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1. 发明授权

EP3660189B1 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES 有权转让
公开(公告)号：EP3660189B1
公开(公告)日：2023-11-15
申请号：EP20152479.0
申请日：2015-03-24
发明人： Middeke, Hermann , Schneider, Steve , Fels, Carl Christian
IPC分类号： C25D5/54 , C23C18/20 , C23C18/24 , C23C18/30 , C25D5/56 , C23C18/16

2. 发明授权

EP3758049B8 DEVICE AND METHOD FOR MOVING AN OBJECT INTO A PROCESSING STATION, CONVEYING SYSTEM AND PROCESSING APPARATUS 有权转让
公开(公告)号：EP3758049B8
公开(公告)日：2022-03-23
申请号：EP19182628.8
申请日：2019-06-26
发明人： Pretscher, Rüdiger
IPC分类号： H01L21/67 , H01L21/677 , H01L21/687

3. 发明授权

EP3508620B1 UREYLENE ADDITIVE, ITS USE AND A PREPARATION METHOD THEREFOR 有权转让
公开(公告)号：EP3508620B1
公开(公告)日：2021-05-19
申请号：EP18150785.6
申请日：2018-01-09
发明人： Bolton, Dr. Onas , Ackermann, Dr. Stefanie , Adolf, Dr. James , Wu, Dr. Jun , Hoffmann, Nadja , Brunner, Dr. Heiko
IPC分类号： C25D7/12 , C07C273/18 , C07C275/10 , C07C275/14 , C08G18/00 , C25D3/38 , C07C211/13 , C07C215/18 , C07C215/50 , C07C217/42 , C08G18/71 , C08G18/73 , C08G18/28 , C08G18/32

5. 发明授权

EP3502320B1 A METHOD FOR INCREASING CORROSION RESISTANCE OF A SUBSTRATE COMPRISING AN OUTERMOST CHROMIUM ALLOY LAYER 有权
公开(公告)号：EP3502320B1
公开(公告)日：2020-07-22
申请号：EP17209956.6
申请日：2017-12-22
申请人： Atotech Deutschland GmbH
发明人： Özkaya, Dr. Berkem , Wachter, Dr. Philipp
IPC分类号： C25D3/06 , C25D9/08 , C25D5/14

6. 发明公开

EP3660189A1 COMPOSITION AND PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES 有权转让
公开(公告)号：EP3660189A1
公开(公告)日：2020-06-03
申请号：EP20152479.0
申请日：2015-03-24
申请人： Atotech Deutschland GmbH
发明人： Middeke, Dr. Hermann , Schneider, Steve , Fels, Dr. Carl Christian
IPC分类号： C25D5/54 , C23C18/20 , C23C18/24 , C23C18/30 , C25D5/56 , C23C18/16
摘要： The present invention relates to a composition of an etching solution and a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.

7. 发明授权

EP3578693B1 AQUEOUS COMPOSITION FOR DEPOSITING A TIN SILVER ALLOY AND METHOD FOR ELECTROLYTICALLY DEPOSITING SUCH AN ALLOY 有权
公开(公告)号：EP3578693B1
公开(公告)日：2020-04-15
申请号：EP18176788.0
申请日：2018-06-08
申请人： Atotech Deutschland GmbH
发明人： Jha, Himendra , Schmidt, Ralf , Schwarz, Christian , Kocer, Recep , Vazhenin, Grigory
IPC分类号： C25D3/60 , C25D7/00

8. 发明公开

EP3578683A1 ELECTROLESS COPPER OR COPPER ALLOY PLATING BATH AND METHOD FOR PLATING 有权
公开(公告)号：EP3578683A1
公开(公告)日：2019-12-11
申请号：EP18176836.7
申请日：2018-06-08
申请人： Atotech Deutschland GmbH
发明人： KULKO, Roman-David , ZARWELL, Sebastian , KLAEDEN, Kilian , PETER, Anna , BECK, Birgit
IPC分类号： C23C18/40 , C23C18/48
摘要： An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, comprising
a) copper ions;
b) at least one reducing agent suitable for reducing copper ions to metallic copper;
c) at least one complexing agent for copper ions;
characterized in that the electroless copper plating bath further comprises
d) at least one compound according to formula (1):

wherein
Z 1 and Z 2 are independently selected from the group consisting of hydrogen; carboxylic acid group; carboxylate group; sulfonic acid group; sulfonate group; carboxamide group; nitrile group; nitro group; substituted or non-substituted trialkylammonium group; substituted or non-substituted 2-carboxyvinyl group; substituted or non-substituted 2-vinylcarboxylate group; substituted or non-substituted 2-(trialkylammonium)vinyl group; substituted or non-substituted hydroxamic acid group; and substituted or non-substituted oxime group;
with the proviso that at least one of Z 1 and Z 2 is not hydrogen;
and
wherein R 1 , R 2 , R 3 and R 4 are defined as follows:
i. R 1 , R 2 , R 3 and R 4 are hydrogen; or
ii. R 1 with R 2 are forming together a substituted or non-substituted aromatic ring moiety, R 3 and R 4 are hydrogen; or
iii. R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, R 1 and R 2 are hydrogen; or
iv. R 1 with R 2 as well as R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, respectively.

The invention further concerns a method for depositing at least a copper or copper alloy layer on a surface of a substrate, a layer system and a kit-of-parts for providing the inventive electroless copper plating bath.

9. 发明公开

EP3567993A1 A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPPER OR COPPER ALLOY AND AN ORGANIC LAYER 有权转让
公开(公告)号：EP3567993A1
公开(公告)日：2019-11-13
申请号：EP18171175.5
申请日：2018-05-08
申请人： Atotech Deutschland GmbH
发明人： LÜTZOW, Norbert , CHO, Wonjin , HONDA, Toshio , TEWS, Dirk , LAGER, Markku , TANG, Felix , KLOPPISCH, Mirko , HAHN, Aaron , SCHMIDT, Gabriela , THOMS, Martin
IPC分类号： H05K3/28 , C23C22/52 , C23F11/14 , H05K3/38
摘要： The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:
(i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy,
(ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising
(ii-a) one or more than one amino azole,
(ii-b) one or more than one organic acid and/or salts thereof,
(ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and
(ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution,
wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

10. 发明授权

EP3380650B1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM 有权
公开(公告)号：EP3380650B1
公开(公告)日：2019-10-30
申请号：EP16801787.9
申请日：2016-11-28
申请人： Atotech Deutschland GmbH
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , RÜCKBROD, Sven
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24

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