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1. 发明申请

WO2022005393A1 OPTICAL DEVICE AND MANUFACTURING METHOD 审中-公开
公开(公告)号：WO2022005393A1
公开(公告)日：2022-01-06
申请号：PCT/SG2021/050364
申请日：2021-06-23
申请人： AMS SENSORS SINGAPORE PTE. LTD.
发明人： SPRING, Nicola
IPC分类号： H01L25/16 , H01L33/48 , H01L33/58 , H01L27/146 , H01S5/183 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L31/00
摘要： Optical Device and Manufacturing Method An optical device (380) is disclosed, the device comprising a substrate (330), a first electrically-conductive element (325) formed as a pattern on the substrate, a layer of material extending over at least a portion of the first electrically-conductive element and forming an optical element (370), and a second electrically-conductive element (355) extending through the layer of material and coupled to the first electrically-conductive element. Also disclosed is an associated method of manufacturing the optical device (380), and an apparatus (600) comprising at least one of the disclosed optical devices, a camera (605), and processing circuitry (615) communicably coupled to the at least one optical device and to the camera.

2. 发明申请

WO2022207421A1 SENSOR ARRANGEMENT, IMAGE SENSOR, IMAGING DEVICE AND METHOD OF PROVIDING A SENSOR ARRANGEMENT 审中-公开
公开(公告)号：WO2022207421A1
公开(公告)日：2022-10-06
申请号：PCT/EP2022/057581
申请日：2022-03-23
申请人： AMS SENSORS BELGIUM BVBA
发明人： XHAKONI, Adi , GUERRIERI, Stefano , TOBESCU, Corneliu
IPC分类号： H01L27/146 , H01L25/167 , H01L27/14618 , H01L31/02327
摘要： In one embodiment a Sensor arrangement comprises a first receiving element (11) configured to detect light in a first wavelength range, a second receiving element (12) configured to detect light in the first wavelength range or in a second wavelength range, a third receiving element (13) configured to detect light in one of the first wavelength range, the second wavelength range or a third wavelength range, a fourth receiving element (14) configured to detect light in a fourth wavelength range, the fourth wavelength range comprising at least part of the infrared wavelength range, and an enhancement layer (16). Therein the first, the second and the third wavelength ranges are different from each other. The enhancement layer (16) is configured to cover a top surface (15) of only the fourth receiving element (14), such that the enhancement layer is arranged between said top surface of the fourth receiving element and a source of incident electromagnetic radiation to increase a quantum efficiency of the fourth receiving element.

3. 发明申请

WO2022271598A1 CAMERA MODULE WITH COMPONENT SIZE BASED ON IMAGE SENSOR 审中-公开
公开(公告)号：WO2022271598A1
公开(公告)日：2022-12-29
申请号：PCT/US2022/034178
申请日：2022-06-20
申请人： META PLATFORMS TECHNOLOGIES, LLC
发明人： AZUMA, Eddie Alex , BIKUMANDLA, Manoj , PENDSE, Rajendra D. , HAZEGH, Cina , HAN, Chao
IPC分类号： H04N5/225 , H01L27/146 , H05K1/11 , H05K1/14 , H01L27/14618 , H04N23/54 , H04N23/55 , H04N23/57 , H05K1/141 , H05K1/144 , H05K1/181 , H05K1/185 , H05K2201/049 , H05K2201/10121
摘要： A camera module includes an image sensor, a lens assembly, a printed circuit board, and a substrate. The image sensor has edges that define a two-dimensional footprint substantially parallel to a surface of the image sensor. The lens assembly is coupled to a top surface of the image sensor and focuses light onto the top surface of the image sensor. Edges of the lens assembly do not extend beyond the footprint. The printed circuit board is below the image sensor and controls the image sensor. The substrate is coupled to a bottom surface of the image sensor and to a top surface of the printed circuit board. The substrate electrically couples the image sensor to the printed circuit board. Edges of the substrate do not extend beyond the footprint.

