基本信息:
- 专利标题： 미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물
- 专利标题（英）：Layered microelectronic contact and method for fabricating same
- 专利标题（中）：层状微电子接触及其制造方法
- 申请号：KR1020057019047 申请日：2004-04-12
- 公开(公告)号：KR1020050118723A 公开(公告)日：2005-12-19
- 发明人： 칸드로스이고르케이. , 밀러찰스에이. , 웬젤스튜어트더블유.
- 申请人： 폼팩터, 인크.
- 申请人地址： **** Southfront Road, Livermore, CA ***** U.S.A.
- 专利权人： 폼팩터, 인크.
- 当前专利权人： 폼팩터, 인크.
- 当前专利权人地址： **** Southfront Road, Livermore, CA ***** U.S.A.
- 代理人： 주성민; 안국찬
- 优先权： US10/410,948 2003-04-10
- 国际申请： PCT/US2004/011116 2004-04-12
- 国际公布： WO2004093164 2004-10-28
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485
摘要：
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad.
摘要（中）：
公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子通过柔性焊盘延伸到其端部区域。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。
公开/授权文献:
- KR100891066B1 미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물 公开/授权日：2009-03-31
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |