The present invention relates to a semiconductor package, which improves the reliability and reduces the phenomenon Wars page.
In one example, the insulating layer and the circuit board includes a second wiring pattern formed on a lower surface of the insulating the first wiring pattern formed on the upper surface of the layer and the insulating layer, seated on an upper surface of the circuit board, the semiconductor die, said circuit board encapsulating the semiconductor die, on top of and wa teu of kaepsyulran through vias are formed exposing the first wiring pattern to the outside, is formed in the through via-containing electrically conductive bump connected to the first wiring pattern wherein semiconductor device; It is seated on an upper portion of the semiconductor device, insulator and an interposer including a solder ball formed on the wiring pattern and the wiring pattern formed on the lower face of the insulator; And the semiconductor device and the interlayer member interposed between the interposer; includes, the solder ball is disclosed a semiconductor package, characterized in that electrically connected to the conductive bump.