4. 发明申请

WO2021190141A1 芯片的封装结构及其封装方法审中-公开
公开(公告)号：WO2021190141A1
公开(公告)日：2021-09-30
申请号：PCT/CN2021/074610
申请日：2021-02-01
申请人：苏州晶方半导体科技股份有限公司
发明人：吴明轩
IPC分类号： H01L23/31 , H01L23/24 , H01L21/50 , H01L21/56 , H01L27/146 , H01L21/561 , H01L23/3107 , H01L27/14618
摘要：本发明揭示了一种封装结构及其封装方法，封装结构包括基板、芯片及透明盖板，基板包括相对设置的第一表面及第二表面，且基板具有贯穿第一表面及第二表面的空腔；芯片固定于第二表面，芯片包括相对设置的功能面及背面，功能面面对第二表面，且功能面覆盖空腔; 透明盖板包括对应空腔的透光部，透光部与功能面之间填充光学胶。本发明的空腔内填充有光学胶和/或透光部，相较于现有技术中无任何物质的空腔结构，可大大提高空腔区域的刚性，从而提高整个封装结构的可靠性，避免在信赖性测过程中或者是在后续封装结构的使用过程中出现爆腔、分层等问题，且可避免透明盖板或芯片的移位等。

5. 发明申请

WO2022026638A2 WIDEBAND BACK-ILLUMINATED ELECTROMAGNETIC RADIATION DETECTORS 审中-公开
公开(公告)号：WO2022026638A2
公开(公告)日：2022-02-03
申请号：PCT/US2021/043596
申请日：2021-07-29
申请人： APPLE INC.
发明人： ARBORE, Mark Alan , MOREA, Matthew T. , KANGAS, Miikka M. , CHEVALLIER, Romain F. , SARMIENTO, Tomas
IPC分类号： G01J1/02 , G01J1/04 , G01J1/42 , G01J3/02 , G01J3/42 , H01L27/146 , G01J1/0209 , G01J1/0271 , G01J1/0411 , G01J1/4228 , G01J2001/0257 , G01J3/0208 , G01J3/0259 , H01L27/1446 , H01L27/14601 , H01L27/14618 , H01L27/14625 , H01L27/14694 , H01L31/0203 , H01L31/02327 , H01L31/03046
摘要： An electromagnetic radiation detector includes an InP substrate having a first surface opposite a second surface; a first InGaAs electromagnetic radiation absorber stacked on the first surface and configured to absorb a first set of electromagnetic radiation wavelengths; a set of one or more buffer layers stacked on the first InGaAs electromagnetic radiation absorber and configured to absorb at least some of the first set of electromagnetic radiation wavelengths; a second InGaAs electromagnetic radiation absorber stacked on the set of one or more buffer layers and configured to absorb a second set of electromagnetic radiation wavelengths; and an immersion condenser lens formed on the second surface and configured to direct electromagnetic radiation through the InP substrate and toward the first InGaAs electromagnetic radiation absorber and the second InGaAs electromagnetic radiation absorber.

6. 发明申请

WO2021253971A1 感光像素模块、图像传感器及电子设备审中-公开
公开(公告)号：WO2021253971A1
公开(公告)日：2021-12-23
申请号：PCT/CN2021/088659
申请日：2021-04-21
申请人： OPPO广东移动通信有限公司
发明人：张学勇
IPC分类号： H01L27/146 , H01L27/14618 , H01L27/14627 , H01L27/1463 , H01L27/14634 , H01L27/14636
摘要：一种感光像素模块（100）、图像传感器（010）及电子设备（100），该感光像素模块（100）包括：保护环（110）、多个感光像素单元（120）和浅槽隔离（130），多个感光像素单元（120）排布于保护环（110）内；多个感光像素单元（120）中任意两个相邻的感光像素单元（120）之间设置有浅槽隔离（130）。通过在保护环（110）内设置多个感光像素单元（120），并且多个感光像素单元（120）中任意两个相邻的感光像素单元（120）之间设置有浅槽隔离（130）进行隔离，能够实现光电转换，并且由于多个感光像素单元（120）共用保护环（110），减少了保护环（110）所占的面积，增加了单位面积内感光像素单元（120）的占比和填充因子，有利于提升图像传感器（010）的光子敏感度和成像质量。

