基本信息:
- 专利标题: 도열층, 감광층, 감광성 조성물, 도열층의 제조 방법, 및 적층체와 반도체 디바이스
- 申请号:KR20207029563 申请日:2019-04-15
- 公开(公告)号:KR20200132943A 公开(公告)日:2020-11-25
- 发明人: YAMASHITA KOSUKE , SHIMADA KAZUTO
- 申请人: FUJIFILM CORP
- 专利权人: FUJIFILM CORP
- 当前专利权人: FUJIFILM CORP
- 优先权: JP2018081904 2018-04-20; JP2018185069 2018-09-28; JP2019041304 2019-03-07
- 主分类号: C08K3/013
- IPC分类号: C08K3/013 ; C08L33/00 ; C08L79/08 ; C08L101/06 ; G03F7/004 ; G03F7/20 ; G03F7/26
摘要:
적어도 1종의필러를포함하고, 열확산율이 5.0×10-7m2s-1 이상이며, 체적저항율이 1.0×1011Ω·cm 이상인도열층을사용한다. 또한, 본발명은, 이도열층을응용한감광층, 감광성조성물, 도열층의제조방법, 및적층체와반도체디바이스에관한것이다.
摘要(英):
The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10−7 m2 s−1 or more, and has a volume resistivity of 1.0×1011 Ω·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.
信息查询:
EspacenetIPC结构图谱:
C | 化学;冶金 |
--C08 | 有机高分子化合物;其制备或化学加工;以其为基料的组合物 |
----C08K | 使用无机物或非高分子有机物作为配料 |
------C08K3/00 | 使用无机配料 |
--------C08K3/01 | .以其特定功能为特征的 |
----------C08K3/013 | ..填料、颜料或增强剂 |