposer for a semiconductor package. The interposer includes a substrate portion and a wall portion disposed on the substrate portion. The substrate portion has a first side, a second side, and an electrical interconnect structure between the first side and the second side. The substrate portion is substantially free from conductive through vias, and the cost for fabricating through silicon vias (TSV) is very expensive; therefore, the fabrication cost of the interposer can be dramatically reduced. In addition, the wall portion is disposed on the first side and defining an aperture exposing a portion of the electrical interconnect structure. At least one semiconductor die can be bonded to the interposer and inside the aperture. Consequently, the height of the semiconductor package is lower than the design of disposing the semiconductor die on top of the interposer.
公开/授权文献:
- TWI622154B 中介物、其半導體封裝及其半導體封裝的製備方法 公开/授权日：2018-04-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/535 | ..包括内部互连的，例如穿交结构 |