7. 发明申请

WO2021201975A1 SMALL CAMERA WITH MOLDING COMPOUND 审中-公开
公开(公告)号：WO2021201975A1
公开(公告)日：2021-10-07
申请号：PCT/US2021/016673
申请日：2021-02-04
申请人： FACEBOOK TECHNOLOGIES, LLC
发明人： LIANG, Minhua
IPC分类号： H04N5/225 , H01L23/31 , H01L27/146 , G02B3/0031 , H01L27/14618 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258
摘要： An imaging module or a camera module includes a lens assembly and an image sensor. Molding compound such as epoxy molding compound (EMC) is disposed around the image sensor to shield ambient light from becoming incident onto the image sensor.

8. 发明申请

WO2022268923A2 DAM AND FILTER FOR SPECTROMETER 审中-公开
公开(公告)号：WO2022268923A2
公开(公告)日：2022-12-29
申请号：PCT/EP2022/067099
申请日：2022-06-23
申请人： TRINAMIX GMBH
发明人： PROKOP, Christoph , OEGUEN, Celal Mohan , HUPFAUER, Thomas
IPC分类号： H01L27/146 , H01L27/14618 , H01L27/14625 , H01L27/14683
摘要： The invention relates to a method (126) of manufacturing at least one optical detector (110) for optical detection of electromagnetic radiation in a predefined range of interest λ[roi]. The method (126) comprises: a) providing at least one detector pixel (112) on a circuit carrier (114); b) dispensing at least one fluidic material in at least one line (122) on the circuit carrier (114), such that the line (122) of fluidic material encloses the at least one detector pixel (112), specifically exactly one detector pixel, and such that the at least one line (122) of fluidic material extends higher from the circuit carrier (114) than the detector pixel (112); c) at least partially hardening, specifically curing, the at least one line (122) of fluidic material, such that the at least one line creates a dam (116) enclosing the at least one detector pixel (112), specifically exactly one detector pixel; and d) depositing at least one filter substrate (118) on the at least one dam (116), such that the filter substrate (118) is adhesively mounted to the dam (116) and covers the at least one detector pixel (112) on at least one side opposing the circuit carrier (114). Further, the invention relates to a method (124) for manufacturing at least one optical detector system (120) having at least two optical detectors (110), to an optical detector (110), to an optical detector system (120) and to a spectroscopic sensing application comprising at least one optical detector system (120).

9. 发明申请

WO2021127086A1 OPTICAL SENSOR WITH TRENCH ETCHED THROUGH DIELECTRIC OVER SILICON 审中-公开
公开(公告)号：WO2021127086A1
公开(公告)日：2021-06-24
申请号：PCT/US2020/065471
申请日：2020-12-17
申请人： TEXAS INSTRUMENTS INCORPORATED , TEXAS INSTRUMENTS JAPAN LIMITED
发明人： SUMMERFELT, Scott, Robert , ALI, Hassan, Omar , COOK, Benjamin, Stassen
IPC分类号： H01L21/3205 , H01L31/054 , H01L27/14618 , H01L27/1462 , H01L27/14627 , H01L27/14629 , H01L27/14636 , H01L27/14685
摘要： In described examples an integrated circuit (IC) (100) has multiple layers of dielectric material (110) overlying at least a portion of a surface of a substrate (102). A trench (106) is etched through the layers of dielectric material to expose a portion the substrate to form a trench floor (105), the trench being surrounded by a trench wall formed by the layers of dielectric material. A metal perimeter band (321) surrounds the trench adjacent the trench wall, the perimeter band being embedded in one of the layers of the dielectric material.

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