基本信息:
- 专利标题： 표면 처리 동박 및 그것을 사용한 적층판
- 专利标题（英）：Surface-treated copper foil and laminated board using same
- 专利标题（中）：表面处理铜箔和层压板使用相同
- 申请号：KR1020157001484 申请日：2013-09-10
- 公开(公告)号：KR101716988B1 公开(公告)日：2017-03-15
- 发明人： 아라이히데타 , 미키아츠시 , 아라이고스케 , 나카무로가이치로
- 申请人： 제이엑스금속주식회사
- 申请人地址： *-*, Otemachi *-chome, Chiyoda-ku, Tokyo, Japan
- 专利权人： 제이엑스금속주식회사
- 当前专利权人： 제이엑스금속주식회사
- 当前专利权人地址： *-*, Otemachi *-chome, Chiyoda-ku, Tokyo, Japan
- 代理人： 특허법인코리아나
- 优先权： JPJP-P-2012-198852 2012-09-10; JPJP-P-2012-227378 2012-10-12; JPJP-P-2012-227381 2012-10-12; JPJP-P-2012-247887 2012-11-09; JPJP-P-2012-247923 2012-11-09; JPJP-P-2012-270786 2012-12-11; JPJP-P-2012-288813 2012-12-28; JPJP-P-2012-288835 2012-12-28; JPJP-P-2013-000676 2013-01-07; JPJP-P-2013-013698 2013-01-28; JPJP-P-2013-013702 2013-01-28
- 国际申请： PCT/JP2013/074438 2013-09-10
- 国际公布： WO2014038716 2014-03-13
- 主分类号： B32B15/08
- IPC分类号： B32B15/08 ; C25D1/04 ; C25D3/12 ; C25D3/38 ; C25D3/56 ; C25D3/58 ; C25D7/06 ; C25F3/22 ; B21B1/40 ; H05K3/02
Excellent transparency of the resin after removing the copper foil by etching the surface treatment provides a copper-clad laminate, and using the same. Surface-treated copper foil is, when it is after the combined surface treatment adhesive preparation to the both surfaces of a polyimide resin substrate, from the surface side in embodiment, removing both sides of a copper foil by etching, and taking the substrate to print a mark on the line, and the obtained observation point - brightness in the graph, from the end of the mark on the brightness curve generated over a portion mark is not depicted tower average Bt and the bottom average value ΔB the difference in the Bb-by (ΔB = Bt Bb), and observation point - the lightness in the graph, brightness in the range of the depth of the intersection point of the curve and Bt, to a value that indicates the location of the nearest intersection between the mark on the line based on the Bt from the intersection to t1, and the brightness curve and Bt 0.1ΔB, brightness curve and 0.1 of intersection of ΔB, when the value indicating the location of the nearest intersection between the mark on the line to t2, the Sv is defined by the following equation (1) becomes equal to or greater than 3.5 Surface treated copper foil.
Sv = (ΔB × 0.1) / (t1 - t2) (1)
公开/授权文献:
- KR1020150034185A 표면 처리 동박 및 그것을 사용한 적층판 公开/授权日：2015-04-02
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B32 | 层状产品 |
| ----B32B | 层状产品，即由扁平的或非扁平的薄层，例如泡沫状的、蜂窝状的薄层构成的产品 |
| ------B32B15/00 | 实质上由金属组成的层状产品 |
| --------B32B15/04 | .由金属组成作为薄层的主要或惟一的成分，它与另一层由一种特定物质构成的薄层相贴 |
| ----------B32B15/08 | ..合成树脂的 |