Checking method of a wafer according to the technical features of the present invention, a plurality of electron beam columns and adjusting the position so as to respectively face the different dies on each of the die area of ​​the different parts of the wafer; Wherein said plurality of electron beam columns each scanning the partial area; And by combining the plurality of partial images acquired by scanning each of the partial areas acquiring a single image of the die; may include. In addition, the inspection method of the wafer according to the technical features of the present invention, designated as stage die inspection target regions of the wafer rotation or at least once an alignment direction of the plurality of electron beam columns such that each scan by a plurality of electron beam column; And scanning direction of the scanning direction, and the plurality of electron-beam column of any one of the edge with the vertical of said die the scan direction of the stage and the plurality of scanning directions of an electron beam column, the scan direction as the to vertical stage each of the stages of the step of rotating the at least one; may include.