基本信息:
- 专利标题： ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE
- 专利标题（中）：在电路微丝电接口
- 申请号：EP06847580.5 申请日：2006-12-12
- 公开(公告)号：EP1982354A2 公开(公告)日：2008-10-22
- 发明人： JACOBSEN, Stephen, C. , MARCEAU, David, P. , ZURN, Shayne
- 申请人： Raytheon Sarcos, LLC
- 申请人地址： 870 Winter Street Waltham, MA 02451 US
- 专利权人： Raytheon Sarcos, LLC
- 当前专利权人： Raytheon Sarcos, LLC
- 当前专利权人地址： 870 Winter Street Waltham, MA 02451 US
- 代理机构： Wombwell, Francis
- 优先权： US749777P 20051212; US749873P 20051212; US637380 20061211
- 国际公布： WO2007070533 20070621
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection (90) includes forming (92) a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding (94) the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. One microelectronic circuit (10) can include a bundle (16) of microfilaments (18) bonded to corresponding bond pads (14) to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/52 | .用于在处于工作中的器件内部从一个组件向另一个组件通电的装置 |