基本信息:
- 专利标题： 반도체 패키지 및 그 제조 방법
- 专利标题（英）：Seminconductor package and method for manufacturing the same
- 专利标题（中）：SEMINCONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- 申请号：KR1020120040673 申请日：2012-04-19
- 公开(公告)号：KR1020130117931A 公开(公告)日：2013-10-29
- 发明人： 이경연 , 김병진 , 김기정
- 申请人： 앰코 테크놀로지 코리아 주식회사
- 申请人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 代理人： 한라특허법인(유한)
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to firmly protect a semiconductor chip by forming a lead frame as an independent terminal after the semiconductor chip is mounted and molded. CONSTITUTION: A plurality of terminals (12) are regularly arranged on the upper surface of an integrated lead frame. A semiconductor chip (14) is laminated on the terminal of the integrated lead frame by a conductive input and output unit (22). A molding compound resin (16) is molded on the upper surface of the integrated lead frame. The terminal of the integrated lead frame is divided into each independent terminal (20) by exposing and developing processes with photoresist. A flip chip (22a) or a conductive wire is selected as the conductive input and output unit.
摘要（中）：
目的：提供一种半导体封装及其制造方法，以在半导体芯片安装和模制之后通过形成作为独立端子的引线框来牢固地保护半导体芯片。 构成：多个端子（12）规则地布置在集成引线框架的上表面上。 通过导电输入和输出单元（22）将半导体芯片（14）层压在集成引线框架的端子上。 在集成引线框架的上表面上模制成型复合树脂（16）。 集成引线框架的端子通过曝光和显影工艺被光刻胶分成每个独立的端子（20）。 选择倒装芯片（22a）或导线作为导电输入和输出单元。
公开/授权文献:
- KR101374145B1 반도체 패키지 및 그 제조 방법 公开/授权日：2014-03-19
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/28 | .封装，例如密封层、涂覆物 |