基本信息:
- 专利标题： 취성 재료 기판의 가공 방법
- 专利标题（英）：Method of machining vulnerable material substrate
- 专利标题（中）：加工易损材料基材的方法
- 申请号：KR1020107025334 申请日：2009-03-27
- 公开(公告)号：KR101223470B1 公开(公告)日：2013-01-17
- 发明人： 후쿠하라켄지 , 이무라아츠시 , 야마모토고오지 , 이노우에슈이치 , 구마가이토루
- 申请人： 미쓰보시 다이야몬도 고교 가부시키가이샤
- 申请人地址： **-** Koroen, Settsu-city, Osaka, Japan
- 专利权人： 미쓰보시 다이야몬도 고교 가부시키가이샤
- 当前专利权人： 미쓰보시 다이야몬도 고교 가부시키가이샤
- 当前专利权人地址： **-** Koroen, Settsu-city, Osaka, Japan
- 代理人： 이철
- 优先权： JPJP-P-2008-105191 2008-04-14; JPJP-P-2008-106220 2008-04-15
- 国际申请： PCT/JP2009/056224 2009-03-27
- 国际公布： WO2009128334 2009-10-22
- 主分类号： C03B33/09
- IPC分类号： C03B33/09 ; B28D1/24 ; G02F1/133 ; B28D5/00
It provides a process for processing a brittle material substrate that can be a stable laser braking process. The time from the first group is determined (端) to be machined along the planned scribing line to the second group is determined, (a) the step of forming a first initial crack to be spaced apart (離 隔) from the first group is determined, (b) claim in the depth direction of the relative movement was cooled by spraying coolant in the region of with the also heated, passed immediately after first time to the determined second group from the laser first group determined side the beam spot and generating a planned scribing line a step of forming a scribe line of a finite depth by using the stress gradient and, (c) the first group is determined, or, a step of forming a second initial crack between the first term determines the first initial crack, and ( d) to move relative to the beam spot of the laser irradiation of the second time to determine the second group from the first group is determined deeper penetration or the scribe line is carried out to complete the division process.
公开/授权文献:
- KR1020110005850A 취성 재료 기판의 가공 방법 公开/授权日：2011-01-19