It discloses with respect to the LDS process and the multi-layered circuit forming method using the LDS painting process.
Multi-layer circuit forming process according to the invention using the injection molding method comprising: (a) producing a molding substrate having a via-hole; Step (b) such that a portion of the first circuit pattern overlaps with the via-holes in the molding substrate, but the first circuit forms a pattern by performing LDS, and plated on the first surface of the molding substrate; (C) forming an insulating layer by coating and drying the LDS coating paint containing a thermoplastic resin on a molded substrate that the first circuit pattern; And (d) the first, but form a second circuit pattern by performing LDS, and plated on an insulating layer, a second circuit part of the pattern that overlaps the portion of the first circuit pattern; And (e) a portion of the first circuit pattern, but the third circuit forming a pattern by performing LDS, and plated on the second side of the molded substrate, a portion of the third circuit pattern through the via-hole of the molding substrate and step to ensure electrical connection with; including, while forming a three or more layers of the circuit is characterized in that using the injection only in the step (a).