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    • 3. 发明申请
    • PHOTORESIST COMPOSITIONS CONTAINING COBALT (III) COMPOUND AND REDOX TRANSFER LIGAND
    • 含有钴(III)化合物和氧化铝转移配体的光催化剂组合物
    • WO1990007730A1
    • 1990-07-12
    • PCT/US1989005755
    • 1989-12-21
    • EASTMAN KODAK COMPANY
    • EASTMAN KODAK COMPANYDO MINH, Thap
    • G03C01/67
    • G03F7/038H05K3/0076H05K3/0082Y10S430/116Y10S430/137
    • A negative-working imaging composition suitable for use as a dry film resist, comprises, in admixture, (a) a polymeric binder, (b) a Co (III) compound capable of partial reduction to Co (II) upon exposure to activating radiation, and (c) a redox transfer ligand capable of reacting with Co (II) to form a Co (II) chelate which reduces adjacent remaining Co (III) compound and forms a Co (III) chelate effective to provide imagewise differential solubility to the composition. The composition can be imagewise exposed to activating radiation, such as a laser, heated, and developed with a developer to form a resist image in the exposed areas. An element comprising a support and a layer of the above-described composition is particularly useful in the manufacture of printed circuit boards by laser direct imaging.
    • 适合用作干膜抗蚀剂的负性成像组合物包含(a)聚合物粘合剂,(b)在暴露于活化辐射后能够部分还原成Co(II)的Co(III)化合物 ,和(c)能够与Co(II)反应以形成Co(II)螯合物的氧化还原转移配体,其减少相邻的剩余的Co(III)化合物并形成Co(III)螯合物,其有效地提供成像差异溶解度 组成。 组合物可以成像地暴露于活化辐射,例如激光,加热并用显影剂显影,以在曝光区域中形成抗蚀剂图像。 包括载体和上述组合物层的元件在通过激光直接成像制造印刷电路板方面特别有用。