基本信息:
- 专利标题： 導熱性矽氧橡膠組合物
- 专利标题（英）：Thermally conductive silicone rubber composition
- 专利标题（中）：导热性硅氧橡胶组合物
- 申请号：TW100103162 申请日：2011-01-27
- 公开(公告)号：TW201137045A 公开(公告)日：2011-11-01
- 发明人： 小玉春美 , 大西正之 , 阪口良 , 中吉和己
- 申请人： 道康寧東麗股份有限公司
- 申请人地址： DOW CORNING TORAY CO., LTD. 日本 JP
- 专利权人： 道康寧東麗股份有限公司
- 当前专利权人： 道康寧東麗股份有限公司
- 当前专利权人地址： DOW CORNING TORAY CO., LTD. 日本 JP
- 代理人： 陳長文
- 优先权： 日本 2010-016719 20100128
- 主分类号： C08L
- IPC分类号： C08L ; C08K ; H01L
A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass% of the total quantity of components (A), (B), and (C).; The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.
公开/授权文献:
- TWI513770B 導熱性矽氧橡膠組合物 公开/授权日：2015-12-21
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |