基本信息:
- 专利标题： 몰딩용 타블렛 공급장치
- 专利标题（英）：Tablet supply apparatus for molding
- 专利标题（中）：用于成型的纸板供应装置
- 申请号：KR1020120130673 申请日：2012-11-19
- 公开(公告)号：KR101436056B1 公开(公告)日：2014-09-02
- 发明人： 김석배 , 구본수
- 申请人： 한미반도체 주식회사
- 申请人地址： 인천광역시 서구 가좌로**번길 ** (가좌동)
- 专利权人： 한미반도체 주식회사
- 当前专利权人： 한미반도체 주식회사
- 当前专利权人地址： 인천광역시 서구 가좌로**번길 ** (가좌동)
- 代理人： 특허법인세림
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/02
It discloses a tablet supply unit for the molding. Tablet supply device for a molding according to an embodiment of the present invention along a plurality of tablet receiving portion circumferentially that the tablet is accommodated is formed at a predetermined interval, change the position of the tablet received in the unit tablet accommodated while being rotated by a predetermined angle by the drive means which comprises a tablet supply unit for supplying the tablet portion and the tablet selection unit with the rotary table, the tablet accommodating the rotary table, the tablet supply unit corresponding to the guide rail with a feeding path for guiding the supply of the tablet, and the tablet size and it comprises a width adjusting device which can adjust the width of the supply path.
公开/授权文献:
- KR1020140063943A 몰딩용 타블렛 공급장치 公开/授权日：2014-05-28
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/56 | ....封装，例如密封层、涂层 |