The invention line on the flip-chip package and its manufacturing method, a technical problem to be solved is the low-cost implementation of a flip-chip using a wire terminal without bumping process, to improve the connection reliability between the semiconductor die and the substrate, Ultra semiconductor die and the substrate easily applicable line in flip-chip packages having a large number of bond pads to a fine pitch and to provide a method of manufacturing the same. Matter of the solution according to the invention for this purpose is formed with a plurality of bond pads semiconductor die, are positioned facing the bonding pad of the semiconductor die, the surface of the substrate formed with a plurality of wiring patterns, the bond pads of the semiconductor die and the sub- interconnecting the wiring pattern of the straight and is substantially "S" as a number of wire terminals and the semiconductor die and the sub-way is formed between a straight line consisting of a flip-chip package, a spacer for protecting the wire terminal and its production is disclosed formed. Flip-chip, wire terminal, ultra fine pitch, the spacer, the substrate