基本信息:
- 专利标题： 기판 처리 시스템 및 제어 장치
- 专利标题（英）：SUBSTRATE PROCESSING SYSTEM AND CONTROL DEVICE
- 申请号：KR1020180035115 申请日：2018-03-27
- 公开(公告)号：KR102246922B1 公开(公告)日：2021-04-29
- 发明人： 다케나가유이치 , 가사이다카히토
- 申请人： 도쿄엘렉트론가부시키가이샤
- 申请人地址： *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 专利权人： 도쿄엘렉트론가부시키가이샤
- 当前专利权人： 도쿄엘렉트론가부시키가이샤
- 当前专利权人地址： *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 代理人： 김태홍; 김진회
- 优先权： JPJP-P-2017-063791 2017-03-28
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; C23C16/44 ; H01L21/66
摘要：
본발명은기판에성막된막의특성의이상값을높은정밀도로검출하는것이가능한기판처리시스템을제공하는것을과제로한다. 일실시형태의기판처리시스템은, 처리용기내에수용된기판에대하여, 미리정해진처리를실행하는것이가능한기판처리장치를구비하는기판처리시스템으로서, 상기기판에대하여성막처리를실행하는처리실행부와, 상기성막처리에의해상기기판에성막된막의특성을취득하는특성취득부와, 상기특성취득부가취득한상기막의특성에기초하여, 상기막의특성이이상값을포함하고있는지의여부를판정하는이상판정부를갖는다.
摘要（英）：
Disclosed is a substrate processing system that includes a substrate processing apparatus configured to perform a predetermined processing on a substrate accommodated in a processing container. The substrate processing system includes: a processing execution unit configured to execute a film deposition processing on the substrate; a characteristic acquiring unit configured to acquire the characteristic of the film deposited on the substrate by the film deposition processing; and an abnormality determination unit configured to determine whether the characteristic of the film includes an abnormal value based on the characteristic of the film acquired by the characteristic acquiring unit.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |