基本信息:
- 专利标题: 化學機械研磨修整器及其製法
- 专利标题(英):Chemical mechanical polishing conditioner and associated methods
- 专利标题(中):化学机械研磨修整器及其制法
- 申请号:TW101141305 申请日:2012-11-07
- 公开(公告)号:TW201417949A 公开(公告)日:2014-05-16
- 发明人: 王嘉群 , WANG, CHIA CHUN , 張凱翔 , CHANG, KAI HSIANG , 鄭忠義 , CHENG, CHUNG YI , 廖文仁 , LIAO, WEN JEN
- 申请人: 中國砂輪企業股份有限公司 , KINIK COMPANY
- 申请人地址: 臺北市
- 专利权人: 中國砂輪企業股份有限公司,KINIK COMPANY
- 当前专利权人: 中國砂輪企業股份有限公司,KINIK COMPANY
- 当前专利权人地址: 臺北市
- 代理人: 蘇建太; 林冠宏
- 主分类号: B24B37/20
- IPC分类号: B24B37/20
The present invention relates to a chemical mechanical polishing conditioner and associated methods. The method for manufacturing a chemical mechanical polishing conditioner comprises: (A) providing a non-planar substrate; (B) providing a bonding layer is disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles, wherein it is embedded in a surface of the bonding layer, and (D) heating and curing the bonding layer, a planar substrate is formed by compensation for the deformation of non-planar substrate during the bonding layer curing, and the abrasive particles are fixed by bonding layer to the surface of the planar substrate; wherein, after step (D), the tips of the abrasive particles with a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and enhance the surface flatness of chemical mechanical polishing conditioner.
公开/授权文献:
- TWI530361B 化學機械研磨修整器及其製法 公开/授权日:2016-04-21
信息查询:
EspacenetIPC结构图谱:
B | 作业;运输 |
--B24 | 磨削;抛光 |
----B24B | 用于磨削或抛光的机床、装置或工艺;磨具磨损表面的修理或调节;磨削,抛光剂或研磨剂的进给 |
------B24B37/00 | 研磨机床或装置,即需要在相对软但仍为刚性的研具和被研磨表面之间加入粉末状磨料;及其附件 |
--------B24B37/005 | .研磨机床或装置的控制装置 |
----------B24B37/20 | ..用于加工平面的研磨垫 |