基本信息:
- 专利标题: 내굴곡성박막과 투명전도성박막이 구비된 투명유연기판 및 이의 제조방법
- 专利标题(英):A transparent flexible board having layer for high flexible layer and transparency conductive layer and Manufacturing method of the same
- 专利标题(中):具有高柔性层和透明导电层的透明柔性板及其制造方法
- 申请号:KR1020110146648 申请日:2011-12-30
- 公开(公告)号:KR101297432B1 公开(公告)日:2013-08-19
- 发明人: 이건환 , 윤정흠 , 이성훈 , 김동호 , 박연현
- 申请人: 한국기계연구원
- 申请人地址: 대전광역시 유성구 가정북로 *** (장동)
- 专利权人: 한국기계연구원
- 当前专利权人: 한국기계연구원
- 当前专利权人地址: 대전광역시 유성구 가정북로 *** (장동)
- 代理人: 김기문
- 主分类号: H01B5/14
- IPC分类号: H01B5/14 ; H01B13/00
The provided with a bending resistance thin film and the transparent conductive thin film according to the present invention, the transparent flexible substrate is made of a polymer and a transparent base material whose surface is pretreated by the ion beam, ITO using a sputtering method on the transparent base material, IZO, AZO, GZO to any one of the consist including the bending resistance thin film formed on the deposited transparent conductive thin film and the transparent conductive thin film composed of an outer characterized. Method of manufacturing a bending resistance thin film and the transparent conductive thin transparent flexible substrate with the according to the present invention, the pretreatment step of pre-processing the surface of a transparent base material made of a polymer with the ion beam, ITO using a sputtering method on the outer surface of the transparent base material , within the formed with IZO, AZO, and a transparent conductive thin film forming step of forming a transparent conductive thin film made of any one of GZO, the paste containing the Ag nanowire on the transparent conductive thin film outer surface, a conductive ink, any one or more of the conductive polymer It characterized by comprising a bending resistance thin film forming step of forming a flexible thin film.
公开/授权文献:
- KR1020130077963A 내굴곡성박막과 투명전도성박막이 구비된 투명유연기판 및 이의 제조방법 公开/授权日:2013-07-10
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01B | 电缆;导体;绝缘体;导电、绝缘或介电材料的选择 |
------H01B5/00 | 按形状区分的非绝缘导体或导电物体 |
--------H01B5/14 | .在绝缘支承物上有导电层或导电薄膜的 |