The present invention includes the steps of pre-treatment for that, the contaminant removal or oxide on the surface of the solder powder production method of the present invention is coated on the object to a low temperature bonding method using the method for producing a solder powder, a method for producing the solder paste and the solder paste; Forming a nano-multilayered coating layer by using a plating method in the electrolytic plating object; Further comprising: separating the nano-multilayered coating layer formed on the coated object; And a step of milling the nano-multilayered coating layer of the release.
According to the present invention, but the micrometer-sized powder paste prepared is possible to size the micro size with a nanolayer, powders both so alternately stacked with nano-layer can be used for low-temperature bonding such as nanopowders, conventional nano powder is not easily oxidized, unlike, the risk or less risk of personal penetration, can be stored in the air, and the powder and the nano-laminate of micrometer size no phenomenon growing attached entangled with adjacent particles at room temperature, having a nano-layered fire when using a mixture of regular powder-free, there is an effect that can further lower the cost is reduced the proportion of the nano-layered powder as compared to the case where the low-temperature bonding can be made with only a nano-layered powder.