基本信息:
- 专利标题: 인라인 열처리 장치
- 专利标题(英):In-line type heat treatment apparatus
- 专利标题(中):在线式热处理设备
- 申请号:KR1020130043088 申请日:2013-04-18
- 公开(公告)号:KR1020140125205A 公开(公告)日:2014-10-28
- 发明人: 임현옥 , 최정환
- 申请人: 주식회사 테라세미콘
- 申请人地址: 경기 화성시 동탄면 경기동로 ***-**,
- 专利权人: 주식회사 테라세미콘
- 当前专利权人: 주식회사 테라세미콘
- 当前专利权人地址: 경기 화성시 동탄면 경기동로 ***-**,
- 代理人: 특허법인 수
- 主分类号: H01L21/324
- IPC分类号: H01L21/324 ; H01L21/677
The in-line heat treatment system is disclosed. In-line heat treatment system according to the present invention is transferred is not the substrate is mounted on a moving (Moving) member for movement in the transport direction or conveying direction and the direction opposite to the substrate of the substrate. Therefore, do not include the frictional force acting between the substrate and the moving member or between the support member and a moving member which is the support substrate is mounted, it does not generate particles (Particle) by friction. Accordingly, the substrate is prevented from being damaged by the particles, there is an effect that improves the reliability of the product.
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料 |
--------------H01L21/26 | ....用波或粒子辐射轰击的 |
----------------H01L21/324 | .....用于改善半导体材料性能的热处理,例如退火、烧结 |