基本信息:
- 专利标题： 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
- 专利标题（英）：Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
- 专利标题（中）：表面处理铜箔，带载体的铜箔，基板，树脂基板，印刷电路板，铜箔层压板和制造印刷电路板的方法
- 申请号：KR1020167001975 申请日：2014-07-24
- 公开(公告)号：KR1020160034915A 公开(公告)日：2016-03-30
- 发明人： 고히키미치야
- 申请人： 제이엑스금속주식회사
- 申请人地址： *-*, Otemachi *-chome, Chiyoda-ku, Tokyo, Japan
- 专利权人： 제이엑스금속주식회사
- 当前专利权人： 제이엑스금속주식회사
- 当前专利权人地址： *-*, Otemachi *-chome, Chiyoda-ku, Tokyo, Japan
- 代理人： 특허법인코리아나
- 优先权： JPJP-P-2013-153732 2013-07-24; JPJP-P-2013-153765 2013-07-24
- 国际申请： PCT/JP2014/069624 2014-07-24
- 国际公布： WO2015012376 2015-01-29
- 主分类号： C25D7/06
- IPC分类号： C25D7/06 ; C23C18/16 ; C25D1/04 ; C25D3/54 ; B32B15/20 ; B32B15/08 ; H05K1/09 ; H05K3/02 ; H05K3/38
摘要：
미세배선형성성을유지하고, 또한무전해구리도금피막의양호한밀착력을실현하는동박제거후 기재면의프로파일형상을부여할수 있는표면처리동박을제공한다. 또, 미세배선형성성을유지하고, 또한무전해구리도금피막의양호한밀착력을실현하는표면의프로파일형상을구비하는수지기재를제공한다. 본발명의표면처리동박은, 동박상에표면처리층이형성된표면처리동박이고, 표면처리층표면의입자상당면적비가 0.1 ∼ 0.85 이다.
摘要（中）：
本发明提供一种表面处理铜箔，其能够在除去铜箔之后赋予基板表面的轮廓形状，该轮廓形状保持精细的布线成形性并且实现令人满意的无电镀铜镀层的粘合。 本发明还提供一种树脂基板，其具有保持精细布线成形性的表面的轮廓形状，并且实现令人满意的无电镀铜镀层的粘附。 本发明的表面处理铜箔是表面处理铜箔，在铜箔上形成表面处理层，与表面处理层的表面的颗粒对应的面积的比例 为0.1〜0.85。
摘要（英）：
Maintaining the fine wire forming, and further provides a surface-treated copper foil that can be removed after the copper foil to achieve good adhesion of the electroless copper plating film, giving the profile shape of the substrate surface. In addition, maintaining the fine wire forming, and further electroless plating provides a resin-based material having a profile shape of the surface to achieve good adhesion of the copper plating film. Surface treated copper foil of the present invention, is a surface-treated copper foil having a surface treatment layer on a copper foil, the particle area ratio is 0.1 ~ 0.85 equivalent of the surface treatment layer surface.
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D7/00 | 以施镀制品为特征的电镀 |
| --------C25D7/06 | .丝；带；箔 |