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    • 4. 发明申请
    • HDMI FORMAT VIDEO PATTERN AND AUDIO FREQUENCIES GENERATOR FOR FIELD TEST AND BUILT-IN SELF TEST
    • HDMI格式视频模式和音频频率发生器,用于现场测试和内置自检
    • WO2008121177A1
    • 2008-10-09
    • PCT/US2008/001328
    • 2008-01-31
    • ANALOGIX SEMICONDUCTOR, INC.ZHU, NingHAO, Jianbin
    • ZHU, NingHAO, Jianbin
    • H04N17/00G01R31/3187G01R31/3167G01R31/28G01R31/317G01R31/3181
    • H04N17/00G01R31/3167G01R31/3187
    • A versatile video pattern and audio pattern generation module 110, that can be integrated onto a video integrated circuit (IC) to generate functional video test input data, in HDMI format, for gray bars, color bars and moving bar data patterns, and to further generate single-tone audio signals, is disclosed. This video signal generator 210 can be made part of the built-in-self test (BIST) to allow simplified testing of the IC. The signals generated can be used to test the video and audio functionality, as well as enabling a system to be demonstrated in the field. The output of the generator during the demonstration can be displayed using any suitable video display enabling simplified demonstration setup. These video and audio signals can be used as a diagnostic tool by the consumer and also for debugging the IC and system as may be necessary.
    • 一种多功能视频图案和音频图案生成模块110,其可以集成到视频集成电路(IC)上以产生HDMI格式的功能视频测试输入数据,用于灰色条,色条和移动条数据模式,以及进一步 生成单音音频信号。 该视频信号发生器210可以制成内置自检(BIST)的一部分,以便简化IC测试。 所产生的信号可用于测试视频和音频功能,以及使系统能够在现场得到证明。 演示期间发生器的输出可以使用任何合适的视频显示进行显示,从而实现简化的演示设置。 这些视频和音频信号可以用作消费者的诊断工具,并且可以用于根据需要调试IC和系统。
    • 9. 发明申请
    • METHOD AND APPARATUS FOR TESTING SIGNAL PATHS BETWEEN AN INTEGRATED CIRCUIT WAFER AND A WAFER TESTER
    • 用于测试集成电路波形与波长测试仪之间的信号波形的方法和装置
    • WO01079863A3
    • 2002-05-16
    • PCT/US2001/010030
    • 2001-03-27
    • G01R27/02G01R31/28G01R31/3167H01L21/66G01R31/316G01R35/00
    • G01R31/3167
    • Signal paths within an interconnect structure linking input/output (I/O) ports of an integrated circuit (IC) tester and test points of an IC die on a wafer are tested for continuity, shorts and resistance by using the interconnect structure to access a similar arrangement of test points on a reference wafer. Conductors in the reference wafer interconnect groups of test points. The tester may then test the continuity of signal paths through the interconnect structure by sending test signals between pairs of its ports through those signal paths and the interconnecting conductors within the reference wafer. A parametric test unit within the tester can also determine impedances of the signal paths through the interconnect structure by comparing magnitudes of voltage drops across pairs of its I/O ports to magnitudes of currents it transmits between the I/O port pairs.
    • 通过使用互连结构来访问集成电路(IC)测试器的输入/输出(I / O)端口和晶片上的IC管芯的测试点的互连结构中的信号路径被测试为连续性,短路和电阻 在参考晶片上测试点的类似布置。 参考晶圆互连组中的导体测试点。 然后,测试者可以通过在参考晶片内的这些信号路径和互连导体之间通过在其端口对之间发送测试信号来测试通过互连结构的信号路径的连续性。 测试仪中的参数测试单元还可以通过将I / O端口对之间的电压降幅度与I / O端口对之间传输的电流大小进行比较,来确定通过互连结构的信号路径的阻抗。