基本信息:
- 专利标题： 미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물
- 专利标题（英）：Microelectronic contact, method for fabricating microelectronic contact, semiconductor device and contact structure
- 专利标题（中）：微电子接触，微电子接触方法，半导体器件及接触结构
- 申请号：KR1020057019047 申请日：2004-04-12
- 公开(公告)号：KR100891066B1 公开(公告)日：2009-03-31
- 发明人： 칸드로스이고르케이. , 밀러찰스에이. , 웬젤스튜어트더블유.
- 申请人： 폼팩터, 인크.
- 申请人地址： **** Southfront Road, Livermore, CA ***** U.S.A.
- 专利权人： 폼팩터, 인크.
- 当前专利权人： 폼팩터, 인크.
- 当前专利权人地址： **** Southfront Road, Livermore, CA ***** U.S.A.
- 代理人： 주성민; 안국찬
- 优先权： US10/410,948 2003-04-10
- 国际申请： PCT/US2004/011116 2004-04-12
- 国际公布： WO2004093164 2004-10-28
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485
반도체 장치, 미세 전자 접속체, 순응성 패드, 트레이스, 리소그래피
The microelectronic spring contact, and a method of manufacture is disclosed for making an electrical connection between the device and the mating substrate. A spring contact is attached to the substrate of the device has a compliant pad spaced apart from a terminal of the device. Compliant pad extends away from the base, and the substrate attached to the substrate and has a side surface which is tapered to a smaller end area remote from the substrate. Trace extends in its end region from the terminal of the device over the compliant pad. At least a portion of the compliant pad end area is covered by the trace, the portion of the trace on the compliant pad is supported by the compliant pad. Semiconductor devices, microelectronic contact, compliant pads, traces, lithography
公开/授权文献:
- KR1020050118723A 미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물 公开/授权日：2005-12-19
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |