基本信息:
- 专利标题： 도금 처리 방법 및 도금 처리 부품 그리고 도금 처리 시스템
- 专利标题（英）：Plating method, plated component, and plating system
- 专利标题（中）：镀层方法镀层组件和镀层系统
- 申请号：KR1020160074608 申请日：2016-06-15
- 公开(公告)号：KR1020160150028A 公开(公告)日：2016-12-28
- 发明人： 이나토미유이치로 , 타나까타카시 , 미즈타니노부타카
- 申请人： 도쿄엘렉트론가부시키가이샤
- 申请人地址： *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 专利权人： 도쿄엘렉트론가부시키가이샤
- 当前专利权人： 도쿄엘렉트론가부시키가이샤
- 当前专利权人地址： *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 代理人： 특허법인엠에이피에스
- 优先权： JPJP-P-2015-123584 2015-06-19
- 主分类号： C23C18/16
- IPC分类号： C23C18/16 ; C23C18/48 ; C23C18/32 ; C23C18/50
Electroless is to prevent the peeling of a plating layer formed by plating and enhance the reliability of the parts produced by the reliability, and the plating process for the plating process. In the present invention, the plating method, in the plating process system (1) for producing a plated component according to the plating parts, plating processing method in accordance with the plating method, electroless plating a first formed by plating electroless plating the surface of the plating layer 38 is made by forming a second electroless plating layer 39 made of a copper alloy by plating. The first electroless plating layer 38 is a barrier layer to prevent diffusion of copper, and may be made of cobalt or cobalt alloy. The second electroless plated layer 39 is a seed layer for electrolytic plating of copper to the surface, and may be made of an alloy of copper and nickel.