基本信息:
- 专利标题： 몰디드 리드리스 패키지 및 이를 이용한 ＬＥＤ 패키지
- 专利标题（英）：Molded leadless package and led package fabricated using the same
- 专利标题（中）：模制无铅包装和使用它的LED包装
- 申请号：KR1020100020030 申请日：2010-03-05
- 公开(公告)号：KR1020110100933A 公开(公告)日：2011-09-15
- 发明人： 최윤화
- 申请人： 제엠제코(주)
- 申请人地址： 경기도 부천시 원미구 길주로***번길 *** (도당동)
- 专利权人： 제엠제코(주)
- 当前专利权人： 제엠제코(주)
- 当前专利权人地址： 경기도 부천시 원미구 길주로***번길 *** (도당동)
- 代理人： 특허법인아주
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L33/62
Discloses a molded leadless package structure without increasing the manufacturing cost stand has a high heat dissipation capacity can be easily increase the number of leads. Molded leadless package of the present invention, so that mutual opposite the die pad having an upper surface and a lower surface that is, the die pad predetermined distance spaced apart from the die pad to the peripheral region of the semiconductor chip, the die pad mounted on the upper surface of the and disposed a plurality of leads, the semiconductor chip and the plurality of exposure to lead part of the connecting means, and at least in part, as the die pad of the bottom of the lead for electrically connecting each and the package covers the die pad, the semiconductor chip, the leads, and connecting means comprising a body, it characterized in that the thickness of the die pad is thicker than the outer lead which is exposed to the outside of the package of the lead body.
公开/授权文献:
- KR101115288B1 몰디드 리드리스 패키지 및 이를 이용한 ＬＥＤ 패키지 公开/授权日：2012-03-05
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/28 | .封装，例如密封层、涂覆物 |