It is an obj ect of the present invention to provide a method for producing a semiconductor apparatus in which the warp and break of a substrate after sealing can be suppressed even when a large substrate is sealed. The present invention provides a method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, including:
an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200°C, and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted;
an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and
a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.